公开(公告)号：US10136519B2

公开(公告)日：2018-11-20

申请号：US15187002

申请日：2016-06-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Phillip Duane Isaacs

IPC: H04L29/06 ,  H05K1/18 ,  H05K3/10 ,  G06F21/00

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.

公开(公告)号：US10115275B2

公开(公告)日：2018-10-30

申请号：US15791642

申请日：2017-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Phillip Duane Isaacs ,  William Santiago-Fernandez

IPC: G08B13/14 ,  G08B13/12

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

公开(公告)号：US09936573B2

公开(公告)日：2018-04-03

申请号：US14941887

申请日：2015-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Phillip Duane Isaacs ,  David C. Long

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09 ,  H05K7/02 ,  H05K3/30 ,  H05K3/12 ,  H05K3/46

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/09 ,  H05K1/183 ,  H05K3/12 ,  H05K3/30 ,  H05K3/301 ,  H05K3/46 ,  H05K5/0208 ,  H05K7/023 ,  H05K2201/015 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≤200 μm, as well as a line-to-line spacing width Ws≤200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US09924591B2

公开(公告)日：2018-03-20

申请号：US14865632

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Phillip Duane Isaacs ,  David C. Long

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09 ,  H05K7/02 ,  H05K3/30 ,  H05K3/12 ,  H05K3/46

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/09 ,  H05K1/183 ,  H05K3/12 ,  H05K3/30 ,  H05K3/301 ,  H05K3/46 ,  H05K5/0208 ,  H05K7/023 ,  H05K2201/015 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US09894749B2

公开(公告)日：2018-02-13

申请号：US14865708

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Zachary T. Dreiss ,  Michael J. Fisher ,  David C. Long ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B13/14 ,  H05K1/02 ,  H05K1/18 ,  G06F21/87 ,  H05K5/02

CPC classification number: H05K1/0213 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/183 ,  H05K5/0208 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

公开(公告)号：US09877383B2

公开(公告)日：2018-01-23

申请号：US15423833

申请日：2017-02-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K1/11

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

公开(公告)号：US09661747B1

公开(公告)日：2017-05-23

申请号：US15193525

申请日：2016-06-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K1/02 ,  H05K3/22 ,  G08B13/12

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

公开(公告)号：US09554477B1

公开(公告)日：2017-01-24

申请号：US14974036

申请日：2015-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K5/02 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract translation: 提供了防篡改组件和制造方法，其中包含电路板保护的外壳。 防篡改组件包括电路板和安装到电路板的电子外壳，并且便于将至少一个电子部件封闭在安全的容积内。 篡改答复电子电路结构有助于定义安全量，篡改受理电子电路结构包括篡改答复电路。 提供粘合剂以部分地将电子外壳固定到电路板。 粘合剂至少部分地接触篡改响应电路，使得电子外壳与电路板的尝试分离导致粘合剂破坏篡改响应电路，便于检测篡改的监视电路的分离 通讯电子电路结构。