公开(公告)号：US20140374751A1

公开(公告)日：2014-12-25

申请号：US14478172

申请日：2014-09-05

Applicant: InnoLux Corporation

Inventor： Hsin-Hung LIN ,  Jung-Fang CHANG ,  Ker-Yih KAO

IPC: H01L29/786 ,  H01L27/12

CPC classification number: H01L27/1225 ,  H01L21/441 ,  H01L21/47 ,  H01L21/471 ,  H01L21/47573 ,  H01L23/3171 ,  H01L23/481 ,  H01L27/1259 ,  H01L29/41733 ,  H01L29/41775 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/7869 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor.

Abstract translation: 公开了一种在基板上包括栅电极的薄膜晶体管。 栅极电介质层设置在栅电极和衬底上，源极/漏电极设置在覆盖栅电极的两个边缘部分的栅极电介质层上。 沟道层设置在覆盖栅极电极的中心部分的栅极电介质层上，沟道区域与源极/漏极接触。 绝缘覆盖层覆盖在沟道层上，其中沟道层包括氧化物半导体。

公开(公告)号：US20250105130A1

公开(公告)日：2025-03-27

申请号：US18808091

申请日：2024-08-19

Applicant: Innolux Corporation

Inventor： Ker-Yih KAO ,  Po-Yun HSU

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L25/18

Abstract: An electronic device includes a substrate having opposite first and second surfaces and a through hole having an inner wall connected to the first and second surfaces, a buffer layer covering the first and second surfaces and the inner wall, a conductor disposed in the through hole, a first circuit structure disposed on the first surface, an electronic element disposed on the first circuit structure, and first connectors disposed on the second surface and electrically connected to the electronic element through the conductor and the first circuit structure. The through hole has a width W and a depth D, and W/D is greater than or equal to 0.01 and less than or equal to 0.5. A thickness T of the buffer layer is greater than or equal to 0.01 μm and less than or equal to 10 μm. A manufacturing method of an electronic device is also provided.

公开(公告)号：US20250028497A1

公开(公告)日：2025-01-23

申请号：US18906734

申请日：2024-10-04

Applicant: InnoLux Corporation

Inventor： Yi-Hua HSU ,  Ker-Yih KAO

IPC: G06F3/14 ,  H10K59/18 ,  H10K77/10 ,  H10K102/00

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

公开(公告)号：US20240404904A1

公开(公告)日：2024-12-05

申请号：US18655448

申请日：2024-05-06

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Wei-Yuan CHENG ,  Ju-Li WANG

IPC: H01L23/31 ,  H01L23/00

Abstract: An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically connecting the electronic component. The protective layer has a second surface away from the active surface, and a first step difference between the first surface and the second surface is between 1 and 10 μm.

公开(公告)号：US20240237454A1

公开(公告)日：2024-07-11

申请号：US18618024

申请日：2024-03-27

Applicant: InnoLux Corporation

Inventor： Shun-Yuan HU ,  Chin-Lung TING ,  Li-Wei MAO ,  Ming-Chun TSENG ,  Kung-Chen KUO ,  Yi-Hua HSU ,  Ker-Yih KAO

IPC: H10K59/18 ,  G09F9/302 ,  G09G3/00 ,  H01L23/00 ,  H01L25/16 ,  H01L27/12 ,  H10K50/86 ,  H10K59/131 ,  H10K77/10 ,  H01L21/66

CPC classification number: H10K59/18 ,  G09F9/3026 ,  G09G3/006 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/162 ,  H01L25/167 ,  H01L27/124 ,  H10K50/865 ,  H10K59/131 ,  H10K77/111 ,  H01L22/14 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: An electrical connection structure is provided. The electrical connection structure includes a plurality of conductive particles and a connection pad including a first part, a second part and a third part. The first part is formed on an array substrate and electrically connected to a circuit of the array substrate. The second part is connected to the first part and passes through the array substrate. The third part is connected to the second part and electrically connected to a circuit of a circuit substrate through the conductive particles.

公开(公告)号：US20230411301A1

公开(公告)日：2023-12-21

申请号：US17819112

申请日：2022-08-11

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ker-Yih KAO ,  Sheng-Nan CHEN ,  Kuo-Sheng YEH

IPC: H01L23/544 ,  H01L21/68

CPC classification number: H01L23/544 ,  H01L21/68 ,  H01L2223/54426

Abstract: An electronic device is provided. The electronic device includes a plurality of spacing elements, a first electronic unit and a second electronic unit, a protective layer and a connecting member. The first electronic unit and the second electronic unit are individually disposed between two adjacent spacing elements. The protective layer surrounds the spacing elements, the first electronic unit and the second electronic unit. The first electronic unit is electrically connected to the second electronic unit via the connecting member. In a direction that is perpendicular to a normal direction of the electronic device, the first electronic unit has a first width, and a first distance is between the two adjacent spacing elements. A ratio of the first distance to the first width is greater than or equal to 1 and less than or equal to 1.3. A method of manufacturing an electronic device is also provided.

公开(公告)号：US20230409270A1

公开(公告)日：2023-12-21

申请号：US18459231

申请日：2023-08-31

Applicant: InnoLux Corporation

Inventor： Yi-Hua HSU ,  Ker-Yih KAO

IPC: G06F3/14 ,  H10K77/10 ,  H10K59/18

CPC classification number: G06F3/1446 ,  H10K77/111 ,  H10K59/18 ,  H10K2102/311

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

公开(公告)号：US20230325036A1

公开(公告)日：2023-10-12

申请号：US18330605

申请日：2023-06-07

Applicant: InnoLux Corporation

Inventor： Li-Wei MAO ,  Chin-Lung TING ,  Ker-Yih KAO ,  Ming-Chun TSENG

IPC: G06F3/042 ,  G06F3/041 ,  G09G3/32

CPC classification number: G06F3/0421 ,  G06F3/0416 ,  G06F3/04166 ,  G09G2360/145 ,  G09G3/32

Abstract: An operation method of an electronic device for sensing an optical signal is provided. The electronic device includes a plurality of optical sensors and a plurality of light-emitting elements disposed adjacent to the plurality of optical sensors. The operation method of the electronic device for sensing the optical signal includes the following steps. The optical signal is provided to a first optical sensor of the plurality of optical sensors. The first optical sensor outputs a driving signal when dimming the plurality of light-emitting elements adjacent to the first optical sensor. Therefore, the accuracy of sensing the optical signal may be effectively increased.

公开(公告)号：US20230284496A1

公开(公告)日：2023-09-07

申请号：US18193003

申请日：2023-03-30

Applicant: InnoLux Corporation

Inventor： Shun-Yuan HU ,  Chin-Lung TING ,  Li-Wei MAO ,  Ming-Chun TSENG ,  Kung-Chen KUO ,  Yi-Hua HSU ,  Ker-Yih KAO

IPC: H10K59/18 ,  G09G3/00 ,  G09F9/302 ,  H01L23/00 ,  H01L25/16 ,  H01L27/12 ,  H10K50/86 ,  H10K59/131 ,  H10K77/10

CPC classification number: H10K59/18 ,  G09F9/3026 ,  G09G3/006 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/162 ,  H01L25/167 ,  H01L27/124 ,  H10K50/865 ,  H10K59/131 ,  H10K77/111 ,  H01L22/14

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

公开(公告)号：US20230006342A1

公开(公告)日：2023-01-05

申请号：US17929907

申请日：2022-09-06

Applicant: InnoLux Corporation

Inventor： Chia-Ping TSENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Ming-Yen WENG ,  Hung-I TSENG ,  Shu-Ling WU ,  Huei-Ying CHEN

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343

Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.