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    System and method for non-invasive large-scale qubit device characterization technique
    34.
    发明授权
    System and method for non-invasive large-scale qubit device characterization technique 有权

    公开(公告)号：US11004896B1

    公开(公告)日：2021-05-11

    申请号：US16676304

    申请日：2019-11-06

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik ,  Jerry M. Chow

    IPC: H01L27/18 ,  B82Y10/00 ,  G06N10/00 ,  H01L39/02 ,  H01L39/22 ,  B82Y30/00

    Abstract: According to an embodiment of the present invention, a system for non-invasively characterizing a qubit device includes a characterization probe chip. The characterization probe chip includes a substrate and a characterization resonator formed on a first surface of the substrate. The characterization resonator includes a superconducting stripline, and a superconducting antenna coupled to an end of the superconducting stripline, the superconducting antenna positioned to align with a qubit on the qubit device being characterized. The characterization probe chip also includes and a superconducting ground plane formed on a second surface of the substrate, the second surface opposing the first surface. In operation, the superconducting antenna is configured to capacitively couple the characterization resonator to the qubit aligned with the superconducting antenna for characterization of the qubit.

    SYSTEM AND METHOD FOR NON-INVASIVE LARGE-SCALE QUBIT DEVICE CHARACTERIZATION TECHNIQUE
    35.
    发明申请
    SYSTEM AND METHOD FOR NON-INVASIVE LARGE-SCALE QUBIT DEVICE CHARACTERIZATION TECHNIQUE 有权

    公开(公告)号：US20210134880A1

    公开(公告)日：2021-05-06

    申请号：US16676304

    申请日：2019-11-06

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik ,  Jerry M. Chow

    IPC: H01L27/18 ,  G06N10/00 ,  H01L39/22 ,  H01L39/02

    Abstract: According to an embodiment of the present invention, a system for non-invasively characterizing a qubit device includes a characterization probe chip. The characterization probe chip includes a substrate and a characterization resonator formed on a first surface of the substrate. The characterization resonator includes a superconducting stripline, and a superconducting antenna coupled to an end of the superconducting stripline, the superconducting antenna positioned to align with a qubit on the qubit device being characterized. The characterization probe chip also includes and a superconducting ground plane formed on a second surface of the substrate, the second surface opposing the first surface. In operation, the superconducting antenna is configured to capacitively couple the characterization resonator to the qubit aligned with the superconducting antenna for characterization of the qubit.

    Contactless screening of a qubit
    36.
    发明授权
    Contactless screening of a qubit 有权

    公开(公告)号：US10900998B1

    公开(公告)日：2021-01-26

    申请号：US16687143

    申请日：2019-11-18

    Applicant: International Business Machines Corporation

    Inventor： Martin O. Sandberg ,  Vivekananda P. Adiga ,  Hanhee Paik ,  Jared Barney Hertzberg

    IPC: G06N10/00 ,  G01Q60/00

    Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

    Flip chip assembly of quantum computing devices
    37.
    发明授权
    Flip chip assembly of quantum computing devices 有权

    公开(公告)号：US10692795B2

    公开(公告)日：2020-06-23

    申请号：US16188466

    申请日：2018-11-13

    Applicant: International Business Machines Corporation

    Inventor： Jae-Woong Nah ,  Hanhee Paik ,  Jerry M. Chow

    IPC: H01L23/48 ,  H01L23/52 ,  H01L23/367 ,  H01L39/22 ,  H01L23/544 ,  H01L23/00 ,  H01L39/04 ,  G06N10/00 ,  H01L23/498

    Abstract: In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.

    FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES
    39.
    发明申请
    FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES 审中-公开

    公开(公告)号：US20200152540A1

    公开(公告)日：2020-05-14

    申请号：US16188466

    申请日：2018-11-13

    Applicant: International Business Machines Corporation

    Inventor： Jae-Woong Nah ,  Hanhee Paik ,  Jerry M. Chow

    IPC: H01L23/367 ,  H01L39/22 ,  H01L23/544 ,  H01L23/00 ,  H01L23/498 ,  H01L39/04 ,  G06N10/00

    Abstract: In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.

    Symmetrical qubits with reduced far-field radiation
    40.
    发明授权
    Symmetrical qubits with reduced far-field radiation 有权

    公开(公告)号：US10573685B1

    公开(公告)日：2020-02-25

    申请号：US16054326

    申请日：2018-08-03

    Applicant: International Business Machines Corporation

    Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Jerry M. Chow ,  Hanhee Paik

    IPC: H01L39/24 ,  H01L27/18 ,  H01L39/02 ,  G06N10/00

    Abstract: Symmetrical qubits with reduced far-field radiation are provided. In one example, a qubit device includes a first group of superconducting capacitor pads positioned about a defined location of the qubit device, wherein the first group of superconducting capacitor pads comprise two or more superconducting capacitor pads having a first polarity, and a second group of superconducting capacitor pads positioned about the defined location of the qubit device in an alternating arrangement with the first group of superconducting capacitor pads, wherein the second group of superconducting capacitor pads comprise two or more superconducting capacitor pads having a second polarity that is opposite the first polarity.

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