摘要:
If a row (column) redundant circuit is not used, a comparison between a defective address and an internal address is not performed in a row (column) fuse programming portion in accordance with a signal output from a circuit for indicating if a row (column) redundant circuit is to be used or not. A comparison outcome signal which is generated when these addresses do not match each other is to be output from the row (column) fuse programming portion.
摘要:
An SRAM includes a memory cell array, a peripheral circuitry including a bit line load connected to the memory cell array, a multiplexer and the like, and a voltage lowering circuit. The voltage lowering circuit receives a power supply potential Vcc and outputs a potential Vin which is lower. The potential Vin is applied to the peripheral circuitry except the memory cell array, and the power supply potential Vcc is directly applied to the memory cell array. Therefore, operational potential of the memory cell array is made relatively higher with respect to the peripheral circuitry. As a result, a static semiconductor memory device which can operation at low voltage and consumes less power can be provided.
摘要:
The present invention comprises a field oxide film formed on a silicon substrate, an underlying film of polycrystal silicon formed on a portion thereof and an insulating film formed so as to cover the field oxide film comprising the underlying film. A surface stepped portion of the insulating film is formed by a portion with an underlying film and a portion without an underlying film under the insulating film, and a blowout portion of a fuse is formed along the surface stepped portion. There are terminal portions at both ends of the blowout portion of the fuse and an aluminum line is connected thereto. In addition, the whole portions comprising the fuse portion are covered with another insulating film and the whole is protected. The fuse is employed as one example in a redundancy circuit of a MOS dynamic RAM having redundancy memory cells.
摘要:
A substrate bias circuit controls application of a conventional substrate charge pump to the substrate of a semiconductor integrated circuit to prevent latching up of parasitic transistors at the time of turn on of power to the integrated circuit. The substrate bias circuit comprises a filed effect transistor having its source and drain electrodes connected between substrate and charge pump. The gate electrode of the transistor is driven through an RC circuit by the power supply to turn on the transistor for a predetermined time period at the time power is initially applied to the integrated circuit. There is no latching up of the parasitic transistors because application of positive bias voltage to the substrate during turn-on is prevented.
摘要:
A semiconductor device is formed by sealing, with a resin, a semiconductor chip (CP1) having an oscillation circuit utilizing a reference resistor. The oscillation circuit generates a reference current by utilizing the reference resistor, a voltage is generated in accordance with this reference current and an oscillation frequency of the oscillation unit, and the oscillation unit oscillates at a frequency in accordance with the generated voltage. The reference resistor is formed of a plurality of resistors, which extend in a first (Y) direction orthogonal to a first side, inside a first region (RG1, RG2, RG3, and RG4) surrounded by the first side (S1, S2, S3, and S4) of a main surface of the semiconductor chip (CP1), a first line (42, 43, 44, and 45) connecting between one end of the first side and the center (CT1) of the main surface of the semiconductor chip, and a second line (42, 43, 44, and 45) connecting between the other end of the first side and the center of the main surface of the semiconductor chip.
摘要:
A semiconductor device is formed by sealing, with a resin, a semiconductor chip (CP1) having an oscillation circuit utilizing a reference resistor. The oscillation circuit generates a reference current by utilizing the reference resistor, a voltage is generated in accordance with this reference current and an oscillation frequency of the oscillation unit, and the oscillation unit oscillates at a frequency in accordance with the generated voltage. The reference resistor is formed of a plurality of resistors, which extend in a first (Y) direction orthogonal to a first side, inside a first region (RG1, RG2, RG3, and RG4) surrounded by the first side (S1, S2, S3, and S4) of a main surface of the semiconductor chip (CP1), a first line (42, 43, 44, and 45) connecting between one end of the first side and the center (CT1) of the main surface of the semiconductor chip, and a second line (42, 43, 44, and 45) connecting between the other end of the first side and the center of the main surface of the semiconductor chip.
摘要:
There is provided a semiconductor device having resistance elements small in temperature dependence of the resistance value. The semiconductor device has metal resistance element layers. The metal resistance element layer includes a resistance film layer. The other metal resistance element layer includes another metal resistance film layer. The metal resistance film layer is one of titanium nitride resistance and tantalum nitride resistance. The other metal resistance film layer is the other of the titanium nitride resistance and the tantalum nitride resistance. The resistance value of titanium nitride resistance has a positive temperature coefficient. Whereas, the resistance value of tantalum nitride resistance has a negative temperature coefficient. A contact plug electrically couples the metal resistance film layer with the other metal resistance film layer. Therefore, the temperature coefficient of the titanium nitride resistance and the temperature coefficient of the tantalum nitride resistance cancel each other. This can reduce the temperature coefficient.
摘要:
A dynamic associative memory device comprising memory cells each of that including: a capacitor connected to one of the bit lines through first transmission gate capable of being switched to ON by an activation of a word line, and having a cell plate supplied with a source voltage; at least one second transmission gate provided in series between the bit lines, capable of being switched to ON by a memory node potential at an opposite side of a source voltage supply-side of the capacitor; and a initializing circuit for controlling the memory node potential upon receiving a reset signal so that at least one of the second transmission gates is switched to OFF.
摘要:
A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in access with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.
摘要:
A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in accordance with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.