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    Integrated Multi-Channel Analog Front End And Digitizer For High Speed Imaging Applications
    31.
    发明申请
    Integrated Multi-Channel Analog Front End And Digitizer For High Speed Imaging Applications 有权
    用于高速成像应用的集成多通道模拟前端和数字转换器

    公开(公告)号：US20140240562A1

    公开(公告)日：2014-08-28

    申请号：US14272454

    申请日：2014-05-07

    Applicant: KLA-Tencor Corporation

    Inventor： David L. Brown ,  Mansour Kermat ,  Lance Glasser ,  Henrik Nielsen ,  Guowu Zheng ,  Kurt Lehman ,  Kenneth F. Hatch ,  Yung-Ho Chuang ,  Venkatraman Iyer

    IPC: H04N5/378

    CPC classification number: H04N5/378 ,  H01L27/14634 ,  H04N5/3694 ,  H04N5/37206 ,  H04N5/37213

    Abstract: A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

    Abstract translation: 用于高速图像处理的模块包括用于产生表示图像的多个模拟输出的图像传感器和用于同时处理多个模拟输出的多个HDD。 每个HDD是被配置为并行处理预定的一组模拟输出的集成电路。 HDD的每个通道可以包括用于调节表示一个传感器模拟输出的信号的AFE，用于将经调节的信号转换成数字信号的ADC，以及用于校准和格式化数字信号以传送到芯片外的数据格式化块 设备。 HDD和驱动电子设备与图像传感器组合成一个封装，以优化信号完整性和高动态范围，并通过使用同步的HDD通道实现高数据速率。 组合多个模块可实现高度可扩展的成像子系统，以优化检测和计量应用。

    INTERPOSER BASED IMAGING SENSOR FOR HIGH-SPEED IMAGE ACQUISITION AND INSPECTION SYSTEMS
    32.
    发明申请
    INTERPOSER BASED IMAGING SENSOR FOR HIGH-SPEED IMAGE ACQUISITION AND INSPECTION SYSTEMS 有权
    用于高速图像采集和检测系统的基于插座的成像传感器

    公开(公告)号：US20130176552A1

    公开(公告)日：2013-07-11

    申请号：US13622155

    申请日：2012-09-18

    Applicant: KLA-Tencor Corporation

    Inventor： David L. Brown ,  Guowu Zheng ,  Yung-Ho Chuang ,  Venkatraman Iyer

    IPC: G01N21/95 ,  H05K13/00 ,  H04N5/335

    CPC classification number: H01L27/14636 ,  G01N21/9501 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14806 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19105 ,  H04N5/3355 ,  H04N5/369 ,  H05K13/00 ,  Y10T29/49117

    Abstract: The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.

    Abstract translation: 本发明包括设置在基板的表面上的插入器，设置在插入件上的光感测阵列传感器，光感测阵列传感器被背面薄化并被配置为用于背光照明，光感测阵列传感器包括像素列，一 或多个放大电路元件，被配置为放大光感测阵列传感器的输出，放大电路可操作地连接到插入器，一个或多个模拟 - 数字转换电路元件，被配置为将光感测阵列传感器的输出转换成 数字信号，所述ADC电路元件可操作地连接到所述插入器，配置成驱动所述阵列传感器的时钟或控制信号的一个或多个驱动器电路元件，所述插入器被配置为电耦合所述光感测阵列传感器中的至少两个， 放大电路，转换电路，驱动器电路或一个或多个附加电路 电话

    Electron-Bombarded Charge-Coupled Device And Inspection Systems Using EBCCD Detectors
    33.
    发明申请
    Electron-Bombarded Charge-Coupled Device And Inspection Systems Using EBCCD Detectors 审中-公开
    使用EBCCD检测器的电子轰击电荷耦合器件和检测系统

    公开(公告)号：US20130148112A1

    公开(公告)日：2013-06-13

    申请号：US13710315

    申请日：2012-12-10

    Applicant: KLA-Tencor Corporation

    Inventor： Yung-Ho Alex Chuang ,  Xuefeng Liu ,  John Fielden ,  David L. Brown

    IPC: G01N21/88 ,  G01N21/95 ,  H01L27/148

    CPC classification number: G01N21/88 ,  G01N21/9501 ,  G01N2021/8822 ,  G01N2021/95676 ,  H01J31/26 ,  H01L27/14806 ,  H01L27/14818 ,  H01L27/14856

    Abstract: A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a plurality of ridges between the holes. The control device may be separated from the photocathode by approximately half a shorter dimension of a CCD pixel or less. A plurality of first electrodes may be provided, wherein each first electrode surrounds a given hole and is separated from the given hole by a gap.

    Abstract translation: 聚焦EBCCD包括位于光电阴极和CCD之间的控制装置。 控制装置具有多个孔，其中多个孔垂直于光电阴极的表面形成，并且其中多个孔的图案与CCD中的像素图案对准。 每个孔被形成在面向光电阴极的控制装置的表面上的至少一个第一电极包围。 控制装置可以包括孔之间的多个脊。 控制装置可以与光电阴极分离CCD像素的大约一半的较短尺寸或更小。 可以提供多个第一电极，其中每个第一电极围绕给定的孔并且通过间隙与给定的孔分离。

    Apparatus for high-speed imaging sensor data transfer
    36.
    发明授权
    Apparatus for high-speed imaging sensor data transfer 有权

    公开(公告)号：US10429321B2

    公开(公告)日：2019-10-01

    申请号：US15671729

    申请日：2017-08-08

    Applicant: KLA-Tencor Corporation

    Inventor： Steve Zamek ,  David L. Brown ,  Venkatraman Iyer

    IPC: G01N21/95 ,  G01T1/24 ,  H01L27/146 ,  H04N5/372 ,  H04N5/225 ,  H01J37/28

    Abstract: An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

    Back-illuminated sensor with boron layer
    38.
    发明授权
    Back-illuminated sensor with boron layer 有权

    公开(公告)号：US10121914B2

    公开(公告)日：2018-11-06

    申请号：US15797970

    申请日：2017-10-30

    Applicant: KLA-Tencor Corporation

    Inventor： Jehn-Huar Chern ,  Ali R. Ehsani ,  Gildardo Delgado ,  David L. Brown ,  Yung-Ho Alex Chuang ,  John Fielden

    IPC: G01N21/88 ,  H01L31/0216 ,  G01N21/95 ,  G01N21/956 ,  H01L27/146 ,  H01L27/148

    Abstract: An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer having opposing surfaces, with circuit elements formed on one surface of the epitaxial layer, and a pure boron layer on the other surface of the epitaxial layer. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.

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