公开(公告)号：US20190341537A1

公开(公告)日：2019-11-07

申请号：US16516214

申请日：2019-07-18

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/64 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US20180269365A1

公开(公告)日：2018-09-20

申请号：US15982330

申请日：2018-05-17

Applicant: Micron Technology, Inc.

Inventor： Martin F. Schubert ,  Kevin Tetz

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/54 ,  H01L51/5275 ,  H01L2924/0002 ,  H01L2933/0083 ,  H01L2924/00

Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.

公开(公告)号：US09748461B2

公开(公告)日：2017-08-29

申请号：US14992787

申请日：2016-01-11

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L21/00 ,  H01L33/64 ,  H01L33/50 ,  H01L33/44 ,  H01L33/52 ,  H01L25/075

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/508 ,  H01L33/52 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075 ,  H01L2924/00

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US20160197255A1

公开(公告)日：2016-07-07

申请号：US14992787

申请日：2016-01-11

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/64 ,  H01L33/52 ,  H01L33/50

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/508 ,  H01L33/52 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075 ,  H01L2924/00

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US09236550B2

公开(公告)日：2016-01-12

申请号：US13774502

申请日：2013-02-22

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/44 ,  H01L25/075

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/508 ,  H01L33/52 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075 ,  H01L2924/00

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US20150287895A1

公开(公告)日：2015-10-08

申请号：US14684192

申请日：2015-04-10

Applicant: Micron Technology, Inc.

Inventor： Martin F. Schubert ,  Kevin Tetz

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/54 ,  H01L51/5275 ,  H01L2924/0002 ,  H01L2933/0083 ,  H01L2924/00

Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.

Abstract translation: 本文公开了固态照明（SSL）装置和制造SSL装置的方法。 在一个实施例中，SSL设备包括在支撑体的表面具有表面和固态发射器（SSE）的支撑件。 SSE可以发射沿着多个第一矢量传播的第一光。 SSL设备还可以在SSE的至少一部分上包括转换器材料。 转换器材料可以发射沿着多个第二矢量传播的第二光。 此外，SSL设备可以包括SSE和转换器材料上的镜头。 透镜可以包括改变第一光和第二光的方向的多个扩散特征，使得第一和第二光在它们离开透镜时融合在一起。 SSL设备可以发出大致均匀的光色。

公开(公告)号：US20130175565A1

公开(公告)日：2013-07-11

申请号：US13774502

申请日：2013-02-22

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/64 ,  H01L33/44

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/508 ,  H01L33/52 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075 ,  H01L2924/00

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

Abstract translation: 下面描述固态照明装置和相关的散热方法。 在一个实施例中，发光二极管（LED）装置包括散热器，热耦合到散热器的LED管芯以及与LED管芯间隔开的荧光体。 LED装置还包括与荧光体和散热器直接接触的热传导路径。 热传导路径被配置为将热量从磷光体传导到散热器。

公开(公告)号：US20130168719A1

公开(公告)日：2013-07-04

申请号：US13780136

申请日：2013-02-28

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Charles M. Watkins ,  Kevin Tetz ,  Thomas Gehrke

IPC: H01L33/44

CPC classification number: H01L33/44 ,  H01L33/507 ,  H01L2933/0041

Abstract: A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.

Abstract translation: 公开了一种用于制造发光二极管（LED）的光转换结构的方法和系统。 该方法包括在LED芯片上形成透明的隔热盖。 该方法还包括将转换材料分配到盖上以在盖上形成转化涂层，并且将密封剂中的LED，硅树脂盖和转化膜封装。 可以添加额外的盖子和转换涂层。