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335 条记录 (耗时 0.027 秒)

    Method of manufacturing a ceramic electronic part
    32.
    发明授权
    Method of manufacturing a ceramic electronic part 有权
    制造陶瓷电子部件的方法

    公开(公告)号：US06572928B1

    公开(公告)日：2003-06-03

    申请号：US09585961

    申请日：2000-06-02

    申请人： Kazuhiro Yoshida ,  Kenichi Watanabe ,  Junichi Oda

    发明人： Kazuhiro Yoshida ,  Kenichi Watanabe ,  Junichi Oda

    IPC分类号： B05D128

    CPC分类号： H01C17/281 ,  H01G13/006

    摘要： A method of manufacturing a ceramic electronic part having a desired film thickness and external electrodes such that the part is manufactured without projections and depression of the surface thereof, includes applying an electrode paste of a prescribed thickness on the surface of the ceramic element. The electrode paste is applied by rotating a roller with the electrode paste on its peripheral surface, and by moving at least either one of the roller and the ceramic element in a prescribed direction so that the ceramic element moves relative to and tangentially of the roller in the direction opposite to the rotation of the roller with at least a part of the ceramic element dipped in the electrode paste applied on the peripheral surface of the roller.

    摘要翻译： 一种制造具有所需膜厚度的陶瓷电子部件的方法和外部电极，使得该部件被制造而没有其表面的突出和凹陷，包括在陶瓷元件的表面上施加规定厚度的电极浆料。 通过使电极浆料在其周面上旋转的辊子，并且通过沿规定的方向移动辊子和陶瓷元件中的至少一个，使得陶瓷元件相对于和相对于辊子的切向移动来施加电极浆料 与辊的旋转相反的方向，其中陶瓷元件的至少一部分浸入施加在辊的外周表面上的电极浆料中。

    Electronic component
    33.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US06362948B1

    公开(公告)日：2002-03-26

    申请号：US09350065

    申请日：1999-07-08

    申请人： Nobushige Moriwaki ,  Kazuhiro Yoshida ,  Kenichi Watanabe ,  Akio Shobu ,  Osamu Yamaoka ,  Yukio Tanaka

    发明人： Nobushige Moriwaki ,  Kazuhiro Yoshida ,  Kenichi Watanabe ,  Akio Shobu ,  Osamu Yamaoka ,  Yukio Tanaka

    IPC分类号： H01G220

    CPC分类号： H01G4/232 ,  H01G4/228

    摘要： A first metallic terminal plate is joined to a first side-face of an electronic chip formed by lamination of lamination-capacitors as plural electronic elements, and a second terminal plate to the second side-face of the chip. The first and second metallic terminal plates comprises first terminal plate portions joined to the first and second side-faces, respectively, and the second terminal plate portions bent along the lower edges of the first terminal plate portions toward the opposed side-faces, respectively and elongated from the range under the electronic chip to be out of the range in the width direction.

    摘要翻译： 第一金属端子板与通过叠层电容器形成的电子芯片的第一侧面接合，作为多个电子元件，以及第二端子板连接到芯片的第二侧面。 第一和第二金属端子板分别包括接合到第一和第二侧面的第一端子板部分，并且第二端子板部分分别沿着第一端子板部分的下边缘朝着相对的侧面弯曲，并且 从电子芯片下方的范围延伸出宽度方向的范围。

    Power supply device configured to automatically restore power after recovery from a power failure, image forming apparatus, and control method
    36.
    发明授权
    Power supply device configured to automatically restore power after recovery from a power failure, image forming apparatus, and control method 有权

    公开(公告)号：US10778860B2

    公开(公告)日：2020-09-15

    申请号：US16299707

    申请日：2019-03-12

    申请人： Kenichi Watanabe ,  Tomohiro Shuta ,  Yuuya Mori

    发明人： Kenichi Watanabe ,  Tomohiro Shuta ,  Yuuya Mori

    IPC分类号： H04N1/00 ,  G06F1/26

    摘要： A power supply device installed in an electronic apparatus includes a first power supply outputting power upon a plug being connected to a system power supply, a second power supply outputting power upon receiving of a power supply control signal, a third power supply outputting power from a battery, a controller operating using the power from the second power supply and configured to control the electronic apparatus, a flip-flop configured to operate using the power from the third power supply and configured to store, upon activating the electronic apparatus, first logic data or upon shutting down the electronic apparatus, second logic data, and a power supply control switch operating using the power from the first power supply, to output the power supply control signal to the second power supply, in response to activating the electronic apparatus or in response to storing the first logic data in the flip-flop.

    Semiconductor device
    38.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08937007B2

    公开(公告)日：2015-01-20

    申请号：US13398254

    申请日：2012-02-16

    申请人： Kenichi Watanabe ,  Nobuhiro Misawa ,  Satoshi Otsuka

    发明人： Kenichi Watanabe ,  Nobuhiro Misawa ,  Satoshi Otsuka

    IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L21/311 ,  H01L23/00 ,  H01L23/31

    CPC分类号： H01L23/562 ,  H01L23/3192 ,  H01L23/564 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/05567 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2224/05552

    摘要： A method of manufacturing a semiconductor device, including: forming a moisture resistant ring surrounding a multilayer interconnection structure in a layered body formed of stacked layers of a plurality of interlayer insulating films lower in dielectric constant than a SiO2 film and including the multilayer interconnection structure; forming a groove in the layered body between the moisture resistant ring and a scribe line, the groove reaching a surface of a semiconductor substrate; forming a film including Si and C as principal components and covering sidewall surfaces and a bottom surface of the groove; and forming a protection film on the film along the sidewall surfaces and the bottom surface of the groove.

    摘要翻译： 一种制造半导体器件的方法，包括：在由SiO 2膜介电常数低于介电常数的多个层间绝缘膜的叠层形成的层叠体中形成包围多层互连结构的防潮环，并且包括所述多层互连结构; 在所述层叠体之间在所述防潮环和划线之间形成凹槽，所述凹槽到达半导体衬底的表面; 形成包括Si和C作为主要成分并覆盖所述槽的侧壁表面和底表面的膜; 以及沿着所述凹槽的侧壁表面和所述底表面在所述膜上形成保护膜。

    Control circuit board, control system, and copying method
    39.
    发明授权
    Control circuit board, control system, and copying method 有权
    控制电路板，控制系统和复印方法

    公开(公告)号：US08861245B2

    公开(公告)日：2014-10-14

    申请号：US13804948

    申请日：2013-03-14

    申请人： Kenichi Watanabe

    发明人： Kenichi Watanabe

    IPC分类号： G11C5/06 ,  G06F13/00

    CPC分类号： G11C5/06 ,  G06F13/00 ,  G06F13/1668

    摘要： A control circuit board includes a first storage unit configured to store therein predetermined data; a connecting unit configured to be connected to another control circuit board including a second storage unit; a switching unit configured to switch between a first state and a second state, the first state being a state in which data read from the first storage unit is enabled but data read from the second storage unit is disabled, the second state being a state in which data read from the first storage unit is disabled but data read from the second storage unit is enabled; and a storage control unit configured to write or read data to or from the first storage unit in the first state, and perform a copying operation that reads the data from the second storage unit and stores the read data in the first storage unit in the second state.

    摘要翻译： 控制电路板包括配置成在其中存储预定数据的第一存储单元; 连接单元，被配置为连接到包括第二存储单元的另一个控制电路板; 切换单元，被配置为在第一状态和第二状态之间切换，所述第一状态是其中从所述第一存储单元读取的数据被使能但从所述第二存储单元读取的数据被禁用的状态，所述第二状态是 从第一存储单元读取的数据被禁用，但是从第二存储单元读取的数据被使能; 以及存储控制单元，被配置为在所述第一状态下向所述第一存储单元写入数据或从所述第一存储单元读取数据，并执行从所述第二存储单元读取所述数据的复制操作，并将所读取的数据存储在所述第一存储单元中 州。

    Facsimile control apparatus
    40.
    发明授权
    Facsimile control apparatus 有权
    传真控制装置

    公开(公告)号：US08842309B2

    公开(公告)日：2014-09-23

    申请号：US13410890

    申请日：2012-03-02

    申请人： Kenichi Watanabe

    发明人： Kenichi Watanabe

    IPC分类号： G06K15/00 ,  H04N1/327 ,  H04N1/00

    CPC分类号： H04N1/00891 ,  H04N1/32793 ,  H04N2201/0093

    摘要： A facsimile control apparatus includes a main control unit configured so that power supply to the main control unit is shut off while the facsimile control apparatus is in an energy-saving mode; a first switching unit configured to switch the power supply to the main control unit on/off; and a detection circuit configured to output a switch control signal for turning the first switching unit on when detecting an input signal input from a public network.

    摘要翻译： 一种传真控制装置，包括：主控制单元，其构造成在所述传真控制装置处于节能模式时关闭所述主控制单元的电力供应; 第一切换单元，被配置为开/关的主控制单元的电源; 以及检测电路，被配置为当检测到从公共网络输入的输入信号时，输出用于使所述第一开关单元接通的开关控制信号。