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    Electronic package cover having underside rib
    32.
    发明授权
    Electronic package cover having underside rib 有权

    公开(公告)号：US10665524B2

    公开(公告)日：2020-05-26

    申请号：US15671734

    申请日：2017-08-08

    Applicant: International Business Machines Corporation

    Inventor： Kamal K. Sikka ,  Krishna R. Tunga

    IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/373 ,  H01L23/42

    Abstract: An electronic package lid which includes one or more underside ribs. The ribs have a major length and a minor width and are generally aligned to be parallel with a diagonal or normal bisector of the processing device. The underside rib generally stiffens the cover such that an upper surface of the cover is more apt to stay flat. As such, cover warpage and, therefore, the peeling of the TIM1 and delamination of underfill due to the physical or dimensional expansion of the processing device and/or a carrier may be reduced. As a result, the surface area dedicated for the seal material upon the carrier surface may be reduced, thereby increasing the available surface area upon the carrier for additional electronic components to be placed in close proximity to the processing device.

    COGNITIVE COMPUTING DEVICE FOR PREDICTING AN OPTIMAL STRATEGY IN COMPETITIVE CIRCUMSTANCES
    33.
    发明申请
    COGNITIVE COMPUTING DEVICE FOR PREDICTING AN OPTIMAL STRATEGY IN COMPETITIVE CIRCUMSTANCES 审中-公开

    公开(公告)号：US20200160228A1

    公开(公告)日：2020-05-21

    申请号：US16191894

    申请日：2018-11-15

    Applicant: International Business Machines Corporation

    Inventor： Mahmoud Amin ,  Zhenxing Bi ,  Lawrence A. Clevenger ,  Leigh Anne H. Clevenger ,  Krishna R. Tunga

    IPC: G06N99/00

    Abstract: Embodiments of the invention provide a computer-implemented method of generating individualized strategies for a group of team members pursing a team objective based on an optimized team strategy. A team objective and a plurality of inputs associated with a plurality of team members is received at a strategy engine. A training model is applied to the plurality of inputs from the first plurality of team members to generate a plurality of individualized strategies for the first plurality of team members to achieve the team objective. An optimized team strategy based on the plurality of individualized strategies is generated and the individualized strategies are communicated to each team member wherein each team member pursuing their individualized strategy leads to achieving the team objective.

    CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE
    37.
    发明申请
    CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE 审中-公开

    公开(公告)号：US20180301355A1

    公开(公告)日：2018-10-18

    申请号：US15486749

    申请日：2017-04-13

    Applicant: International Business Machines Corporation

    Inventor： Tuhin Sinha ,  Krishna R. Tunga

    IPC: H01L21/56 ,  H01L23/00

    Abstract: A method to control warpage in a semiconductor chip package that includes: attaching a semiconductor chip to a semiconductor chip package; attaching a stiffener to the semiconductor chip package so that the semiconductor chip is contained within the stiffener, the stiffener having a coefficient of thermal expansion (CTE) less than that of the substrate on which the chip is assembled; attaching the semiconductor chip package to a laminate substrate; and removing the stiffener.

    Multichip electronic packages and methods of manufacture
    40.
    发明授权
    Multichip electronic packages and methods of manufacture 有权
    Multichip电子封装和制造方法

    公开(公告)号：US08860206B2

    公开(公告)日：2014-10-14

    申请号：US14041875

    申请日：2013-09-30

    Applicant: International Business Machines Corporation

    Inventor： Kamal K. Sikka ,  Hilton T. Toy ,  Krishna R. Tunga ,  Jeffrey A. Zitz

    IPC: H01L23/12 ,  H01L21/50 ,  H01L23/10 ,  H01L23/04 ,  H01L23/00

    CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/10 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2924/01322 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/166 ,  H01L2924/00

    Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.

    Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 调整包括将芯片垫片放置在芯片上，并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 该调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。

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