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公开(公告)号：US10264665B2
公开(公告)日：2019-04-16
申请号：US15835557
申请日：2017-12-08
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Zachary T. Dreiss , Michael J. Fisher , David C. Long , William Santiago-Fernandez , Thomas Weiss
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).
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公开(公告)号：US10242543B2
公开(公告)日：2019-03-26
申请号：US15820620
申请日：2017-11-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Phillip Duane Isaacs
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor over time for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).
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公开(公告)号：US20180103538A1
公开(公告)日：2018-04-12
申请号：US15835569
申请日：2017-12-08
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Zachary T. Dreiss , Michael J. Fisher , David C. Long , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K1/0213 , G06F21/87 , H05K1/0275 , H05K1/028 , H05K1/0393 , H05K1/183 , H05K5/0208 , H05K2201/091 , H05K2201/09109 , H05K2201/09263 , H05K2201/0999 , H05K2201/10151
Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).
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公开(公告)号：US11147158B2
公开(公告)日：2021-10-12
申请号：US16596941
申请日：2019-10-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Michael J. Fisher , David C. Long
IPC: H05K1/02 , H05K1/11 , H05K1/18 , H05K5/02 , G01N27/04 , G06F21/87 , G06F21/86 , H01L23/00 , H05K1/09
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
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公开(公告)号：US10595401B1
公开(公告)日：2020-03-17
申请号：US16424874
申请日：2019-05-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Arthur J. Higby , David C. Long , Michael J. Fisher , Russell A. Budd , Michel Turgeon , Sylvain Tetreault
Abstract: Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.
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Patent Agency Ranking
公开(公告)号：US10172232B2
公开(公告)日：2019-01-01
申请号：US15827275
申请日：2017-11-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Edward N. Cohen , Silvio Dragone , Michael J. Fisher , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
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公开(公告)号：US10169967B1
公开(公告)日：2019-01-01
申请号：US16048622
申请日：2018-07-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Phillip Duane Isaacs , William Santiago-Fernandez
IPC: G08B13/12
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.
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公开(公告)号：US11122682B2
公开(公告)日：2021-09-14
申请号：US15944898
申请日：2018-04-04
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Mark K. Hoffmeyer , William L. Brodsky , William Santiago-Fernandez , David C. Long , Silvio Dragone , Michael J. Fisher , Arthur J. Higby
Abstract: Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.
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公开(公告)号：US10568202B2
公开(公告)日：2020-02-18
申请号：US15658717
申请日：2017-07-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Michael J. Fisher , David C. Long
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
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公开(公告)号：US10217336B2
公开(公告)日：2019-02-26
申请号：US16048650
申请日：2018-07-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Phillip Duane Isaacs , William Santiago-Fernandez
IPC: G08B13/12
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.
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