公开(公告)号：US5888126A

公开(公告)日：1999-03-30

申请号：US590836

申请日：1996-01-24

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US5882244A

公开(公告)日：1999-03-16

申请号：US967767

申请日：1997-11-10

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

IPC分类号： B24B37/00 ,  B24B37/013 ,  B24B37/015 ,  B24B49/14 ,  B24B49/00

CPC分类号： B24B37/015 ,  B24B49/14

摘要： A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.

摘要翻译： 抛光装置使得可以精确地检测抛光期间工件的温度，并且基于该检测温度进行抛光终点确定。 抛光装置将诸如半导体晶片的工件的表面中的凹凸抛光到平坦的和镜面状的光洁度。 保持半导体晶片的顶环设置有温度传感器。 由温度传感器检测在半导体晶片中通过研磨产生的摩擦热，并且基于检测到的温度来确定研磨终点。

公开(公告)号：US06752692B2

公开(公告)日：2004-06-22

申请号：US09932987

申请日：2001-08-21

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US06406364B1

公开(公告)日：2002-06-18

申请号：US09355895

申请日：1999-10-25

申请人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

发明人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

IPC分类号： B24B5700

CPC分类号： B24B37/04 ,  B24B57/02 ,  Y10S451/91

摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

摘要翻译： 本发明的目的是提供一种抛光装置，其能够以稳定的速度供给研磨粒子尺寸不变的抛光液。 公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。 装置（20）包括：用于输送抛光溶液的溶液通道; 和超声波振动器（72）设置在溶液通道的至少一个位置。

公开(公告)号：US5838447A

公开(公告)日：1998-11-17

申请号：US683959

申请日：1996-07-19

申请人： Hirokuni Hiyama ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： G01B11/06 ,  G01B11/30 ,  G01N21/84

CPC分类号： B24B37/205 ,  B24B49/12 ,  G01B11/0683 ,  G01B11/306

摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and such workpiece against the polishing cloth. The polishing apparatus also has a thickness detector for detecting the thickness of a surface layer of the workpiece supported by the top ring while the workpiece is being polished without exposing the workpiece. The thickness detector includes a sensor mounted in the turntable and including at least one light-emitting element for emitting light toward the surface layer of the workpiece and at least one light-detecting element for detecting light reflected from the surface layer of the workpiece.

摘要翻译： 抛光装置在实时检测工件的表面层的厚度或平坦度的同时对半导体晶片等工件进行抛光。 抛光装置包括：转台，其具有安装在其上表面上的抛光布，以及设置在转盘上方的顶环，用于将抛光的工件支撑在抛光布上。 抛光装置还具有厚度检测器，用于在工件抛光而不暴露工件的同时检测由顶环支撑的工件的表面层的厚度。 厚度检测器包括安装在转盘中的传感器，并且包括用于向工件的表面层发射光的至少一个发光元件和用于检测从工件的表面层反射的光的至少一个光检测元件。

公开(公告)号：US07214122B2

公开(公告)日：2007-05-08

申请号：US11274112

申请日：2005-11-16

申请人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

发明人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

摘要翻译： 基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。 基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。 抛光垫在其中形成有通孔。 基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。 发光和接收装置设置在抛光台中。 衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。 供给通道具有可拆卸地安装在抛光台上的出口部分。 衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

公开(公告)号：US20070173177A1

公开(公告)日：2007-07-26

申请号：US11727727

申请日：2007-03-28

申请人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

发明人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

公开(公告)号：US07507144B2

公开(公告)日：2009-03-24

申请号：US11727727

申请日：2007-03-28

申请人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

发明人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

摘要翻译： 基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。 基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。 抛光垫在其中形成有通孔。 基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。 发光和接收装置设置在抛光台中。 衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。 供给通道具有可拆卸地安装在抛光台上的出口部分。 衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

公开(公告)号：US20060105679A1

公开(公告)日：2006-05-18

申请号：US11274112

申请日：2005-11-16

申请人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

发明人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

公开(公告)号：US20120068965A1

公开(公告)日：2012-03-22

申请号：US13228686

申请日：2011-09-09

申请人： Yutaka Wada ,  Naohiro Takahashi ,  Takashi Itaya

发明人： Yutaka Wada ,  Naohiro Takahashi ,  Takashi Itaya

IPC分类号： G06F3/045

CPC分类号： G06F3/044 ,  G06F3/0414

摘要： A sensor apparatus includes: a sensor panel that includes an input operation surface and is configured to detect positional coordinates of a detection object that comes into contact with the input operation surface; a casing; and a pressure-sensitive sensor that includes a first electrode fixed on the sensor panel side, a second electrode fixed on the casing side, and an elastic member that is provided between the sensor panel and the casing and elastically supports the sensor panel with respect to the casing, includes, between the first electrode and the second electrode, a first area formed with a first capacitance and a second area formed with a second capacitance larger than the first capacitance, and is configured to detect a pressing force input to the input operation surface as a change in a capacitance between the first electrode and the second electrode.

摘要翻译： 传感器装置包括：传感器面板，包括输入操作面，被配置为检测与输入操作面接触的检测对象的位置坐标; 套管 以及压敏传感器，其包括固定在所述传感器面板侧的第一电极，固定在所述壳体侧的第二电极和设置在所述传感器面板与所述壳体之间的弹性部件，并相对于所述传感器面板弹性地支撑所述传感器面板 壳体在第一电极和第二电极之间包括形成有第一电容的第一区域和形成有大于第一电容的第二电容的第二区域，并且被配置为检测输入到输入操作的按压力 表面作为第一电极和第二电极之间的电容的变化。