摘要:
When an operational mode is shifted to a standby mode, a first transistor is brought into a conduction state by a control signal, and a word line is thereby clamped to a ground voltage. Further, a second transistor is brought into a non-conduction state, and supply of an internal power supply voltage to a word line driver is shut off. Subsequently, the supply of the internal power supply voltage is halted for saving electrical power. When the operational mode returns to a normal mode, the supply of the internal power supply voltage is started, and subsequently, the first transistor is brought into the non-conduction state by the control signal, and the second transistor is thereby brought into the conduction state.
摘要:
In an SRAM according to the present invention, an internal power supply voltage for a memory cell is applied to a back gate of each of P-channel MOS transistors included in an equalizer, a write driver, and a column select gate. Therefore, even if an internal power supply voltage for a peripheral circuit is shut off to reduce current consumption during standby, a threshold voltage of each of the P-channel MOS transistors is maintained at a high level, and hence a leakage current is small.
摘要:
In an SRAM according to the present invention, an internal power supply voltage for a memory cell is applied to a back gate of each of P-channel MOS transistors included in an equalizer, a write driver, and a column select gate. Therefore, even if an internal power supply voltage for a peripheral circuit is shut off to reduce current consumption during standby, a threshold voltage of each of the P-channel MOS transistors is maintained at a high level, and hence a leakage current is small.
摘要:
In a SRAM cell including a bipolar transistor and a cut transistor, the threshold Vtheff (Driver) of driver transistor and the threshold Vtheff (Cut) of cut transistor are set such that they satisfy the expressions,Vtheff(Driver).gtoreq.�{log(1 .mu.A)}-{log(Vcc/10R)}!.times.S(1)�{log(1 .mu.A)}-{log((Ie.times.(1/(hFE+1)))/10)}!.times.S.ltoreq.Vtheff(Cut).ltoreq.�{log(1 .mu.A)}-{log(Vcc/R)}!.times.S(2)Vtheff(Cut)-S.ltoreq.Vtheff(Ac) (3)
摘要:
When a potential D of an output node is drawn out to the level of ground potential GND by an n channel pull-down output transistor, a pull-down gate control transistor is rendered conductive. The output node and the n channel pull-down output transistor conduct.
摘要:
A semiconductor integrated circuit device has an internal circuit node reset signal generation circuit for inverting an output signal with a predetermined time lag immediately after application of power. The internal circuit node reset generation circuit comprises an initial stage power on reset signal generation circuit, an initial stage signal transmission circuit for inputting a signal outputted by the initial stage power on reset signal generation circuit, a final stage power on reset signal generation circuit for inputting a signal outputted by the initial stage signal transmission circuit, and a final stage signal transmission circuit for inputting a signal outputted by the power on reset signal and outputting the output signal. When an operating source voltage lower limit value of the initial stage power on reset signal generation circuit is lower than that of the final stage signal transmission circuit and a source voltage has not reached a predetermined value, it is possible for the final stage power on reset signal generation circuit to generate an output signal without being influenced by the initial stage power on reset signal generation circuit, and to output an internal circuit inactivation signal for a certain time after application of power, and an inversion signal after passing the certain time. As a result, a certain internal circuit initialization time may be exactly established.
摘要:
When an operational mode is shifted to a standby mode, a first transistor is brought into a conduction state by a control signal, and a word line is thereby clamped to a ground voltage. Further, a second transistor is brought into a non-conduction state, and supply of an internal power supply voltage to a word line driver is shut off. Subsequently, the supply of the internal power supply voltage is halted for saving electrical power. When the operational mode returns to a normal mode, the supply of the internal power supply voltage is started, and subsequently, the first transistor is brought into the non-conduction state by the control signal, and the second transistor is thereby brought into the conduction state.
摘要:
A semiconductor integrated circuit according to the present invention comprises a synchronous SRAM, a signal generation circuit generating a chip selection signal, a clock signal etc. supplied to the synchronous SRAM, a voltage set circuit setting the voltage of a system power supply line and a controller controlling the signal generation circuit and the voltage set circuit. When setting the synchronous SRAM in a power down mode, the chip selection signal is set in a nonselective state and the power supply voltage of the system power supply line is stepped down to a standby potential. Thus, the synchronous SRAM enters a standby state having extremely low power consumption.
摘要:
An I/O protection circuit includes a P-channel MOS transistor connected between an input terminal and a power supply line, and an N-channel MOS transistor connected between the input terminal and a ground line. Gate electrodes of both the transistors are floated. The transistors may be replaced with gate diodes. Further, gate electrodes may be formed from the same layer as a gate electrode provided for field shielding.
摘要:
In repairing a defective memory cell of a data memory placed in a data memory region, a repairing circuit which employs a repairing method causing some access penalty but having high repairing efficiency is located in a redundant row region and a redundant column region in the data memory region. On the other hand, in repairing a defective memory cell of a tag memory placed in a tag memory region, a repairing circuit which employs a repairing method having low repairing efficiency but causing little access penalty is located in a redundant column region in the tag memory region. Accordingly, optimal repair of a defective memory cell can be achieved according to respective functions of the tag memory and the data memory.