Document processing method and system
    31.
    发明授权
    Document processing method and system 有权
    文件处理方法和系统

    公开(公告)号:US09058383B2

    公开(公告)日:2015-06-16

    申请号:US13608438

    申请日:2012-09-10

    IPC分类号: G06F7/00 G06F17/30

    CPC分类号: G06F17/30716 G06F17/30011

    摘要: A method and system for filtering a candidate document in a candidate document set are provided. The method includes receiving one or more entity word—topic word pairs and identifying one or more entity words of the candidate document and topic words. The method also includes determining whether to add the candidate document into a filtered document set using the entity words and topic words in the given entity word—topic word pairs and the identified entity words and topic words in the candidate document. The method further includes adding the candidate document into a filtered document set in response to determining that the candidate document should be added into the filtered document set.

    摘要翻译: 提供了一种用于过滤候选文档集中候选文档的方法和系统。 该方法包括接收一个或多个实体字主题词对并识别候选文档和主题词的一个或多个实体单词。 该方法还包括使用给定实体字主题词对中的实体单词和主题词以及候选文档中所识别的实体单词和主题词来确定是否将候选文档添加到过滤文档集中。 该方法还包括响应于确定候选文档应该被添加到经过滤的文档集中而将候选文档添加到经过过滤的文档集中。

    Trenched substrate for crystal growth and wafer bonding
    33.
    发明授权
    Trenched substrate for crystal growth and wafer bonding 失效
    用于晶体生长和晶圆键合的沟槽衬底

    公开(公告)号:US08664747B2

    公开(公告)日:2014-03-04

    申请号:US12111084

    申请日:2008-04-28

    申请人: Jie Cui

    发明人: Jie Cui

    IPC分类号: H01L29/06

    摘要: A substrate for a light emitting diode (LED) can have one or more trenches formed therein so as to mitigate stress build up within the substrate due to mismatched thermal coefficients of expansion between the substrate and layers of material, e.g., semiconductor material, formed thereon. In this manner, the likelihood of damage to the substrate, such as cracking thereof, is substantially mitigated.

    摘要翻译: 用于发光二极管(LED)的衬底可以具有形成在其中的一个或多个沟槽,以便由于衬底和材料层(例如,形成在其上的半导体材料)之间的不匹配的热膨胀系数而减轻衬底内的应力积聚 。 以这种方式,基本上减轻了对基板的损坏的可能性,例如其破裂。

    METHOD AND SYSTEM AND PROCESSING HTTP REQUESTS
    35.
    发明申请
    METHOD AND SYSTEM AND PROCESSING HTTP REQUESTS 有权
    方法和系统和处理HTTP请求

    公开(公告)号:US20110078278A1

    公开(公告)日:2011-03-31

    申请号:US12868891

    申请日:2010-08-26

    IPC分类号: G06F15/16

    摘要: A method and a system for processing an HTTP request. There is provided a method for processing an HTTP request, including: receiving an original HTTP request for accessing an instance of an application; modifying a domain name to be accessed; and sending the new HTTP request to a server of the application so as to access the instance of the application, wherein the domain name to be accessed by the original HTTP request and the new domain name correspond to a same IP address. This avoids various problems such as data confusion, data error, and use inconvenience in the related art occurring when a plurality of service instances of a same application run in a same hypertext transfer protocol session. A system for carrying out the above method is also provided.

    摘要翻译: 一种用于处理HTTP请求的方法和系统。 提供了一种用于处理HTTP请求的方法,包括:接收用于访问应用的实例的原始HTTP请求; 修改要访问的域名; 并将新的HTTP请求发送到应用的服务器,以访问应用的实例,其中由原始HTTP请求访问的域名和新域名对应于相同的IP地址。 这避免了在相同应用程序的多个服务实例在相同的超文本传输​​协议会话中运行时出现的各种问题,例如数据混淆,数据错误和使用相关技术中的不便。 还提供了一种用于执行上述方法的系统。

    TRENCHED SUBSTRATE FOR CRYSTAL GROWTH AND WAFER BONDING
    36.
    发明申请
    TRENCHED SUBSTRATE FOR CRYSTAL GROWTH AND WAFER BONDING 失效
    用于晶体生长和波形粘结的基底

    公开(公告)号:US20090267083A1

    公开(公告)日:2009-10-29

    申请号:US12111084

    申请日:2008-04-28

    申请人: Jie Cui

    发明人: Jie Cui

    IPC分类号: H01L33/00 H01L23/00

    摘要: A substrate for a light emitting diode (LED) can have one or more trenches formed therein so as to mitigate stress build up within the substrate due to mismatched thermal coefficients of expansion between the substrate and layers of material, e.g., semiconductor material, formed thereon. In this manner, the likelihood of damage to the substrate, such as cracking thereof, is substantially mitigated.

    摘要翻译: 用于发光二极管(LED)的衬底可以具有形成在其中的一个或多个沟槽,以便由于衬底和材料层(例如,形成在其上的半导体材料)之间的不匹配的热膨胀系数而减轻衬底内的应力积聚 。 以这种方式,基本上减轻了对基片的破坏的可能性,例如破裂。