Abstract:
An apparatus and method of assembly are described that provide improved mechanisms for cooling an optoelectronic transducer in a fiber optic system. The apparatus includes a thermoelectric cooler (TEC) secured to the optoelectronic transducer for removing heat from the optoelectronic transducer in response to instructions from a TEC driver, as well as a microcontroller electrically connected to the TEC driver for monitoring temperature and communicating with the TEC driver to selectively activate and deactivate the TEC at least partially based on the monitored temperature and/or other measured/detected data to effect a more efficient cooling mechanism for optoelectronic transducers, such as VCSELs. In addition, the user may be able to configure the system to maintain the optoelectronic transducer within a user-defined range of temperatures. In this way, a longer life and better performance of the optoelectronic transducer may be achieved, and datacenter costs related to cooling and/or maintenance may be minimized.
Abstract:
A transducer reliability testing and VCSEL failure prediction method are provided. The method includes applying a testing temperature and a constant current to a VCSEL for a testing time. The method monitors a forward voltage of the VCSEL and determines if a first change in forward voltage is above a first predetermined threshold over the testing time and if a second change in forward voltage is above a second predetermined threshold over a portion of the testing time. The method determines failure of the VCSEL if either of these predetermined thresholds are exceeded. The method determines passage of the VCSEL if the first change in the forward voltage and the second change in the forward voltage are both below the first predetermined threshold and the second predetermined threshold, respectively.
Abstract:
An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.
Abstract:
An optical apparatus, comprising a Silicon Photonics (SiP) device, with multiple optical waveguides and an array of collimating lenses, configured to receive light from the multiple optical waveguides in paths not including optical fibers and to collimate the light of the multiple optical waveguides into collimated beams. A receptacle is configured to receive an external optical device in an orientation aligned with the collimated beams from the array of collimating lenses.
Abstract:
An electro-optic transceiver module, method of manufacturing, and method of transmitting signals are provided that allow multiple optical signals at different wavelengths (e.g., according to CWDM) to be combined for transmission via a number of optical fibers that is smaller than the number of electrical channels according to which the optical signals were generated. Thus, CWDM may be used in connection with lower-cost VCSEL technology (e.g., as opposed to higher-cost edge-emitting lasers) by providing for wavelength compensation at the VCSEL driver to offset any changes in wavelength that may have otherwise occurred at the VCSELs. In particular, a microcontroller of the electro-optic transceiver module correlates a monitored temperature of the VCSELs to an actual wavelength of the corresponding optical signals transmitted by the respective VCSELS and determined an adjustment in a current supplied by the VCSEL driver to each VCSEL to achieve more precise and consistent wavelengths at the VCSELs.
Abstract:
An apparatus and method of assembly are described that provide improved mechanisms for cooling an optoelectronic transducer in a fiber optic system. The apparatus includes a thermoelectric cooler (TEC) secured to the optoelectronic transducer for removing heat from the optoelectronic transducer in response to instructions from a TEC driver, as well as a microcontroller electrically connected to the TEC driver for monitoring temperature and communicating with the TEC driver to selectively activate and deactivate the TEC at least partially based on the monitored temperature and/or other measured/detected data to effect a more efficient cooling mechanism for optoelectronic transducers, such as VCSELs. In addition, the user may be able to configure the system to maintain the optoelectronic transducer within a user-defined range of temperatures. In this way, a longer life and better performance of the optoelectronic transducer may be achieved, and datacenter costs related to cooling and/or maintenance may be minimized.
Abstract:
An apparatus includes a Silicon Photonics (SiP) device and a ferrule. The SiP includes multiple optical waveguides. The ferrule includes multiple optical fibers for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array of micro-lenses is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.