公开(公告)号：US20230253288A1

公开(公告)日：2023-08-10

申请号：US17668236

申请日：2022-02-09

Applicant: Intel Corporation

Inventor： Abdulafeez Adebiyi ,  Je-Young Chang ,  Devdatta Kulkarni ,  Sandeep Ahuja

IPC: H01L23/373 ,  H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/3733 ,  H01L23/427 ,  H01L25/0655 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/291 ,  H01L23/29 ,  H01L23/3732 ,  H01L24/13

Abstract: An integrated circuit device may include an integrated circuit die coupled to a substrate, and a porous material on the die or a thermal interface material and extending beyond the edges of the die and over the substrate. An integrated circuit system may include a substrate with a power supply and an integrated circuit die, such that a porous material on the die extends over the substrate beyond a footprint of the die. A porous material may be formed on and beyond an edge of a received integrated circuit die coupled to a substrate or a thermal interface material on the die.

公开(公告)号：US11676883B2

公开(公告)日：2023-06-13

申请号：US16355596

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Je-Young Chang ,  Kelly Lofgreen ,  Weihua Tang ,  Aastha Uppal

IPC: H01L23/38 ,  H01L35/10 ,  H01L35/30 ,  H01L35/18 ,  H01L35/16

CPC classification number: H01L23/38 ,  H01L35/10 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30

Abstract: An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

公开(公告)号：US20230125822A1

公开(公告)日：2023-04-27

申请号：US17512138

申请日：2021-10-27

Applicant: Intel Corporation

Inventor： Abdulafeez Adebiyi ,  Je-Young Chang ,  Devdatta Kulkarni

IPC: H01L23/44 ,  H01L23/373

Abstract: A two-phase immersion cooling system for integrated circuit assembly may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device may include a surface enhancement structure and a boiling enhancement material layer, such as a micro-porous material, on the surface enhancement structure.

公开(公告)号：US11378346B2

公开(公告)日：2022-07-05

申请号：US16147548

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Je-Young Chang

IPC: H01L23/36 ,  F28D20/02 ,  H01L23/373 ,  H01L23/367 ,  C09K5/06 ,  H01L49/02

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

公开(公告)号：US20210305120A1

公开(公告)日：2021-09-30

申请号：US16831078

申请日：2020-03-26

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Je-Young Chang ,  Ram Viswanath ,  Elah Bozorg-Grayeli ,  Ahmad Al Mohammad

IPC: H01L23/367 ,  H01L23/495 ,  H01L23/373

Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

公开(公告)号：US20210249326A1

公开(公告)日：2021-08-12

申请号：US16789322

申请日：2020-02-12

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Je-Young Chang

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00

Abstract: An integrated circuit assembly may be formed comprising at least one integrated circuit device, a heat dissipation device having a thermal contact surface with at least one containment structure extending into or from the heat dissipation device at the thermal contact surface, and a thermal interface material between the at least one integrated circuit device and the heat dissipation device, wherein the thermal interface material contacts the at least one containment structure of the heat dissipation device.

公开(公告)号：US20200273772A1

公开(公告)日：2020-08-27

申请号：US16287116

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Omkar Karhade ,  Ram Viswanath ,  Je-Young Chang ,  Weihua Tang ,  Nitin Deshpande ,  Mitul Modi ,  Edvin Cetegen ,  Sanka Ganesan ,  Yiqun Bai ,  Jan Krajniak ,  Kumar Singh

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/427 ,  H01L25/18 ,  H01L21/56

Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

公开(公告)号：US20200219790A1

公开(公告)日：2020-07-09

申请号：US16241158

申请日：2019-01-07

Applicant: INTEL CORPORATION

Inventor： Aastha Uppal ,  Je-Young Chang ,  Weihua Tang ,  Minseok Ha

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.

公开(公告)号：US20200051894A1

公开(公告)日：2020-02-13

申请号：US16100406

申请日：2018-08-10

Applicant: Intel Corporation

Inventor： Zhimin Wan ,  Je-Young Chang ,  Chia-Pin Chiu ,  Shankar Devasenathipathy ,  Betsegaw Kebede Gebrehiwot ,  Chandra Mohan Jha

IPC: H01L23/427 ,  H01L25/18

Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.

公开(公告)号：US20190206764A1

公开(公告)日：2019-07-04

申请号：US15859236

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler ,  Je-Young Chang

IPC: H01L23/433 ,  H01L23/367 ,  H01L23/427

Abstract: Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit. Associated electronic devices, systems, and methods are also disclosed.