公开(公告)号：US20190069412A1

公开(公告)日：2019-02-28

申请号：US16001510

申请日：2018-06-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM ,  Kyung Hwa YU ,  Man Su BYUN ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H05K1/11

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05≤A1/A1≤0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

公开(公告)号：US20190066918A1

公开(公告)日：2019-02-28

申请号：US15994871

申请日：2018-05-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Heon JEONG ,  Young Ghyu AHN ,  Ho Yoon KIM ,  Man Su BYUN ,  Soo Hwan SON

IPC: H01G4/12 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.

公开(公告)号：US20180151298A1

公开(公告)日：2018-05-31

申请号：US15880169

申请日：2018-01-25

Applicant: Samsung Electro-Mechanics, Co., Ltd.

Inventor： Ho Yoon KIM

IPC: H01G4/30 ,  H05K1/11 ,  H01G4/012 ,  H05K1/18 ,  H01G4/248 ,  H01G4/224 ,  H01G4/002

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/002 ,  H01G4/012 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015

Abstract: A composite electronic component includes: a composite including a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, external electrodes extending from third and fourth surfaces of the capacitor body to portions of the first, second, fifth, and sixth surfaces, respectively, a discharge layer disposed between the external electrodes on the second surface of the capacitor body, and a protective layer disposed on the discharge layer; and conductive resin layers overlapping the third and fourth surfaces and portions of the first, second, fifth, and sixth surfaces, respectively. Widths of portions of the external electrodes formed on the first surface of the capacitor body are greater than widths of portions of the first and second conductive resin layers overlapping the first surface of the capacitor body.

公开(公告)号：US20160014886A1

公开(公告)日：2016-01-14

申请号：US14657813

申请日：2015-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM ,  Byeong Cheol MOON ,  Myeong Gi KIM ,  Jin Woo HAN ,  Soo Hwan SON

IPC: H05K1/02 ,  H05K1/18 ,  H01F27/28 ,  H01G4/40 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01G4/40 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1053 ,  Y02P70/613

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

公开(公告)号：US20140292460A1

公开(公告)日：2014-10-02

申请号：US14081472

申请日：2013-11-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ho Yoon KIM ,  Myeong Gi KIM ,  Il Jin PARK ,  Jin Woo HAHN ,  Min Kyoung CHEON

IPC: H01F27/245 ,  H01F41/04 ,  H01F27/28

CPC classification number: H01F41/043 ,  H01F17/0013 ,  H01F27/255 ,  H01F41/0246 ,  H01F2017/0066 ,  H01F2027/2809

Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a ferrite-organic body; an internal electrode laminated on the ferrite-organic body along a thickness direction of the ferrite-organic body to have a multilayer structure; a metal-organic body constituting a device body with the ferrite-organic body by covering the ferrite-organic body; and an external electrode covering the device body to be electrically connected to the internal electrode.

Abstract translation: 本发明涉及电感器。 根据本发明实施例的电感器包括：铁素体 - 有机体; 沿铁素体 - 有机体的厚度方向层叠在铁素体 - 有机体上的内部电极，具有多层结构; 通过覆盖铁素体 - 有机体来构成具有铁素体 - 有机体的器件主体的金属 - 有机体; 以及覆盖所述器件主体以与内部电极电连接的外部电极。