公开(公告)号：US10542226B2

公开(公告)日：2020-01-21

申请号：US16152629

申请日：2018-10-05

Applicant: OLYMPUS CORPORATION

Inventor： Takanori Tanaka ,  Masashi Saito ,  Takatoshi Igarashi ,  Satoru Adachi ,  Katsumi Hosogai ,  Nana Akahane

IPC: H04N5/345 ,  H04N5/369 ,  H04N5/378 ,  A61B1/00 ,  A61B1/045 ,  A61B1/05 ,  H01L27/146 ,  H04N5/376

Abstract: An imaging element includes: a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals; a transmission chip where at least a power source unit and a transmission unit are arranged; plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit; and plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip. The transmission chip is layered and connected at a back surface side of the pixel chip. The capacitative chips are layered and connected at a back surface side of the transmission chip. The connecting portions are arranged so as to overlap one another.

公开(公告)号：US10456022B2

公开(公告)日：2019-10-29

申请号：US15939740

申请日：2018-03-29

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Makoto Ono ,  Masashi Saito ,  Satoru Adachi ,  Nana Akahane ,  Takanori Tanaka ,  Katsumi Hosogai

IPC: A61B1/05 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01L27/14 ,  H01L27/146 ,  H04N5/378 ,  A61B1/00 ,  A61B1/045 ,  A61B1/06 ,  H01L21/66 ,  H04N5/345 ,  H04N5/376 ,  H04N7/10 ,  H04N5/225 ,  H04N5/232 ,  H04N5/369

Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.

公开(公告)号：US10249672B2

公开(公告)日：2019-04-02

申请号：US14556831

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori ,  Takatoshi Igarashi ,  Kazuhiro Yoshida

IPC: H01L27/146 ,  H01L25/04 ,  H01L23/31 ,  H01L23/00 ,  H04N5/369

Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.

公开(公告)号：US09240398B2

公开(公告)日：2016-01-19

申请号：US14557157

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori ,  Takatoshi Igarashi ,  Kazuhiro Yoshida

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L27/146 ,  H01L21/78 ,  H01L21/66 ,  H01L21/786 ,  H01L23/31

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L21/786 ,  H01L22/10 ,  H01L22/20 ,  H01L23/3121 ,  H01L27/14618 ,  H01L27/14638 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，包括以下处理：切割图像拾取芯片基板以制造多个图像拾取芯片; 通过透明粘合剂层将图像拾取芯片接合到玻璃晶片，以及将虚拟芯片接合到不结合图像拾取芯片的玻璃晶片的外周区域以制造接合的晶片; 在图像拾取芯片和虚拟芯片之间填充密封构件; 加工接合的晶片以使厚度变薄; 并切割接合的晶片。

公开(公告)号：US20150333037A1

公开(公告)日：2015-11-19

申请号：US14808054

申请日：2015-07-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida ,  Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: H01L25/04 ,  H01L25/00

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member made of a BCB resin or polyimide; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 用BCB树脂或聚酰亚胺制成的密封件填充多个图像拾取芯片之间的间隙的过程; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。