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公开(公告)号：US20210102975A1
公开(公告)日：2021-04-08
申请号：US17029979
申请日：2020-09-23
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Proposed is a probe card for performing a circuit test on a wafer and, more particularly, a probe card capable of realizing a reduction in size and pitch of probe insertion holes.
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公开(公告)号：US20210043797A1
公开(公告)日：2021-02-11
申请号：US16534699
申请日：2019-08-07
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: H01L33/00 , H01L25/075 , H01L33/48 , H01L27/15
Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.
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公开(公告)号：US20210013259A1
公开(公告)日：2021-01-14
申请号：US16921564
申请日：2020-07-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.
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公开(公告)号：US20200271693A1
公开(公告)日：2020-08-27
申请号：US16794147
申请日：2020-02-18
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01R1/073
Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.
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公开(公告)号：US20200083412A1
公开(公告)日：2020-03-12
申请号：US16563529
申请日：2019-09-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.
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Patent Agency Ranking
公开(公告)号：US20190308332A1
公开(公告)日：2019-10-10
申请号：US16377083
申请日：2019-04-05
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN , Tae Hwan SONG
Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.
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公开(公告)号：US20190304818A1
公开(公告)日：2019-10-03
申请号：US16370810
申请日：2019-03-29
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.
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公开(公告)号：US20190064094A1
公开(公告)日：2019-02-28
申请号：US16112554
申请日：2018-08-24
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01N27/12 , G01N27/30 , G01N27/406
Abstract: The present invention relates to a gas sensor that measures the concentration of gas through a sensing membrane and a gas sensor package having the same and, more particularly, to a gas sensor and a gas sensor package having the same that can ensure high thermal efficiency and uniform heat transfer to make it possible to be sufficiently heated with low power consumption and to precisely measure gas concentration.
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公开(公告)号：US20170338383A1
公开(公告)日：2017-11-23
申请号：US15468717
申请日：2017-03-24
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
CPC classification number: H01L33/486 , H01L21/481 , H01L21/4846 , H01L23/00 , H01L23/498 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/81385 , H01L2224/83385 , H01L2224/83439 , H01L2224/85439 , H01L2933/0033 , H01L2933/0066
Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.
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公开(公告)号：US20250020690A1
公开(公告)日：2025-01-16
申请号：US18764351
申请日：2024-07-04
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01R1/067
Abstract: A guide member, an inspection device, and an electro-conductive contact pin for improving inspection reliability with respect to an inspection object are proposed.
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