摘要:
It is an object of the present invention to provide adhesive compositions having excellent flexibility, rubber elasticity, mechanical properties, heat resistance and low-temperature properties.An adhesive composition of the invention includes 10 to 70 parts by weight of a soft polypropylene resin composition (X) which includes 40 to 98 wt % of a propylene copolymer (A) satisfying the following requirements (A1) to (A8) and 2 to 60 wt % of a crystalline isotactic polypropylene (B) satisfying the following requirements (B1) to (B3), and 30 to 90 parts by weight of a tackifier (C) (wherein the total of the component (X) and the component (C) is 100 parts by weight), wherein (A1) Shore A hardness: 20 to 90; (A2) the copolymer comprises a copolymer with C3 units at 51 to 90 mol %, C2 units at 7 to 24 mol % and C4-20 α-olefin units at 3 to 25 mol %; (A3) Mw/Mn: 1.2 to 3.5; (A4) mm: 85 to 99.9%; (A5) value B: 0.8 to 1.3; (A6) 2,1-insertion ratio: less than 1%; (A7) Tg: −10° C. to −50° C.; (A8) MFR (230° C.): 0.5 to 500 g/10 min; (B1) Tm: 100 to 175° C.; (B2) mmmm: 90 to 99.8%; (B3) MFR (230° C.): 0.1 to 100 g/10 min.
摘要:
[Problem] To provide a thermoplastic resin composition which is excellent in transparency and adhesion properties and hardly causes staining of an adherend after it is separated, a multilayer laminate using the composition, an article, and a method for protecting a surface of an article.[Means for solving problem] A thermoplastic resin composition (X) comprising the following components (A) to (C): (A) isotactic polypropylene containing not less than 90% by mol of propylene units, in an amount of 1 to 65% by weight, (B) a propylene copolymer which is a copolymer of propylene and at least one α-olefin of 2 to 20 carbon atoms (excluding propylene) and whose melting point, as measured by DSC, is lower than 65° C. or is not observed, in an amount of 30 to 94% by weight, and (C) a 1-butene-based polymer which is selected from the group consisting of a 1-butene homopolymer and a copolymer of 1-butene and an α-olefin of 2 to 20 carbon atoms (excluding 1-butene) (said copolymer containing not less than 16% by mol of 1-butene units) and whose melting point, as measured by DSC, is in the range of 65 to 135° C., in an amount of 5 to 60% by weight, the total amount of said components (A) to (C) being 100% by weight.
摘要:
[Object] To provide a resin composition with excellent mold releasability and blocking resistance.[Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [η] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.
摘要翻译:提供具有优异的脱模性和抗粘连性的树脂组合物。 [解决方案]含有4-甲基-1-戊烯聚合物的树脂组合物,相对于所选择的至少一种树脂(A),相对于每100质量份的所述4-甲基-1-戊烯类聚合物(B),含有0.01〜10质量份的4-甲基-1-戊烯类聚合物 由热塑性树脂和热固性树脂组成的组合物,其中4-甲基-1-戊烯聚合物(B)的特性粘度[ηe]为135°时测得的0.01或更大但小于0.50dl / g C.在十氢化萘溶剂中。
摘要:
[Problem] To provide a thermoplastic resin composition which is excellent in transparency and adhesion properties and hardly causes staining of an adherend after it is separated, a multilayer laminate using the composition, an article, and a method for protecting a surface of an article.[Means for solving problem] A thermoplastic resin composition (X) comprising the following components (A) to (C): (A) isotactic polypropylene containing not less than 90% by mol of propylene units, in an amount of 1 to 65% by weight, (B) a propylene copolymer which is a copolymer of propylene and at least one α-olefin of 2 to 20 carbon atoms (excluding propylene) and whose melting point, as measured by DSC, is lower than 65° C. or is not observed, in an amount of 30 to 94% by weight, and (C) a 1-butene-based polymer which is selected from the group consisting of a 1-butene homopolymer and a copolymer of 1-butene and an α-olefin of 2 to 20 carbon atoms (excluding 1-butene) (said copolymer containing not less than 16% by mol of 1-butene units) and whose melting point, as measured by DSC, is in the range of 65 to 135° C., in an amount of 5 to 60% by weight, the total amount of said components (A) to (C) being 100% by weight.
摘要:
There are provided a painted structure of a magnesium alloy molded product having an aesthetic appearance, a painting method of forming the patented structure of the magnesium alloy molded product having an aesthetic appearance, and a casing fabricated using the magnesium alloy molded product. The painted structure of the magnesium alloy molded product has flow marks of which maximum depth is 100 &mgr;m and maximum opening width is 0.5 mm. An anticorrosive film is formed on a surface of the magnesium alloy molded product, and a painted film having an average surface roughness of 10 &mgr;m or more and a thickness of 80 &mgr;m or more is formed on a surface of the anticorrosive film.
摘要:
An air conditioning system suitable for automotive application is disclosed, in which the noise in the frequency range of about 1 kHz to 2 kHz is reduced. At least a sound absorbing member is arranged over the portions extending from a turning section of an air path where the air blown under pressure from a blower impinges and changes direction toward a heat exchanger, i.e. from the spiral end of a scroll casing to the front of an evaporator.
摘要:
A thin-film transistor array is suited for the manufacture of an image display utilizing liquid crystal. In the thin-film transistor array, a first electrically conductive layer made principally of aluminum is selectively formed on one surface of a substrate. The first electrically conductive layer contains, as an impurity, a high-melting point metal which can be anodized. An oxide layer is formed by an anodization process on the first electrically conductive layer, and the first insulating layer is formed on the oxide layer so as to overlay the substrate. Furthermore, a first semiconductor layer made principally of silicon is selectively formed on the insulating layer, and a pair of second semiconductor layers made principally of silicon containing phosphorus are formed on the first semiconductor layer. A pair of second electrically conductive layers are formed on the paired second semiconductor layers, respectively.