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    COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THEREOF
    2.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THEREOF 有权
    复合电子元件及其安装板

    公开(公告)号：US20150371780A1

    公开(公告)日：2015-12-24

    申请号：US14485437

    申请日：2014-09-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byeong Cheol MOON ,  Jae Hoon LEE ,  Myeong Gi KIM ,  Jin Woo HAN ,  Soo Hwan SON

    IPC: H01G4/40 ,  H01G4/30 ,  H05K1/18 ,  H01F27/28

    CPC classification number: H01G4/40 ,  H01F27/022 ,  H01F27/292 ,  H01F27/40 ,  H01F2027/2809 ,  H01G2/065 ,  H01G2/22 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  Y02P70/611

    Abstract: A composite electronic component may include a composite body including a capacitor and an inductor coupled to each other; an input terminal formed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal formed on the second end surface of the composite body and connected to the first internal electrode of the capacitor; and a ground terminal formed on a first end surface of the capacitor in the composite body. The capacitor may be coupled to a side surface of the inductor, and the sum of ratio of lengths of a short axis to a long axis of the coil part is 0.7 to 1.0.

    Abstract translation: 复合电子部件可以包括：复合体，其包括彼此耦合的电容器和电感器; 输入端子，形成在复合体的第一端面上，并与电感器的线圈部分相连; 输出端子，包括形成在复合体的第二端面上并连接到电感器的线圈部分的第一输出端子和形成在复合体的第二端面上的第二输出端子，并且连接到第一内部电极 电容器 以及形成在复合体中的电容器的第一端面上的接地端子。 电容器可以耦合到电感器的侧表面，并且短轴与线圈部分的长轴的长度之比的总和为0.7至1.0。

    CHIP ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND PACKAGING UNIT THEREOF
    4.
    发明申请
    CHIP ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND PACKAGING UNIT THEREOF 审中-公开
    芯片电子元件，具有该组件的板及其包装单元

    公开(公告)号：US20150102891A1

    公开(公告)日：2015-04-16

    申请号：US14505012

    申请日：2014-10-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chan YOON ,  Dong Hwan LEE ,  Jin Woo HAN

    IPC: H01F27/28

    CPC classification number: H01F27/2804 ,  H01F2027/2819

    Abstract: A chip electronic component may include: a magnetic body having first and second main surfaces opposing each other in a thickness direction, first and second side surfaces opposing each other in a width direction, and first and second end surfaces opposing each other in a length direction, a thickness of the magnetic body being greater than a width thereof; internal coil pattern parts disposed in the magnetic body; and external electrodes disposed on at least one surface of the magnetic body. The internal coil pattern parts may be disposed to be perpendicular with respect to the first and second main surfaces of the magnetic body.

    Abstract translation: 芯片电子部件可以包括：具有在厚度方向上彼此相对的第一和第二主表面的磁体，在宽度方向上彼此相对的第一和第二侧表面以及在长度方向上彼此相对的第一和第二端面 磁体的厚度大于其宽度; 设置在磁体内的内部线圈图形部分; 以及设置在所述磁性体的至少一个表面上的外部电极。 内部线圈图形部分可以相对于磁性体的第一和第二主表面垂直设置。

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