公开(公告)号：US10308504B2

公开(公告)日：2019-06-04

申请号：US15476843

申请日：2017-03-31

Applicant: Palo Alto Research Center Incorporated

Inventor： Jeng Ping Lu ,  Eugene M. Chow ,  David K. Biegelsen ,  Sourobh Raychaudhuri

IPC: H01L21/06 ,  B81C1/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L21/027 ,  H01L29/06

Abstract: A method of manufacturing and using micro assembler systems are described. A method of manufacturing includes disposing a first plurality of electrodes above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The method further includes disposing a second plurality of electrodes above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing. A method of using micro assembler systems includes disposing a mobile particle at least partially submersed in an assembly medium above a substrate, a first plurality of electrodes and a second plurality of electrodes. The method further includes conducting a field through individual electrodes of the first plurality of electrodes and the second plurality of electrodes to generate electrophoretic forces or dielectrophoretic forces on the mobile particle.

公开(公告)号：US10018969B2

公开(公告)日：2018-07-10

申请号：US15380449

申请日：2016-12-15

Applicant: Palo Alto Research Center Incorporated

Inventor： Ramkumar Abhishek ,  Sourobh Raychaudhuri ,  Ashish Pattekar

IPC: G04F1/00 ,  A61M5/31 ,  A61J7/04 ,  B65D75/36 ,  B65D75/54 ,  B65D1/02 ,  B65D25/20

CPC classification number: G04F1/00 ,  A61J7/0409 ,  A61J7/0427 ,  A61J2200/70 ,  A61M5/31 ,  A61M2205/584 ,  B65D1/02 ,  B65D25/205 ,  B65D75/367 ,  B65D75/54 ,  G01N31/229 ,  G04F7/00

Abstract: An elapsed timer device includes a timer element comprising a timer chamber, a timer chamber conditioning material disposed within the timer chamber, and a sensor arranged to sense a timer chemical within the timer chamber. The sensor indicates elapsed time in response to a threshold level of the chemical being present within the timer chamber. The timer chamber, timer chemical adsorption/desorption characteristics of the timer chamber conditioning material, and the sensor are configured so that an amount of the timer chemical within the timer chamber reaches the threshold level within a predetermined time after initialization of the timer element.

公开(公告)号：US11984701B2

公开(公告)日：2024-05-14

申请号：US17408745

申请日：2021-08-23

Applicant: Palo Alto Research Center Incorporated

Inventor： Joerg Martini ,  Sourobh Raychaudhuri ,  Christopher Chua ,  David K. Biegelsen ,  Joseph Lee

IPC: H01S5/042 ,  B41J2/44 ,  B41J2/45 ,  B41J2/455 ,  H01S5/40 ,  H01S5/42

CPC classification number: H01S5/04256 ,  B41J2/442 ,  B41J2/45 ,  B41J2/455 ,  H01S5/042 ,  H01S5/4025 ,  H01S5/423

Abstract: A computer adapted to convert images into raw data can provide the raw data to a control interface adapted to transmit the raw data with timing information to an electronic driver circuit. The electronic driver circuit can convert the raw data with the timing information provided by a control interface into regulated current signals provided to the semiconductor laser array at 300 dpi and higher. The semiconductor array can convert the current signals into light to illuminate an imaging member. The laser array can comprise vertical cavity surface emitting lasers providing imaging greater than 300 dpi. Each semiconductor laser can operate at 50 mW or greater.

公开(公告)号：US11827037B2

公开(公告)日：2023-11-28

申请号：US17408814

申请日：2021-08-23

Applicant: Palo Alto Research Center Incorporated

Inventor： Joerg Martini ,  Christopher Chua ,  Zhihong Yang ,  Mark Teepe ,  Patrick Y. Maeda ,  Sourobh Raychaudhuri ,  Elif Karatay ,  Noble M. Johnson ,  David K. Biegelsen ,  Joseph Lee

IPC: H01S5/042 ,  H01S5/40 ,  H01S5/42 ,  H01S5/183 ,  B41J2/44 ,  B41J2/45 ,  B41J2/455 ,  B41J2/47 ,  G02B19/00

CPC classification number: B41J2/455 ,  B41J2/442 ,  B41J2/47 ,  G02B19/0014 ,  G02B19/0057 ,  H01S5/042 ,  H01S5/18394 ,  H01S5/4025 ,  H01S5/423

Abstract: A laser imager for a printing system, comprising a plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated control channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers, and optical elements arranged in a linear lens array configured to capture and focus light from the plurality of independently addressable surface emitting lasers onto a imaging member, wherein the plurality of independently addressable surface emitting lasers arranged in a linear array and the optical elements arranged in a linear lens array operate together to image the imaging member.

公开(公告)号：US11673800B2

公开(公告)日：2023-06-13

申请号：US17591493

申请日：2022-02-02

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Bradley Rupp ,  Jengping Lu ,  Julie A. Bert ,  Lara S. Crawford ,  Sourobh Raychaudhuri ,  Eugene M. Chow ,  Matthew Shreve ,  Sergey Butylkov

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00

CPC classification number: B81C99/002 ,  H01L21/67271 ,  H01L21/67294 ,  H01L24/95 ,  H01L2224/95133 ,  H01L2224/95145 ,  H01L2924/1461 ,  Y10T29/49131 ,  Y10T29/5313

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

公开(公告)号：US20230055149A1

公开(公告)日：2023-02-23

申请号：US17408814

申请日：2021-08-23

Applicant: Palo Alto Research Center Incorporated

Inventor： Joerg Martini ,  Christopher Chua ,  Zhihong Yang ,  Mark Teepe ,  Patrick Y. Maeda ,  Sourobh Raychaudhuri ,  Elif Karatay ,  Noble M. Johnson ,  David K. Biegelsen ,  Joseph Lee

IPC: B41J2/47 ,  B41J2/455

Abstract: A laser imager for a printing system, comprising a plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated control channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers, and optical elements arranged in a linear lens array configured to capture and focus light from the plurality of independently addressable surface emitting lasers onto a imaging member, wherein the plurality of independently addressable surface emitting lasers arranged in a linear array and the optical elements arranged in a linear lens array operate together to image the imaging member.

公开(公告)号：US11440307B2

公开(公告)日：2022-09-13

申请号：US17171286

申请日：2021-02-09

Applicant: Palo Alto Research Center Incorporated

Inventor： JengPing Lu ,  Eugene M. Chow ,  Sourobh Raychaudhuri

IPC: B32B37/00 ,  B32B37/10 ,  B32B38/04 ,  B32B38/18 ,  H01L21/677

Abstract: Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.

公开(公告)号：US11348905B2

公开(公告)日：2022-05-31

申请号：US16805911

申请日：2020-03-02

Applicant: Palo Alto Research Center Incorporated

Inventor： Yunda Wang ,  Jengping Lu ,  Qian Wang ,  Sourobh Raychaudhuri

IPC: H01L21/66 ,  G01R31/26 ,  H01L25/075 ,  H01L25/16 ,  H01L33/00

Abstract: MicroLED chips are transferred from an epitaxy wafer to a first coupon substrate. The first coupon substrate has a first, soft adhesive layer that temporarily holds the microLED chips. Using a first transfer substrate, a subset of the microLED chips are transferred from the first coupon substrate to a second coupon substrate having a second, soft adhesive layer. A pattern of microLED chips are transferred from another substrate to the second coupon substrate via a second transfer substrate to fill vacancies in the subset of microLED chips. The transfer substrates are operable to hold and release pluralities of micro objects.

公开(公告)号：US20220153575A1

公开(公告)日：2022-05-19

申请号：US17591493

申请日：2022-02-02

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Bradley Rupp ,  Jengping Lu ,  Julie A. Bert ,  Lara S. Crawford ,  Sourobh Raychaudhuri ,  Eugene M. Chow ,  Matthew Shreve ,  Sergey Butylkov

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

公开(公告)号：US10926521B2

公开(公告)日：2021-02-23

申请号：US16235251

申请日：2018-12-28

Applicant: Palo Alto Research Center Incorporated

Inventor： JengPing Lu ,  Eugene M. Chow ,  Sourobh Raychaudhuri

IPC: B32B37/00 ,  B32B37/10 ,  B32B38/04 ,  B32B38/18 ,  H01L21/677

Abstract: Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers in parallel to a target substrate.