公开(公告)号：US09080612B2

公开(公告)日：2015-07-14

申请号：US13819402

申请日：2011-07-25

申请人： Tomoharu Fujii ,  Tsuyoshi Yamanaka ,  Shigeru Ishii

发明人： Tomoharu Fujii ,  Tsuyoshi Yamanaka ,  Shigeru Ishii

IPC分类号： F16D25/08 ,  F16D13/40 ,  F16D13/72 ,  F16D25/04 ,  F16D48/02

CPC分类号： F16D13/40 ,  F16D13/648 ,  F16D13/72 ,  F16D25/044 ,  F16D25/082 ,  F16D2048/0212 ,  F16D2069/004 ,  F16D2300/0212

摘要： Provided are devices and methods to minimize drag caused by abrasion powder between clutch plates and to prevent a faulty engagement or release of a dry clutch. A hybrid driving force transmission device is provided, wherein a multi-plate dry clutch is arranged in a sealed space and used for connecting/disconnecting transmission of a driving force is provided with drive plates, driven plates, friction facings, and a housing cover. The drive plates are splined to a clutch hub, and have, in the sections thereof that are splined to the clutch hub, vent holes for channeling the air flowing in the axial direction. The driven plates are splined to a clutch drum. The housing cover has an external air intake hole for drawing external air into the sealed space, and an external air discharge hole for discharging the airflow from the sealed space to the outside.

摘要翻译： 提供了用于最小化由离合器板之间的磨耗粉引起的阻力并且防止干式离合器的错误接合或释放的装置和方法。 提供一种混合驱动力传递装置，其中多板干式离合器布置在密封空间中并用于驱动力的连接/断开传动，设置有驱动板，从动板，摩擦面和壳体盖。 驱动板花键连接到离合器毂，并且在其与花键连接到离合器毂的部分中具有用于引导沿轴向流动的空气的通风孔。 从动板花键到离合器鼓。 壳体盖具有用于将外部空气吸入密封空间的外部空气吸入孔和用于将气流从密封空间排出到外部的外部空气排出孔。

公开(公告)号：US08552815B2

公开(公告)日：2013-10-08

申请号：US12787451

申请日：2010-05-26

申请人： Tomoharu Fujii ,  Yukari Chino

发明人： Tomoharu Fujii ,  Yukari Chino

IPC分类号： H01P5/02

CPC分类号： H01P11/003 ,  H01P3/121 ,  H01P11/001 ,  H01P11/002

摘要： A high-frequency line structure includes a multi-layered resin substrate in which insulating layers of a resin are laminated. A high-frequency-signal input part is arranged on the resin substrate to input a high-frequency signal and supply the high-frequency signal to the resin substrate. A high-frequency-signal output part is arranged in the resin substrate to receive the high-frequency signal from the input part and output the received high-frequency signal. A first metal layer is arranged to encircle the input and output pads and electrically insulated from the input and output parts. A second metal layer is arranged on the resin substrate. A plurality of penetration vias are arranged in the resin substrate to encircle the input part and the output part, and each penetration via being connected to the first and second metal layers.

摘要翻译： 高频线路结构包括层叠有树脂的绝缘层的多层树脂基板。 在树脂基板上配置有高频信号输入部，以输入高频信号，并向树脂基板供给高频信号。 高频信号输出部分布置在树脂基板中以从输入部分接收高频信号并输出​​接收到的高频信号。 第一金属层被布置成环绕输入和输出焊盘并与输入和输出部件电绝缘。 第二金属层设置在树脂基板上。 多个贯通孔设置在树脂基板中以包围输入部分和输出部分，并且每个穿透通孔连接到第一和第二金属层。

公开(公告)号：US20130163206A1

公开(公告)日：2013-06-27

申请号：US13676569

申请日：2012-11-14

申请人： Narue Kobayashi ,  Tomoharu Fujii ,  Yukiharu Takeuchi

发明人： Narue Kobayashi ,  Tomoharu Fujii ,  Yukiharu Takeuchi

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom surface of the cavity, and electrode terminals of the chip are connected via wires to wiring portions formed on the board around the cavity. The chip is mounted in close contact with a side wall of the cavity, the side wall being near a region where a wiring for higher frequency compared with other wirings within the wiring portion is formed. A recessed portion is provided in a region of the bottom surface of the cavity, and a thermal via extending from the bottom surface of the recessed to the outside of the board is provided, the region being near a portion where the chip is in close contact.

摘要翻译： 半导体器件包括其中半导体元件（芯片）安装在形成在布线板中的空腔中的结构，其中插入在芯片和腔的底表面之间的粘合剂，并且芯片的电极端子经由导线连接到 形成在板周围的配线部分。 芯片安装成与空腔的侧壁紧密接触，侧壁靠近一个区域，与布线部分内的其它配线相比，更高频率的布线形成。 凹部设置在空腔的底面的区域中，并且设置从凹部的底面延伸到外部的热通孔，该区域靠近芯片紧密接触的部分 。

公开(公告)号：US08373997B2

公开(公告)日：2013-02-12

申请号：US12972894

申请日：2010-12-20

申请人： Narue Kobayashi ,  Tomoharu Fujii ,  Yukiharu Takeuchi

发明人： Narue Kobayashi ,  Tomoharu Fujii ,  Yukiharu Takeuchi

IPC分类号： H05K7/00

CPC分类号： H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom surface of the cavity, and electrode terminals of the chip are connected via wires to wiring portions formed on the board around the cavity. The chip is mounted in close contact with a side wall of the cavity, the side wall being near a region where a wiring for higher frequency compared with other wirings within the wiring portion is formed. A recessed portion is provided in a region of the bottom surface of the cavity, and a thermal via extending from the bottom surface of the recessed to the outside of the board is provided, the region being near a portion where the chip is in close contact.

摘要翻译： 半导体器件包括其中半导体元件（芯片）安装在形成在布线板中的空腔中的结构，其中插入在芯片和腔的底表面之间的粘合剂，并且芯片的电极端子经由导线连接到 形成在板周围的配线部分。 芯片安装成与空腔的侧壁紧密接触，侧壁靠近一个区域，与布线部分内的其它配线相比，更高频率的布线形成。 凹部设置在空腔的底面的区域中，并且设置从凹部的底面延伸到外部的热通孔，该区域靠近芯片紧密接触的部分 。

公开(公告)号：US20090267221A1

公开(公告)日：2009-10-29

申请号：US12428594

申请日：2009-04-23

申请人： Tomoharu FUJII

发明人： Tomoharu FUJII

IPC分类号： H01L23/538

CPC分类号： H01L23/49833 ,  H01L21/56 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/48 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An antenna formed on one surface side of a silicon substrate and a semiconductor element provided on the other surface side of the silicon substrate are electrically connected to each other by means of a through via penetrating the silicon substrate. A wiring board is formed separately from the silicon substrate. A passive element is provided on one surface side of the wiring board. A copper core solder ball is provided between the one surface side of the wiring board and the other surface side of the silicon substrate and electrically connects the silicon substrate and the wiring board to each other.

摘要翻译： 形成在硅衬底的一个表面侧的天线和设置在硅衬底的另一表面侧上的半导体元件通过穿透硅衬底的贯通孔彼此电连接。 与硅衬底分开形成布线板。 无源元件设置在布线板的一个表面侧。 在布线基板的一个表面侧和硅基板的另一个表面侧之间设置铜芯焊球，并将硅基板和布线板彼此电连接。

公开(公告)号：US20090166811A1

公开(公告)日：2009-07-02

申请号：US12342755

申请日：2008-12-23

申请人： Tomoharu FUJII

发明人： Tomoharu FUJII

IPC分类号： H01L29/41 ,  H01L21/02

CPC分类号： H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A semiconductor device has a semiconductor chip and through electrodes formed passing through the semiconductor chip. A ground layer connected to the through electrode and a patch antenna connected to the through electrode are provided through an inorganic insulating layer formed of SiO2 or SiN on a second face opposite to a first face (main face) of the semiconductor chip.

摘要翻译： 半导体器件具有通过半导体芯片形成的半导体芯片和穿过电极。 在与半导体芯片的第一面（主面）相反的第二面上，通过与SiO 2或SiN形成的无机绝缘层，设置连接至贯通电极的接地层和与贯通电极连接的贴片天线。

公开(公告)号：US20080217515A1

公开(公告)日：2008-09-11

申请号：US12044540

申请日：2008-03-07

申请人： Tomoharu Fujii

发明人： Tomoharu Fujii

IPC分类号： G01J1/44

CPC分类号： G01J1/4228 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/46 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A silicon substrate is used as a substrate body of a wiring substrate and also, plural light receiving elements for outputting a detection signal according to illuminance of light at the time of receiving light applied from the outside, an amplification circuit element for amplifying the detection signal outputted by the light receiving elements, a changeover switch element for performing switching as to whether or not the light receiving element is electrically connected to the amplification circuit element, and a resistor and a capacitor electrically connected to the amplification circuit element are disposed on the wiring substrate.

摘要翻译： 硅基板被用作布线基板的基板主体，还有，用于在接收从外部施加的光时根据光的照度输出检测信号的多个光接收元件，用于放大检测信号的放大电路元件 由光接收元件输出的切换开关元件，用于进行与受光元件是否电连接到放大电路元件的切换的切换开关元件，以及电连接到放大电路元件的电阻器和电容器布置在布线 基质。

公开(公告)号：US20070275655A1

公开(公告)日：2007-11-29

申请号：US11798717

申请日：2007-05-16

申请人： Tomoyuki Iwamoto ,  Tomoharu Fujii

发明人： Tomoyuki Iwamoto ,  Tomoharu Fujii

IPC分类号： H04B3/36

CPC分类号： H04B7/155

摘要： A terminal includes a wireless module for relaying a data signal, a sub-module for relaying the data signal, and a switch which connects the wireless module and the sub-module in parallel, and selects the wireless module or the sub-module to relay the data signal in response to a control signal from a controller provided in the wireless module.

摘要翻译： 终端包括用于中继数据信号的无线模块，用于中继数据信号的子模块和并行连接无线模块和子模块的交换机，并选择无线模块或子模块进行中继 所述数据信号响应于来自所述无线模块中提供的控制器的控制信号。

公开(公告)号：US06556175B2

公开(公告)日：2003-04-29

申请号：US09940570

申请日：2001-08-28

申请人： Shigeru Okamura ,  Tomoharu Fujii

发明人： Shigeru Okamura ,  Tomoharu Fujii

IPC分类号： H01Q136

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00

摘要： An antenna for a non-contact type IC card is provided. A plane coil is formed by punching or etching a thin metal plate in such a manner that a conductor line is wound several times on substantially the same surface. The plane coil has respective terminals at innermost and outermost ends. The innermost terminal is provided with accommodation hole, in which a semiconductor element having electrode terminals is arranged. A circuit film comprises an insulating resin film and a circuit pattern formed on the insulating resin film. The circuit pattern electrically connects the electrode terminals of the semiconductor element to the terminals of the plane coil, respectively. At least one projection is integrally formed with the conductor and extending therefrom inwardly or outwardly so as not to contact an adjacent loop of the conductor line. The projection is located at any desired position to be used as a suction pad, an alignment mark or a positioning guide when said plane coil is sucked or positioned.

摘要翻译： 提供了一种用于非接触型IC卡的天线。平面线圈是通过冲压或蚀刻薄金属板而形成的，使得导体线在基本上相同的表面上几次缠绕。 平面线圈在最内侧和最外端具有相应的端子。 最里面的端子设置有容纳孔，其中布置有具有电极端子的半导体元件。 电路膜包括绝缘树脂膜和形成在绝缘树脂膜上的电路图案。 电路图案分别将半导体元件的电极端子与平面线圈的端子电连接。 至少一个突起与导体一体地形成并且从内向内或向外延伸，以便不接触导体线的相邻环。 当所述平面线圈被吸入或定位时，突出部位于任何期望的位置，用作吸盘，对准标记或定位引导件。

公开(公告)号：US08405953B2

公开(公告)日：2013-03-26

申请号：US12191454

申请日：2008-08-14

申请人： Tomoharu Fujii ,  Masahiro Sunohara

发明人： Tomoharu Fujii ,  Masahiro Sunohara

IPC分类号： H01G4/002 ,  H01G4/005

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01G4/236 ,  Y10T29/435

摘要： A capacitor-embedded substrate includes a base material having a desired thickness, and a pair of conductors (feedthrough electrodes) each formed in a desired pattern to penetrate through the base material in the thickness direction thereof, and oppositely disposed with an insulating layer interposed therebetween. The pair of electrodes are formed in comb-shaped patterns, and are oppositely disposed in such a manner that respective comb-tooth portions are meshed with each other.

摘要翻译： 电容器嵌入式基板包括具有期望厚度的基体材料和一对导体（馈通电极），每个导体（馈通电极）以期望的图案形成，以在其厚度方向上穿透基底材料，并且相对设置有绝缘层 。 一对电极形成为梳形图案，并且以相应的梳齿部彼此啮合的方式相对地设置。