Abstract:
An image sensor read out circuit includes a first current mirror circuit in which a second current conducted through a second current path is controlled in response to a first current conducted through the first current path. The second current is conducted through an amplifier transistor of a pixel circuit. A first current source is coupled to the first current path to provide a substantially constant current component of the first current. A second current source is coupled to a power supply rail of the pixel circuit and coupled to the first current path to provide a ripple current component of the first current. The ripple current component provided by the second current source is responsive to a ripple in the power supply rail. The first current is responsive to a sum of the currents from the first and second current sources.
Abstract:
An integrated circuit system includes a first device wafer bonded to a second device wafer at a bonding interface of dielectrics. Each wafer includes a plurality of dies, where each die includes a device, a metal stack, and a seal ring that is formed at an edge region of the die. Seal rings included in dies of the second device wafer each include a first conductive path provided with metal formed in a first opening that extends from a backside of the second device wafer, through the second device wafer, and through the bonding interface to the seal ring of a corresponding die in the first device wafer.
Abstract:
A CMOS pixel array is introduced into a dark environment to acquire video image frames. During a first frame, each row of pixels is sequentially reset, one row at a time, and then each row of pixels is sequentially read out, one row at a time. During a second frame, each row of pixels is sequentially reset, one row at a time, and then each row of pixels sequentially read out, one row at a time. A light source illuminates the dark environment during a vertical blanking period between the reading of the last row during the first frame and the reading of the first row during the second frame. The light source does not illuminate the dark environment between reading the first and last rows during the first frame nor between reading the first and last rows during the second frame.
Abstract:
An example imaging sensor system includes a backside-illuminated CMOS imaging array formed in a first semiconductor layer of a first wafer. The CMOS imaging array includes an N number of pixels, where each pixel includes a photodiode region. The first wafer is bonded to a second wafer at a bonding interface between a first metal stack of the first wafer and a second metal stack of the second wafer. A storage device is disposed in a second semiconductor layer of the second wafer. The storage device includes at least N number of storage cells, where each of the N number of storage cells are configured to store a signal representative of image charge accumulated by a respective photodiode region. Each storage cell includes a circuit element that is sensitive to light-induced leakage.
Abstract:
A method of counting photons using a plurality of single photon avalanche diodes (SPADs), including initiating a detection phase, enabling each single photon avalanche diode (SPAD) of the plurality of SPADs for a period of time within the detection phase, accumulating a SPAD event from each SPAD of the plurality of SPADs, wherein each SPAD event corresponds to a detection of a single photon, determining a counter code at an end of the detection phase, where the counter code corresponds to accumulated SPAD events, and enabling one or more SPADs of the plurality of SPADs within an exposure phase based on the counter code, where the counter code is greater than an expected number of the SPAD events during the exposure phase, and where the expected number of SPAD events during the exposure phase is based on the counter code that is determined at the end of the detection phase.
Abstract:
A switch driver circuit includes a plurality of pullup transistors. The plurality of pullup transistors includes a first pullup transistor coupled between a voltage supply and a first output node. A plurality of pulldown transistors includes a first pulldown transistor coupled between the first output node and a ground node. A slope control circuit is coupled to the ground node. A plurality of global connection switches includes a first global connection switch coupled between the first output node and the slope control circuit.
Abstract:
An image sensor includes a source follower coupled to a photodiode to generate an image signal responsive to photogenerated charge. The image signal is received by image readout circuitry through a row select transistor. A reset transistor resets the photogenerated charge. A first node of mode select circuit is coupled to the reset transistor, a second node is coupled to a pixel supply voltage, and a third node is coupled to an event driven circuit. The mode select circuit couples the first node to the second node during an imaging mode to supply the pixel supply voltage to the reset transistor. The mode select circuit is further configured to couple the first node to the third node during an event driven mode to couple a photocurrent of the photodiode to drive the event driven circuit through the reset transistor to detect changes in the photocurrent.
Abstract:
A switch driver circuit includes a first transistor coupled between a voltage supply and a first output node. A second transistor is coupled between the first output node and a first discharge node. A first slope control circuit is coupled to the first discharge node to discharge the first discharge node at a first slope. A third transistor is coupled between the voltage supply and a second output node. A fourth transistor is coupled between the second output node and a second discharge node. A second slope control circuit coupled to the second discharge node to discharge the second discharge node at a second slope. The first and second slopes are mismatched.
Abstract:
A pixel array includes pixel cells disposed in semiconductor material. Each of the pixel cells includes photodiodes, and a floating diffusion to receive image charge from the photodiodes. A source follower is coupled to the floating diffusion to generate an image signal in response image charge from the photodiodes. Drain regions of first and second row select transistors are coupled to a source of the source follower. A common junction is disposed in the semiconductor material between gates of the first and second row select transistors such that the drains of the first and second row select transistors are shared and coupled together through the semiconductor material of the common junction. The pixel cells are organized into a rows and columns with bitlines.
Abstract:
A readout circuit for use in an image sensor includes a first sample and hold (SH) circuit coupled to a bitline that is coupled to a pixel array. A second SH circuit is coupled to the bitline. A bypass switch is coupled to the bitline, the first SH circuit, and the second SH circuit. An analog to digital converter (ADC) is coupled to the bypass switch. The bypass switch is configured to provide an image charge value from the pixel array to the ADC through the bitline, or through one of the first SH circuit or the second SH circuit in response to a switch select signal.