公开(公告)号：US20050094120A1

公开(公告)日：2005-05-05

申请号：US10974327

申请日：2004-10-27

申请人： Kazunari Sekigawa ,  Toshinori Koyama ,  Kazutaka Kobayashi ,  Masatoshi Akagawa

发明人： Kazunari Sekigawa ,  Toshinori Koyama ,  Kazutaka Kobayashi ,  Masatoshi Akagawa

IPC分类号： G03F7/20 ,  G03B27/54 ,  H01L21/027 ,  H05K3/00

CPC分类号： G03F7/70283 ,  G03F7/70291 ,  H05K3/0002 ,  H05K3/0005 ,  H05K3/0082

摘要： A direct exposure system comprises: a data mask that is a data object including drawing data; and a control mask that is a data object including at least one logical layer in which information about exposure conditions applied according to regions on a substrate is specified, and performs a direct exposure process using integrated data generated by combining the data mask with the control mask.

摘要翻译： 直接曝光系统包括：作为包括绘图数据的数据对象的数据掩模; 以及作为包括至少一个逻辑层的控制掩模，所述至少一个逻辑层指定了根据基板上的区域应用的关于曝光条件的信息，并且使用通过将数据掩模与控制掩模组合而生成的积分数据进行直接曝光处理 。

公开(公告)号：US06452806B2

公开(公告)日：2002-09-17

申请号：US09768607

申请日：2001-01-25

申请人： Takashi Ikeda ,  Masatoshi Akagawa ,  Daisuke Ito

发明人： Takashi Ikeda ,  Masatoshi Akagawa ,  Daisuke Ito

IPC分类号： H05K114

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching. The plane coil 10 in which a conductor line 11 is wound a plurality of times in substantially the same plane is formed by punching, terminals 10a, 10b of the plane coil 10 and electrode terminals 12a, 12b of the semiconductor element 12 are electrically connected to each other, the plane coil 10 is provided with an outside terminal 10a formed outside the coil and an inside terminal formed inside the coil, the semiconductor element 12 is arranged in such a manner that a forming face on which the electrode terminals 12a, 12b are formed or a plane reverse to the forming face is opposed to the conductor line 11 of the plane coil 10, the electrode terminals 12a, 12b of the semiconductor element 12 are respectively located adjacent to the outside terminal 10a and the inside terminal 10b of the plane coil 10, and the electrode terminals 12a, 12b are electrically connected to the terminals 10a, 10b of the plane coil 10 located on the same side with respect to the inside and outside of the coil.

摘要翻译： 可以以低成本批量生产的IC卡由通过冲压或蚀刻形成的平面线圈构成。 通过冲孔形成导体线11在基本相同的平面中多次缠绕的平面线圈10，平面线圈10的端子10a，10b和半导体元件12的电极端子12a，12b电连接到 彼此之间，平面线圈10设置有形成在线圈外部的外部端子10a和形成在线圈内部的内部端子，半导体元件12以这样的方式配置，使得其上形成有电极端子12a，12b的形成面 形成的或与成形面相反的平面与平面线圈10的导体线11相对，半导体元件12的电极端子12a，12b分别位于与外部端子10a和平面的内部端子10b相邻的位置 线圈10，并且电极端子12a，12b电连接到相对于线圈的内部和外部位于同一侧的平面线圈10的端子10a，10b 。

公开(公告)号：US06380614B1

公开(公告)日：2002-04-30

申请号：US09602073

申请日：2000-06-23

申请人： Tsutomu Higuchi ,  Tomoharu Fujii ,  Shigeru Okamura ,  Tsuyoshi Sato ,  Takayoshi Wakabayashi ,  Masatoshi Akagawa

发明人： Tsutomu Higuchi ,  Tomoharu Fujii ,  Shigeru Okamura ,  Tsuyoshi Sato ,  Takayoshi Wakabayashi ,  Masatoshi Akagawa

IPC分类号： H01L2302

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81395 ,  H01L2924/00014

摘要： An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.

摘要翻译： IC卡包括：具有相应端子部分的平面线圈; 半导体元件，其布置在与所述平面线圈不重叠的位置处，所述半导体元件具有电极端子; 用于将平面线圈的各个端子部分电连接到半导体元件的电极端子的装置; 以及加强框架，其设置在与半导体元件基本相同的面上，使得半导体元件被加强框架包围。

公开(公告)号：US6121688A

公开(公告)日：2000-09-19

申请号：US168148

申请日：1998-10-08

申请人： Masatoshi Akagawa

发明人： Masatoshi Akagawa

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H01L23/48

CPC分类号： H01L24/31 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5328 ,  H01L24/28 ,  H01L24/83 ,  H05K3/4617 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/81903 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L24/12 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0373 ,  H05K2201/0215 ,  H05K3/323 ,  H05K3/4084 ,  H05K3/4647

摘要： An anisotropic conductive sheet material includes a resin and conductive fillers, such as metallic particles, added in the resin. A conductive layer is formed on one of the surfaces of the anisotropic conductive sheet material. A circuit board includes a substrate having first and second surfaces and a circuit pattern being formed on the first surface of the substrate, an anisotropic conductive sheet having first and second surfaces, a circuit pattern being formed on the first surface thereof. The second surface of the anisotropic conductive sheet is adhered to the first surface of the substrate in such a manner that the circuit patterns are electrically connected to each other by means of the anisotropic conductive sheet. An electrically insulative layer formed on the first surface of the anisotropic conductive sheet to cover the circuit pattern thereof, except that external connecting portions thereof are exposed.

摘要翻译： 各向异性导电片材料包括树脂和添加在树脂中的诸如金属颗粒的导电填料。 在各向异性导电片材的一个表面上形成导电层。 电路板包括具有第一表面和第二表面的基板和形成在基板的第一表面上的电路图案，具有第一和第二表面的各向异性导电片，在其第一表面上形成电路图案。 各向异性导电片的第二表面以通过各向异性导电片彼此电连接的方式粘附到基板的第一表面。 形成在各向异性导电片的第一表面上以覆盖其电路图案的电绝缘层，除了外露连接部分外。