POLYMER-BASED INTERCONNECTION BETWEEN SILICON PHOTONICS DEVICES AND OPTICAL FIBERS
    37.
    发明申请
    POLYMER-BASED INTERCONNECTION BETWEEN SILICON PHOTONICS DEVICES AND OPTICAL FIBERS 审中-公开
    硅光电器件与光纤之间的基于聚合物的互连

    公开(公告)号:US20150010268A1

    公开(公告)日:2015-01-08

    申请号:US13935515

    申请日:2013-07-04

    CPC classification number: G02B6/32 G02B6/30

    Abstract: An apparatus includes a Silicon Photonics (SiP) device and a ferrule. The SiP includes multiple optical waveguides. The ferrule includes multiple optical fibers for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array of micro-lenses is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.

    Abstract translation: 一种装置包括硅光子学(SiP)器件和套圈。 SiP包括多个光波导。 套圈包括用于与SiP器件的各个光波导交换光信号的多个光纤。 在一些实施例中,微透镜阵列被配置为耦合SiP器件的光波导与套管的相应光纤之间的光信号。 在一些实施例中,聚合物层被放置在SiP器件和套圈之间,并且包括多个基于聚合物的点尺寸转换器(SSC),其被配置为将SiP器件的光波导与相应的光学器件 套管的纤维。

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