Abstract:
A coil component includes a body, a coil portion disposed in the body and having first and second lead-out portions exposed to at least one surface of the body to be spaced apart from each other, first and second external electrodes disposed on the at least one surface of the body to be spaced apart from each other, and respectively connected to the first and second lead-out portions, a dielectric layer disposed on a surface of the body, and a third external electrode disposed on the surface of the body having the dielectric layer disposed thereon to be spaced apart from each of the first and second external electrodes, and covering the dielectric layer.
Abstract:
An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.
Abstract:
A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.
Abstract:
A multilayer ceramic electronic component may include first and second metal frames connected to different external electrodes of a multilayer ceramic capacitor, respectively, and disposed to be spaced apart from a mounting surface of the multilayer ceramic capacitor; and an insulating layer disposed on a surface of the multilayer ceramic capacitor opposing the mounting surface thereof.
Abstract:
A coil electronic component includes a magnetic body enclosing a coil part and a magnetic metal plate. The magnetic metal plate is arranged in a direction in which magnetic flux flows within the magnetic body.
Abstract:
A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.
Abstract:
An electronic component comprises a magnetic body containing a magnetic metal powder; and internal coil parts embedded in the magnetic body and disposed on one surface and the other surface of an insulating substrate, respectively. A core part is disposed inwardly of the internal coil parts, and a through-hole penetrating through the magnetic body is disposed in a portion of the core part.
Abstract:
Disclosed herein is a common mode filter in order to improve attenuation of the common mode filter, the common mode filter including: a support substrate; an insulation layer provided on the support substrate and including a coil pattern formed therein; and a non-magnetic dielectric body provided on the insulation layer.
Abstract:
There are provided a coil component and a board having the same. The coil component may include: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate, and third and fourth coil parts disposed on the other surface of the substrate; a connection part disposed to penetrate through the two cores in the magnetic body and connecting the two cores to each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.
Abstract:
A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.