摘要:
In an NMOS active clamp device and an NMOS active clamp array with multiple source and drain contacts, the robustness against ESD events is increased by reducing channel resistance through the inclusion of one or more p+ regions formed at least partially in the source and electrically connected to the one or more source contacts.
摘要:
In a dual direction ESD protection structure, first and second NMOS devices are serially connected back-to-back by connecting their drains or their sources using a common floating interconnect, while ensuring that the devices remain isolated from each other.
摘要:
An NLDMOS SCR device based on an LDMOS fabrication process includes a dual gate to provide controllable switching characteristics to allow it to be used for ESD protection of fast switching voltage regulators.
摘要:
A diode for alternating current (DIAC) electrostatic discharge (ESD) protection circuit is formed in a silicon germanium (SiGe) hetrojunction bipolar transistor (HBT) process that utilizes a very thin collector region. ESD protection for a pair of to-be-protected pads is provided by utilizing the base structures and the emitter structures of the SiGe transistors.
摘要:
A MOS transistor and subsurface collectors can be formed by using a hard mask and precisely varying the implant angle, rotation, dose, and energy. In this case, a particular atomic species can be placed volumetrically in a required location under the hard mask. The dopant can be implanted to form sub-silicon volumes of arbitrary shapes, such as pipes, volumes, hemispheres, and interconnects.
摘要:
In an ESD protection structure, dual direction ESD protection is provided by forming an n-well isolation ring around an NMOS device so that the p-well in which the NMOS drain is formed is isolated from the underlying p-substrate by the n-well isolation ring. By forming the n-well isolation ring the p-n-p-n structure of an embedded SCR for reverse ESD protection is provided. The width of the n-well isolation ring and its spacing from the NMOS drain are adjusted to provide the desired SCR parameters.
摘要:
The integration period of an imaging cell, or the time that an imaging cell is exposed to light energy, is substantially increased by utilizing a single-poly, electrically-programmable, read-only-memory (EPROM) structure to capture the light energy. Photogenerated electrons are formed in the channel region of the EPROM structure from the light energy. The photogenerated electrons are then accelerated into having ionizing collisions which, in turn, leads to electrons being injected onto the floating gate of the EPROM structure at a rate that is proportionate to the number of photons captured by the channel region.
摘要:
An integrated circuit is powered by exposing conductive regions, such as the p+ source regions of the PMOS transistors that are formed to receive a supply voltage, to light energy from a light source. The conductive regions function as photodiodes that produce voltages on the conductive regions via the photovoltaic effect.
摘要:
NVM cell for storing three levels of charge: one erased and two programmed states. The cell comprises a transistor structure providing a gate current versus gate voltage curve having a shape with a flat region or a second peak. To provide such a structure, one embodiment combines two parallel transistors having different threshold voltages, and another embodiment uses one transistor with variable doping. The gate current curve provides two programming zones. Programming the first state includes applying a voltage across a channel, ramping up a gate voltage in the first programming zone, followed by ramping it back down. Programming the second state comprises applying a voltage across a channel, ramping up a gate voltage past the first programming zone and into the second programming zone, followed by ramping it back down. Ramping the voltage back down may optionally be preceded by turning off the voltage across the channel.
摘要:
A linear time-driver circuit is provided that consumes low space on-chip. The time-driver circuit is based upon the small capacitor charge of the merged region of a 5V tolerant cascaded NMOS device, a single gate device and a zener diode.