公开(公告)号：US20190037155A1

公开(公告)日：2019-01-31

申请号：US16152629

申请日：2018-10-05

Applicant: OLYMPUS CORPORATION

Inventor： Takanori TANAKA ,  Masashi SAITO ,  Takatoshi IGARASHI ,  Satoru ADACHI ,  Katsumi HOSOGAI ,  Nana AKAHANE

IPC: H04N5/345 ,  H04N5/369 ,  H04N5/378 ,  H04N5/376 ,  A61B1/05 ,  A61B1/00 ,  A61B1/045 ,  H01L27/146

CPC classification number: H04N5/3452 ,  A61B1/00009 ,  A61B1/04 ,  A61B1/045 ,  A61B1/05 ,  G02B23/24 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H04N5/369 ,  H04N5/3696 ,  H04N5/3698 ,  H04N5/3765 ,  H04N5/378

Abstract: An imaging element includes: a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals; a transmission chip where at least a power source unit and a transmission unit are arranged; plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit; and plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip. The transmission chip is layered and connected at a back surface side of the pixel chip. The capacitative chips are layered and connected at a back surface side of the transmission chip. The connecting portions are arranged so as to overlap one another.

公开(公告)号：US20160206186A1

公开(公告)日：2016-07-21

申请号：US15082016

申请日：2016-03-28

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI

IPC: A61B1/05

CPC classification number: A61B1/051 ,  A61B1/0008 ,  A61B1/00114

Abstract: An imaging module includes: an image sensor; a substrate having a conductor layer and extending from the image sensor; a multi-layer substrate having therein conductor layers on the substrate; electronic components mounted on/in the multi-layer substrate; an image signal electrode pad and a drive signal electrode pad on the image sensor; an image signal cable; a drive signal cable; an image signal wiring pattern through which an image signal is transmitted from the image signal electrode pad to the image signal cable; and a drive signal wiring pattern through which a drive signal is transmitted from the drive signal cable to the drive signal electrode pad. At least one of the electronic components is embedded inside the multi-layer substrate. The image signal wiring pattern and the drive signal wiring pattern are separated into different conductor layers of the substrate and the multi-layer substrate due to the embedded electronic component.

Abstract translation: 成像模块包括：图像传感器; 具有导体层并从图像传感器延伸的基板; 在基板上具有导体层的多层基板; 安装在多层基板上的电子部件; 图像信号电极焊盘和图像传感器上的驱动信号电极焊盘; 图像信号电缆; 驱动信号电缆; 图像信号布线图案，图像信号通过图像信号从图像信号电极焊盘传输到图像信号电缆; 以及驱动信号布线图案，通过该驱动信号布线图案，驱动信号从驱动信号电缆传输到驱动信号电极焊盘。 电子部件中的至少一个嵌入在多层基板的内部。 图像信号布线图案和驱动信号布线图案由于嵌入的电子部件而被分离成基板和多层基板的不同的导体层。

公开(公告)号：US20160054559A1

公开(公告)日：2016-02-25

申请号：US14931070

申请日：2015-11-03

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI

IPC: G02B23/24 ,  H04N13/02 ,  H04N5/225

CPC classification number: G02B23/2484 ,  A61B1/051 ,  G02B23/2476 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/0271 ,  H05K1/115

Abstract: An imaging unit includes: a solid state image sensor configured to receive light and perform photoelectric conversion on the light to generate an electric signal; a substrate extending from the solid state image sensor in an optical axis direction of the solid state image sensor; and a multi-layer substrate formed on a surface of the substrate, the multi-layer substrate having a plurality of electronic components mounted thereon and having a plurality of conductor layers and a plurality of via holes formed therein. At least one of the plurality of electronic components is embedded inside the multi-layer substrate. The plurality of via holes is formed on an outer side of the at least one of the plurality of electronic components embedded inside the multi-layer substrate along an optical axis direction of the multi-layer substrate.

Abstract translation: 成像单元包括：固态图像传感器，被配置为接收光并对光进行光电转换以产生电信号; 从固态图像传感器沿固体图像传感器的光轴方向延伸的基板; 以及形成在所述基板的表面上的多层基板，所述多层基板具有安装在其上的多个电子部件，并且具有形成在其中的多个导体层和多个通孔。 多个电子部件中的至少一个嵌入在多层基板的内部。 多个通孔形成在沿着多层基板的光轴方向嵌入在多层基板内的多个电子部件中的至少一个电子部件的外侧。

公开(公告)号：US20150190040A1

公开(公告)日：2015-07-09

申请号：US14666699

申请日：2015-03-24

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Noriyuki FUJIMORI

IPC: A61B1/05 ,  H01L31/0203 ,  H01L27/146

CPC classification number: A61B1/051 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/13

Abstract: An image pickup apparatus includes a substrate, on a first surface of which a light receiving section and a peripheral circuit section are formed, a multilayer wiring layer stacked on the first surface and including a plurality of metal layers and insulating layers, a translucent cover located on the multilayer wiring layer, and a side surface sealing member which extends from a peripheral section of a surface in the translucent cover to the substrate side while having a frame shape, and protects outer peripheral side surfaces of the multilayer wiring layer.

Abstract translation: 一种图像拾取装置，包括在其第一表面上形成有光接收部分和外围电路部分的基板，堆叠在第一表面上并包括多个金属层和绝缘层的多层布线层，位于 在多层布线层以及从透光性盖的表面的周边部分延伸到基板侧同时具有框架形状的侧表面密封件，并且保护多层布线层的外周侧表面。

公开(公告)号：US20150085169A1

公开(公告)日：2015-03-26

申请号：US14557271

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Kazuhiro YOSHIDA

IPC: H04N5/335 ,  H04N5/225

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，其特征在于，包括以下步骤：切割摄像芯片基板，在每个所述光接收部分周围形成电极焊盘，制作摄像芯片; 将作为无缺陷产品确定的图像拾取芯片接合到玻璃晶片以制造接合晶片的工艺; 在接合晶片上的图像拾取芯片之间填充密封构件的过程; 一种加工工艺，其包括使连接的晶片的厚度变薄以使加工表面变平且形成通孔互连，每个连接到每个电极焊盘; 形成多个外部连接电极的过程，每个外部连接电极通过每个通孔互连连接到每个电极焊盘; 以及切割接合的晶片的过程。

公开(公告)号：US20140180040A1

公开(公告)日：2014-06-26

申请号：US14191677

申请日：2014-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Yukiharu MAKINO

IPC: A61B1/04

CPC classification number: A61B1/041 ,  A61B1/00016 ,  A61B1/051 ,  A61B5/073 ,  A61B5/6861 ,  A61B2562/162

Abstract: In a capsule endoscope, on an inside of a capsule type housing including a cylindrical main body section and two semispherical end cover sections and having a rotationally symmetrical shape with respect to a center axis of the housing, an image pickup board section, a transmission board section, and a reception board section are housed such that principal planes of the image pickup board section, the transmission board section, and the reception board section are orthogonal to the center axis. A coil wire of at least one of a transmission coil formed by a transmission coil wire and a reception coil formed by a reception coil wire, respective principal planes of which are orthogonal to the center axis, is disposed on the end cover section side of the housing.

Abstract translation: 在胶囊型内窥镜中，在包括圆筒形主体部和两个半球形端盖部的胶囊型壳体的内侧，相对于壳体的中心轴线具有旋转对称的形状，摄像板部，传输板 并且容纳接收板部分，使得图像拾取板部分，传输板部分和接收板部分的主平面与中心轴线正交。 由传输线圈线形成的传输线圈和由接收线圈线形成的接收线圈中的至少一个的线圈线，其主体平面垂直于中心轴线，被布置在 住房。

公开(公告)号：US20140180005A1

公开(公告)日：2014-06-26

申请号：US14191543

申请日：2014-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Yukiharu MAKINO ,  Noriyuki FUJIMORI

IPC: A61B1/04

CPC classification number: A61B1/041 ,  A61B1/00006 ,  A61B1/00016 ,  A61B1/00181 ,  A61B1/05

Abstract: In a capsule endoscope, inside a housing, a plurality of connecting sections of a circuit board formed by arranging a plurality of board sections to one another in a row via the connecting sections are bent at 180 degrees and the plurality of board sections are arranged such that principal planes of the respective board sections are orthogonal to a center axis of the housing. The capsule endoscope includes two transducer sections, a first image pickup chip connected to the transducer section via two signal lines and configured to generate a clock signal and acquire first image data according to the generated clock signal, a second image pickup chip configured to acquire second image data according to the clock signal transmitted by one signal line from the first image pickup chip, and a transmitting section configured to transmit the first image data and the second image data by radio.

Abstract translation: 在胶囊型内窥镜中，在壳体内部，通过连接部将多个基板部彼此排成一列形成的电路基板的多个连接部弯曲成180度，多个基板部分配置成 相应板部分的主平面垂直于壳体的中心轴线。 胶囊型内窥镜包括两个换能器部，第一图像拾取芯片，经由两个信号线连接到换能器部，并且被配置为产生时钟信号，并根据生成的时钟信号获取第一图像数据;第二图像拾取芯片，被配置为获取第二图像拾取芯片 根据由一个信号线从第一图像拾取芯片发送的时钟信号的图像数据，以及被配置为通过无线电发送第一图像数据和第二图像数据的发送部。

公开(公告)号：US20220417401A1

公开(公告)日：2022-12-29

申请号：US17897539

申请日：2022-08-29

Applicant: OLYMPUS CORPORATION

Inventor： Keiichi KOBAYASHI ,  Takatoshi IGARASHI

IPC: H04N5/225 ,  G02B23/24 ,  H01L27/146

Abstract: An endoscope comprising: an objective optical system; an imager having a light receiving plane that faces an emitting plane of the objective optical system; a semiconductor device provided so as to face a plane, of the imager, opposite to the light receiving plane; and a conductive member that covers the objective optical system, the imager, and the semiconductor device, the conductive member having an external dimension that is identical between a side of the objective optical system and a side of the imager. A distance from an end portion of the semiconductor device in a direction orthogonal to an optical axis of the objective optical system to an inner wall of the conductive member is shorter than a distance from an end portion of the imager in the direction orthogonal to the optical axis of the objective optical system to the inner wall of the conductive member.

公开(公告)号：US20220079428A1

公开(公告)日：2022-03-17

申请号：US17534861

申请日：2021-11-24

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI

IPC: A61B1/05 ,  A61B1/00 ,  H04N5/225

Abstract: An image pickup module includes an image pickup device having a light receiving circuit, a prism arranged on the light receiving circuit and configured to bend incident light to guide the incident light to the light receiving circuit, a stacked device that includes a plurality of semiconductor devices each having a through wiring and bonded to each other by solder, and is arranged around the light receiving circuit of the image pickup device, a resin layer stacked on an uppermost semiconductor device of the plurality of semiconductor devices of the stacked device, and a plurality of cables connected to the stacked device and having a connection portion with the stacked device covered with the resin layer.

公开(公告)号：US20200344386A1

公开(公告)日：2020-10-29

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takatoshi IGARASHI ,  Takuro SUYAMA ,  Kazuhiro YOSHIDA ,  Kensuke SUGA

IPC: H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.