Abstract:
A signal delay control circuit for use in a semiconductor memory device is disclosed. The circuit includes a first reference voltage generating unit for generating a first reference voltage; a second reference voltage generating unit for generating a second reference voltage that is lower than the first reference voltage; a control signal generating unit for generating a clock signal to drive input and output operations of internal circuits; and an impedance circuit in circuit with the first and second reference voltage generating units for generating a plurality of reference voltages to be applied to the internal circuits wherein the reference voltages are set in accordance with a distance between the control signal generating unit and the respective one of the internal circuits.
Abstract:
A microwave frequency converting receiver of an RF unit should be generally used in wireless/mobile communications systems such as cellular, PCS, WLL and IMT2000 systems and also have low power consumption, low-noise characteristic, high gain and small size. In order to produce the above frequency converting receiver, a multi-band and multi-mode frequency converting receiver for use in a wireless mobile communications system comprises a wideband low-noise amplifier for amplifying a radio frequency input signal, a frequency mixer for generating an intermediate frequency signal having a relatively high linearity by mixing a local oscillator frequency signal and the amplified radio frequency signal outputted from the wideband low noise amplifier, an intermediate frequency amplifier for producing a final intermediate frequency signal by amplifying the intermediate frequency signal derived from the frequency mixer and an input matching circuit for receiving a microwave signal within a frequency band of the wireless mobile communications system, impedance-matching the received microwave signal to the radio frequency input signal of the wideband low-noise amplifier and determining an operating frequency band of the frequency converting receiver.
Abstract:
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the comers of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.
Abstract:
An LED package includes a lead frame, a housing part, and a lead heat dissipating part. The lead frame includes a first lead mounting an LED chip and a second lead spaced apart from the first lead. The housing part covers a portion of the lead frame and includes an opening part for exposing the LED chip, a first side corresponding to a support side contacting the first lead and the second lead, and a second side opposite to the first side. The lead heat dissipating part is extended from the first lead and exposed partially to the first side of the housing part. Herein, the first side of the housing part is thicker than the second side.
Abstract:
A video decoding apparatus and method based on a data and function splitting scheme are disclosed. The video decoding apparatus based on a data and function splitting scheme includes a variable length decoding unit performing variable length decoding and parsing on a bit stream to acquire residual data and a decoding parameter, and splitting the residual data and the decoding parameter by row; and N (N is a natural number of 2 or larger) number of clusters splitting dequantization and inverse discrete cosine transform (IDCT), motion vector prediction, intra prediction and motion compensation, video restoration, and deblocking function into M number of functions, acquiring the residual data, the decoding parameter, and macroblock (MB) processing information of an upper cluster by column, and splitting the information acquired by column into M number of functions to process the same.
Abstract:
A semiconductor apparatus having first and second chips includes a first operation unit disposed in the first chip, and is configured to perform a predetermined arithmetic operation for an initial code according to a first repair signal and generate a first operation code; and a second operation unit disposed in the second chip, and configured to perform the predetermined arithmetic operation for the first operation code according to a second repair signal and generate a second operation code.
Abstract:
A fuse circuit includes a plurality of fuse sets configured to perform fuse programming and generate fuse signals in response to fuse programming signals and a fuse control unit configured to generate the fuse programming signals depending upon a level of a programming voltage.
Abstract:
A nonvolatile ferroelectric memory device includes a plurality of unit cell arrays, wherein each of the plurality of unit cell arrays includes: a bottom word line; a plurality of insulating layers formed on the bottom word line, respectively; a floating channel layer comprising a plurality of channel regions located on the plurality of insulating layers and a plurality of drain and source regions which are alternately electrically connected in series to the plurality of channel regions; a plurality of ferroelectric layers formed respectively on the plurality of channel regions of the floating channel layer; and a plurality of word lines formed on the plurality of ferroelectric layers, respectively. The unit cell array reads and writes a plurality of data by inducing different channel resistance to the plurality of channel regions depending on polarity states of the plurality of ferroelectric layers.
Abstract:
A semiconductor apparatus has a plurality of chips stacked therein. Read control signals for controlling read operations of the plurality of chips are synchronized with a reference clock such that the time taken from the application of a read command to the output of data for each of the plurality of chips is maintained substantially the same.
Abstract:
A nonvolatile ferroelectric memory device is provided so as to control read/write operations of a nonvolatile memory cell using a channel resistance of the memory cell which is differentiated by polarity states of a ferroelectric material. In the memory device, an insulating layer is formed on a bottom word line, and a floating channel layer comprising a N-type drain region, a P-type channel region and a N-type source region is formed on the insulating layer. Then, a ferroelectric layer is formed on the floating channel layer, and a word line is formed on the ferroelectric layer. As a result, the resistance state induced to the channel region is controlled depending on the polarity of the ferroelectric layer, thereby regulating the read/write operations of the memory cell array.