公开(公告)号：US08227332B2

公开(公告)日：2012-07-24

申请号：US12262982

申请日：2008-10-31

申请人： Romain Coffy ,  Jacky Seiller ,  Gil Provent

发明人： Romain Coffy ,  Jacky Seiller ,  Gil Provent

IPC分类号： H01L21/44

CPC分类号： H05K3/242 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05666 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/11422 ,  H01L2224/11472 ,  H01L2224/11912 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H05K3/3473 ,  H05K2203/043 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01028 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A method for fabricating electrical bonding pads on one face of a wafer includes the production of electrically conductive areas and electrical connection branches connecting these conductive areas. A layer of mask material is deposited and openings are produced in this mask layer which extend above said conductive areas and at least some of which extend at least partly beyond the peripheral edges of the underlying conductive areas. Blocks made of a solder material are produces in the openings by electrodeposition in a bath. The mask material is then removed along with the connection branches. The wafer is passed through or placed in an oven so as to shape, on the conductive areas, the blocks into substantially domed electrical bonding pads.

摘要翻译： 用于在晶片的一个面上制造电接合焊盘的方法包括制造导电区域和连接这些导电区域的电连接分支。 沉积掩模材料层，并且在该掩模层中产生开口，该掩模层在所述导电区域之上延伸，并且至少其中一些延伸至少部分地超过下面的导电区域的周边边缘。 通过在浴中电沉积在开口中产生由焊料材料制成的块。 然后将掩模材料与连接分支一起移除。 将晶片通过或放置在烘箱中，以在导电区域上将块形成为基本上圆顶的电接合焊盘。

公开(公告)号：US07643311B2

公开(公告)日：2010-01-05

申请号：US11407854

申请日：2006-04-20

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H05K9/00

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0022 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.

摘要翻译： 一种防止电磁干扰的电子设备，包括：具有第一和第二电子部件的支撑结构，其中所述支撑结构包括围绕所述第一和第二电子部件中的每一个的导电装置; 形成在所述支撑结构上的所述第一和第二电子元件上的第一和第二绝缘块; 以及覆盖在第一和第二电子部件上形成的第一和第二绝缘块的金属层，其中金属层通过导电装置电连接到支撑结构，以保护第一和第二电子部件免受电磁干扰照射 从每个第一和第二电子部件。

公开(公告)号：US07282906B2

公开(公告)日：2007-10-16

申请号：US11407855

申请日：2006-04-20

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H01L23/552 ,  H01K7/14

CPC分类号： H01L23/552 ,  H01L23/055 ,  H01L23/06 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16152 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0022 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device for protecting an electronic circuit comprising a support to which are attached at least two circuit portions, each comprising at least one integrated circuit chip. The device comprises a wafer of a semiconductor material covered with a conductive layer arranged parallel to the support, the wafer being connected to the support by conductive pillars distributed around each circuit portion and in contact with the conductive layer.

摘要翻译： 一种用于保护电子电路的装置，包括支撑件，至少两个电路部分连接至所述支架，每个电路部分包括至少一个集成电路芯片。 该器件包括半导体材料的晶片，该半导体材料被平行于支撑体布置的导电层覆盖，晶片通过分布在每个电路部分周围并与导电层接触的导电柱连接到支撑体。

公开(公告)号：US20060274517A1

公开(公告)日：2006-12-07

申请号：US11407854

申请日：2006-04-20

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H05K9/00

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0022 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.

摘要翻译： 一种防止电磁干扰的电子设备，包括：具有第一和第二电子部件的支撑结构，其中所述支撑结构包括围绕所述第一和第二电子部件中的每一个的导电装置; 形成在所述支撑结构上的所述第一和第二电子元件上的第一和第二绝缘块; 以及覆盖在第一和第二电子部件上形成的第一和第二绝缘块的金属层，其中金属层通过导电装置电连接到支撑结构，以保护第一和第二电子部件免受电磁干扰的照射 从每个第一和第二电子部件。