公开(公告)号：US08841224B2

公开(公告)日：2014-09-23

申请号：US13773347

申请日：2013-02-21

Applicant: TDK Corporation

Inventor： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Tatsuya Kojima ,  Satoshi Takagi

IPC: C04B35/495 ,  C04B35/50 ,  H01G4/10 ,  H01G4/30 ,  H01G4/12

CPC classification number: C04B35/50 ,  C04B35/495 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3239 ,  C04B2235/3241 ,  C04B2235/3251 ,  C04B2235/3256 ,  C04B2235/3258 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/76 ,  C04B2235/79 ,  C04B2235/9615 ,  H01G4/1254 ,  H01G4/30

Abstract: Dielectric ceramic composition comprising a compound shown by a general formula {A1−x(RE)2x/3}y-B2O5+y and has a tungsten bronze-type structure. In the formula, “A” is at least one selected from a group comprising Ba, Ca, Sr and Mg, “B” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and said “x” and “y” satisfies 0 1.000, respectively. The dielectric ceramic composition further comprises an oxide of at least one selected from V, Mo, Fe, W, Mn and Cr.

Abstract translation: 电介质陶瓷组合物，其包含通式{A1-x（RE）2x / 3} y-B2O5 + y所示的化合物，并具有钨青铜型结构。 在该式中，“A”为选自Ba，Ca，Sr和Mg的组中的至少一种，“B”为选自Nb和Ta中的至少一种，“RE”为选自Sc，Y， La，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu，所述“x”和“y”分别满足0 电介质陶瓷组合物还包含选自V，Mo，Fe，W，Mn和Cr中的至少一种的氧化物。

公开(公告)号：US12094658B2

公开(公告)日：2024-09-17

申请号：US17748482

申请日：2022-05-19

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Yuichiro Sueda ,  Ryota Namiki

IPC: H01G4/12 ,  C04B35/468 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/1227 ,  C04B35/4682 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30 ,  C04B2235/3206

Abstract: A dielectric composition includes dielectric particles and first segregations. The dielectric particles each include a perovskite compound represented by ABO3 as a main component. The first segregations each include at least Ba, V, and O. A molar ratio (Ba/Ti) of Ba to Ti detected in the first segregations is 1.20 or more.

公开(公告)号：US12027317B2

公开(公告)日：2024-07-02

申请号：US17748580

申请日：2022-05-19

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Hiroaki Murakami ,  Yuichiro Sueda ,  Ryota Namiki

IPC: H01G4/12 ,  C04B35/468 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/1227 ,  C04B35/4682 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30 ,  C04B2235/3206

Abstract: A dielectric composition includes dielectric particles and first segregations. The dielectric particles each include a perovskite compound represented by ABO3 as a main component. The first segregations each include Ba, Ti, Si, Ni, and O.

公开(公告)号：US12014879B2

公开(公告)日：2024-06-18

申请号：US17903302

申请日：2022-09-06

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Yoshitaka Nagashima ,  Yasuhiro Okui ,  Masahide Ishizuya ,  Yuuki Hidaka

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer electronic component includes a plurality of dielectric layers and a plurality of electrode layers that are alternately stacked. A skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more.

公开(公告)号：US11984266B2

公开(公告)日：2024-05-14

申请号：US17683602

申请日：2022-03-01

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Yuichiro Sueda ,  Ryota Namiki

IPC: H01G4/12 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/1227 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a baked electrode layer having a first region and a second region. The first region is contacted with the end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constitutes an outer surface of the baked electrode layer. The first region includes a glass frit including at least B and Si. The second region includes an Al based oxide mainly including Al.

公开(公告)号：US11961675B2

公开(公告)日：2024-04-16

申请号：US17685018

申请日：2022-03-02

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Yuichiro Sueda ,  Ryota Namiki

IPC: H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/2325 ,  H01G4/302

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal, electrode layer. The element body includes a boundary layer at an end of the ceramic layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The boundary layer includes Ba and Ti as a main component. The boundary layer includes 0.27-0.40 parts by mol of Ba, provided that a total of Ba and Ti included in the boundary layer is 1 part by mol.

公开(公告)号：US11823841B2

公开(公告)日：2023-11-21

申请号：US17683645

申请日：2022-03-01

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Yuichiro Sueda ,  Ryota Namiki

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/248

CPC classification number: H01G4/2325 ,  H01G4/1209 ,  H01G4/248 ,  H01G4/30

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a baked electrode layer having a first region and a second region. The first region is contacted with the end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constitutes an outer surface of the baked electrode layer. The first region includes a glass frit including at least B, Zn, and Si. The second region includes an oxide having a higher melting point than Cu.

公开(公告)号：US11646163B2

公开(公告)日：2023-05-09

申请号：US17228822

申请日：2021-04-13

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi ,  Toshihiro Iguchi ,  Kenya Tamaki ,  Shinya Saito

IPC: H01F27/28 ,  H01G4/224 ,  H01G4/228 ,  H01G4/38 ,  H01G4/40

CPC classification number: H01G4/40 ,  H01F27/28 ,  H01G4/224 ,  H01G4/228 ,  H01G4/38

Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

公开(公告)号：US11646160B2

公开(公告)日：2023-05-09

申请号：US17463964

申请日：2021-09-01

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/2325 ,  H01G4/12

Abstract: An electronic component includes an element body including a side surface and an end surface adjacent to each other, and an external electrode disposed on the side surface and the end surface. The external electrode includes a metal layer disposed on the side surface and the end surface and made of sintered copper, a conductive resin layer that is disposed on the metal layer in such a manner that a partial region of the metal layer is exposed and contains a plurality of copper particles and a resin, and a plating layer disposed on the partial region of the metal layer and the conductive resin layer. The conductive resin includes a first portion located on the side surface. The plating layer includes a second portion located on the side surface. A thickness of the first portion is smaller than a thickness of the second portion.

公开(公告)号：US11501919B2

公开(公告)日：2022-11-15

申请号：US17119212

申请日：2020-12-11

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Nobuto Morigasaki

IPC: H01G4/12 ,  C04B35/465 ,  C04B35/468 ,  C04B35/48 ,  C04B35/50

Abstract: A dielectric composition includes main phases and Ca-RE-Si—O segregation phases. The main phases include a main component expressed by ABO3. “A” includes at least one selected from barium and calcium. “B” includes at least one selected from titanium and zirconium. “RE” represents at least one of rare earth elements. A molar ratio of (Si/Ca) is larger than one. A molar ratio of (Si/RE) is larger than one, provided that the molar ratio of (Si/RE) is a molar ratio of silicon included in the segregation phases to the rare earth elements included therein. An average length of major axes of the segregation phases is 1.30-2.80 times as large as an average particle size of the main phases. An average length of minor axes of the segregation phases is 0.21-0.48 times as large as an average particle size of the main phases.