公开(公告)号：US08165021B2

公开(公告)日：2012-04-24

申请号：US11899935

申请日：2007-09-05

Applicant: Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

Inventor： Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

IPC: G01R31/08 ,  G06F11/00 ,  G08C15/00 ,  H04J1/16 ,  H04J3/14 ,  H04L1/00 ,  H04L12/26 ,  H04L12/28 ,  H04L12/56

CPC classification number: H04L47/824 ,  H04L47/10 ,  H04L47/70 ,  H04L47/805 ,  H04L47/822

Abstract: In one embodiment, a network device receives a request from a client in association with a connection, where the request indicates an amount of one or more resources that is requested to support the connection. The network device determines whether the amount of the resources is available. The network device may then allocate a level of the resources to the connection according to whether the amount of the resources is available.

Abstract translation: 在一个实施例中，网络设备从连接中接收来自客户端的请求，其中请求指示被请求支持连接的一个或多个资源的量。 网络设备确定资源的数量是否可用。 然后，网络设备可以根据资源的数量是否可用来向该连接分配一个资源级别。

公开(公告)号：US08129230B2

公开(公告)日：2012-03-06

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20110037181A1

公开(公告)日：2011-02-17

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US07816785B2

公开(公告)日：2010-10-19

申请号：US12357744

申请日：2009-01-22

Applicant: Sushumna Iruvanti ,  Randall G. Kemink ,  Rajneesh Kumar ,  Steven P. Ostrander ,  Prabjit Singh

Inventor： Sushumna Iruvanti ,  Randall G. Kemink ,  Rajneesh Kumar ,  Steven P. Ostrander ,  Prabjit Singh

IPC: H01L23/10

CPC classification number: H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.

Abstract translation: 提供了一种用于半导体器件的改进的热界面材料。 更具体地，提供了用于热界面材料的低压缩力，非硅氧烷，高导热性配方。 热界面材料包括使用约100psi或更小的压缩力显示约5.5W / mK或更高的导热率和约100微米或更小的压缩粘合线厚度的非硅氧烷有机物的组合物。

公开(公告)号：US07486658B2

公开(公告)日：2009-02-03

申请号：US11192706

申请日：2005-07-29

Applicant: Rajneesh Kumar

Inventor： Rajneesh Kumar

IPC: H04J3/06

CPC classification number: H04N21/6437 ,  H04J3/0638 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2416 ,  H04L47/286 ,  H04N21/4305 ,  H04N21/64322 ,  H04W28/10 ,  H04W56/00 ,  H04W84/12

Abstract: A method and system directed to negotiating and triggering media stream synchronization at the link layer in a QoS-enabled 802.11 WLAN, or other wireless, network. In one implementation, the present invention allows for improved performance of streaming network applications, such as video conferencing, over wireless links. In one implementation, the present invention also provides an optional mechanism whereby a mobile station can signal a need for on-the-fly throttling, if an application on the mobile detects that there is a need for better synchronization of two streams, such as a lower priority stream to a higher priority stream.

Abstract translation: 一种用于在启用QoS的802.11 WLAN或其他无线网络中的链路层协商和触发媒体流同步的方法和系统。 在一个实现中，本发明允许通过无线链路改进诸如视频会议之类的流媒体网络应用的性能。 在一个实施方式中，本发明还提供了一种可选的机构，其中移动台可以发出对即时节流的需要，如果移动台上的应用检测到需要两个流的更好的同步，诸如 较低优先级流到较高优先级流。

公开(公告)号：US20070242649A1

公开(公告)日：2007-10-18

申请号：US11405319

申请日：2006-04-17

Applicant: Rajneesh Kumar ,  Ashish Chotai ,  Aseem Asthana ,  Sravan Vadlakonda ,  Girish Variyath ,  Vikram Jayaraman ,  Pradeep Bheda

Inventor： Rajneesh Kumar ,  Ashish Chotai ,  Aseem Asthana ,  Sravan Vadlakonda ,  Girish Variyath ,  Vikram Jayaraman ,  Pradeep Bheda

IPC: H04Q7/28

CPC classification number: H04W72/0406 ,  H04W4/16 ,  H04W84/16

Abstract: In one embodiment, a method for requesting wireless network resources includes transmitting a network resource request to a wireless network in response to a session initiation message from a session signaling node and, responsive to an indication that the wireless network lacks sufficient resources, conditionally transmitting a camp-on information message to the session signaling node.

Abstract translation: 在一个实施例中，用于请求无线网络资源的方法包括响应于来自会话信令节点的会话发起消息向无线网络发送网络资源请求，并且响应于无线网络缺少足够资源的指示，有条件地发送 驻留信息消息发送到会话信令节点。

公开(公告)号：US08492910B2

公开(公告)日：2013-07-23

申请号：US13358910

申请日：2012-01-26

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20120217287A1

公开(公告)日：2012-08-30

申请号：US13036086

申请日：2011-02-28

Applicant: Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

Inventor： Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/0016

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract translation: 安装到接合头的第一衬底和安装到基板的第二衬底在接合时被保持在不同的升高的温度，从而相对于室温在第二衬底和第一衬底之间提供基本匹配的热膨胀。 此外，焊接材料部分和第二基板的温度至少升高到接触后的熔融温度。 第一基板和第二基板之间的距离可被调制以增强焊点的完整性。 一旦该距离处于最佳状态，就将分离头拆下，并使粘结结构冷却以形成结合的倒装芯片结构。 或者，焊接头可以在冷却步骤期间通过附接到芯片来控制焊点的冷却速度。

公开(公告)号：US08204029B2

公开(公告)日：2012-06-19

申请号：US12339473

申请日：2008-12-19

Applicant: David Sheldon Stephenson ,  Seema Nayak ,  Sudip Ghosal ,  Rajneesh Kumar

Inventor： David Sheldon Stephenson ,  Seema Nayak ,  Sudip Ghosal ,  Rajneesh Kumar

IPC: H04W4/00

CPC classification number: H04W36/0088 ,  H04L63/10 ,  H04W36/14 ,  H04W84/12

Abstract: A system and method are provided in which access point (AP) devices in a wireless local area network (WLAN) are typed or configured into one of three measurement and reporting roles: Monitor-Mode AP (MMAP), Portal AP (PAP), a Border AP (BAP) or an Interior AP (IAP). APs are assigned specific link measurement requirements according to their assigned type or role. In general, MMAPs and PAPs have the greatest measurement and reporting responsibilities, BAPs have less measurement and reporting responsibilities than PAPs and IAPs have the least measurement and reporting responsibilities. The APs generate measurements that are supplied to appropriate equipment to facilitate handover decisions with respect to a dual-mode wireless client device that roams between the WLAN and another network or vice versa. As a result, link measurements are only performed by APs in locations where such measurements are necessary for handover service, thus reducing the overall processing load on the WLAN infrastructure.

Abstract translation: 提供了一种系统和方法，其中无线局域网（WLAN）中的接入点（AP）设备被输入或配置为三个测量和报告角色之一：监视模式AP（MMAP），门户AP（PAP） 边界AP（BAP）或内部AP（IAP）。 AP根据其分配的类型或角色为特定的链路测量要求分配。 一般来说，MMAPs和PAPs具有最大的测量和报告责任，BAP的测量和报告责任比PAP更少，IAP具有最少的测量和报告责任。 AP产生提供给适当设备的测量结果，以便于相对于在WLAN和另一网络之间漫游的双模无线客户端设备进行切换决策，反之亦然。 因此，链路测量仅由AP在这种测量对于切换服务是必需的位置中执行，从而减少WLAN基础设施上的整体处理负担。

公开(公告)号：US07948905B2

公开(公告)日：2011-05-24

申请号：US12040346

申请日：2008-02-29

Applicant: Girish S. Variyath ,  Vikram Jayaraman ,  Karthikeyan Ganesan ,  Rajneesh Kumar

Inventor： Girish S. Variyath ,  Vikram Jayaraman ,  Karthikeyan Ganesan ,  Rajneesh Kumar

IPC: H04L12/26

CPC classification number: H04L41/5087 ,  H04L41/0681 ,  H04L41/145 ,  H04L41/5009 ,  H04W24/06

Abstract: A voice over WLAN diagnostic system. In particular implementations, a method includes simulating, in response to a triggering event, Voice over Internet Protocol (VoIP) communications with a remote diagnostics engine; gathering metric data characterizing one or more aspects of the simulated VoIP communications; and periodically transmitting diagnostic packets including the metric data to the remote diagnostics engine; wherein the simulating VoIP communications comprises transmitting diagnostic protocol packets that simulate VoIP communications to the remote diagnostic engine; and intercepting diagnostic protocol packets received from the diagnostics engine.

Abstract translation: WLAN诊断系统的语音。 在特定实施方式中，一种方法包括响应于触发事件来模拟与远程诊断引擎的互联网协议语音（VoIP）通信; 收集表征模拟VoIP通信的一个或多个方面的度量数据; 并且将包括所述度量数据的诊断分组周期性地发送到所述远程诊断引擎; 其中所述模拟VoIP通信包括向所述远程诊断引擎发送模拟VoIP通信的诊断协议分组; 并拦截从诊断引擎收到的诊断协议数据包。