摘要:
A semiconductor memory device comprises a main bit line pair, a plurality of subbit line pairs, a plurality of selection transistor pairs, a plurality of word lines, a plurality of memory cells, and a plurality of first precharging circuits. The subbit line pairs are provided in correspondence to the main bit line pair. One and other subbit lines of the subbit line pairs are arranged in straight lines along the main bit line pair. The selection transistors are provided in correspondence to the subbit line pairs. Each of the selection transistor pairs is connected between the main bit line pair and the corresponding subbit line pair, and turned on in response to a prescribed selection signal. The word lines are arranged to intersect with one and the other subbit lines of the subbit line pairs. The memory cells are provided in correspondence to intersection points between one and the other subbit lines of the subbit line pairs and the word lines. Each of the memory cells is connected to the corresponding subbit line and the corresponding word line. The first precharging circuits are provided in correspondence to the subbit line pairs. Each of the first precharging circuits directly precharges the corresponding subbit line pair at the prescribed precharging potential.
摘要:
Data input/output pad portions are arranged corresponding to memory blocks and adjacent to a corresponding memory block in the center region between memory blocks, and memory blocks. Power supply pads are arranged at both ends of the center region. Power supply pad transmits a power supply voltage to data input/output pad portions, and power supply pad transmits the power supply voltage to data input/output pad portions. Power supply pad for peripheral circuitry is arranged in the center portion of the center region. A multibit test circuit is provided for each memory block. A data input/output buffer operating stably at high speed is implemented in a large storage capacity memory device which in turn accommodates a multibit test mode.
摘要:
One memory array is divided into a plurality of banks sharing a row of memory cells. Global IO buses are disposed for memory column blocks forming the plurality of banks included in one memory array. The global IO buses are selectively and electrically connected to the same data input/output terminal.
摘要:
In a DRAM, an upper address is assigned to each of ways W0 and W1, and a lower address is assigned to each word line WL in each of ways W0 and W1. A self-refresh start trigger generating circuit senses start of self-refresh, and a refresh address change sensing circuit senses change in an upper address. Based on the result of sensing, way selection signals RX0 and RX1 will not be reset and held at an active level while ways W0 and W1 are selected, respectively. Consequently, power consumption can be reduced compared to a conventional example in which signals RX0 and RX1 are reset every time a single word line WL is selected.
摘要:
A semiconductor memory device includes a semiconductor substrate, a plurality of sub bit line pairs formed on the semiconductor substrate, a main bit line pair formed at a layer above the plurality of sub bit line pairs, a plurality of selecting transistors, a plurality of word lines located to cross the sub bit line pairs, and a plurality of memory cells. Each selecting transistor is provided corresponding to one sub bit line and has one source/drain region connected to a corresponding sub bit line. At a layer above the other source/drain region of the selecting transistor, an intermediate layer is formed in the same layer as that of a storage node of memory cell. The intermediate layer is connected to the other source/drain region of the selecting transistor through a contact hole formed beneath it. The intermediate layer is further connected to the main bit line through another contact hole formed on the intermediate layer.
摘要:
Main bit lines MBL and ZMBL are disposed at opposite sides of a sense amplifier SA. Main bit lines MBL and ZMBL each are provided for paired sub-bit lines SBL1 and SBL2 (or SBL3 and SBL4). Sub-bit line pair SBL1 and SBL2 is connected to main bit line MBL via a block select switch T1. Sub-bit line pair SBL3 and SBL4 is connected to main bit line ZMBL via a block select switch T2. Since one main bit line is provided for two sub-bit lines, a pitch of the main bit lines is twice as large as a pitch of the sub-bit lines, so that conditions on the pitch of main bit lines are remarkably eased, which facilitates layout of elements.
摘要:
N channel sense amplifier transistors have their backgate potentials set to a backgate precharge potential higher than a potential intermediate between an operation power supply potential and a ground potential prior to start of sensing operation, and then lowered following the lowering of an n common source node potential during the sensing operation. The n common source node is precharged to the intermediate potential. The backgate precharge potential is set no greater than a potential of the intermediate potential plus a pn junction diffusion, to suppress a leakage current from the backgate to source or drain of each of the sense amplifier transistors. P channel sense amplifier transistors have also their backgate potential set to a precharge potential lower than the intermediate potential prior to sensing operation and raised following the rise of a p common source node potential.
摘要:
A semiconductor circuit or a MOS-DRAM wherein converting means is provided that converts substrate potential or body bias potential between two values for MOS-FETs in a logic circuit, memory cells, and operating circuit of the MOS-DRAM, thereby raising the threshold voltage of the MOS-FETs when in the standby state and lowering it when in active state. The converting means includes a level shift circuit and a switch circuit. The substrate potential or body bias potential is controlled only of the MOS-FETs which are nonconducting in the standby state; this configuration achieves a reduction in power consumption associated with the potential switching. Furthermore, in a structure where MOS-FETs of the same conductivity type are formed adjacent to each other, MOS-FETs of SOI structure are preferable for better results.
摘要:
Column address A0-A11 is once predecoded by a first predecoder PD1, a second predecoder PD2, and a CDE buffer CDB and then applied to a column decoder CD. Column decoder CD selectively drives one of a plurality of column selecting lines CSL on the basis of the applied predecoded signals. This causes corresponding bit lines in respective memory cell arrays MCA1-MCA4 to be simultaneously selected. Column decoder CD includes a plurality of column drivers corresponding to the plurality of column selecting lines, and the column drivers are divided into a plurality of groups. The predecoded signals applied from second predecoder PD2 and CDE buffer CDB to column decoder CD are generated independently for respective groups, and signal lines for them are also distributed to respective groups. This causes the length of wiring of each predecoded signal line to be shortened.
摘要:
There is provided a semiconductor device which can maintain a high tuning accuracy while suppressing a cost increase and suppress an increase in the time required for tuning. There are included, in addition to variable resistors configuring a level shift circuit, an additional resistor coupled between the output node of a VBGR voltage of a BGR circuit and one of the variable resistors and an additional resistor coupled between the other of the variable resistors and a reference voltage. N-channel MOS transistors are coupled in parallel with the additional resistors, respectively.