Logic switching device and method of manufacturing the same

    公开(公告)号:US11305365B2

    公开(公告)日:2022-04-19

    申请号:US16881377

    申请日:2020-05-22

    Abstract: Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.

    Photoelectric conversion element and optical sensor including the same

    公开(公告)号:US11004888B2

    公开(公告)日:2021-05-11

    申请号:US16692603

    申请日:2019-11-22

    Abstract: A photoelectric conversion element and an optical sensor including the same are disclosed. The photoelectric conversion element may include a plurality of lattice stacks repeatedly stacked on top of each other on a substrate and configured to have an effective band gap. The plurality of lattice stacks may each include a first active layer and a second active layer on the first active layer. The first active layer may include a first two-dimensional material having a first band gap. The second active layer may include a second two-dimensional material having a second band gap not overlapping the first band gap. An effective band gap may be adjusted based on the first two-dimensional materials and thicknesses of the first active layer and the second active layer and a number of times of plurality of lattice stacks.

    Logic switching device and method of manufacturing the same

    公开(公告)号:US10702940B2

    公开(公告)日:2020-07-07

    申请号:US16391477

    申请日:2019-04-23

    Abstract: Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.

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