COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET
    31.
    发明申请
    COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET 有权
    电子元件系统柜的冷却系统

    公开(公告)号:US20100053890A1

    公开(公告)日:2010-03-04

    申请号:US12202619

    申请日:2008-09-02

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20772 H05K7/20781

    摘要: An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.

    摘要翻译: 电子部件系统机柜包括多个电子部件系统托架以及安装在多个电子部件系统托架中的各个电子部件系统托架中的多个电子部件系统。 电子部件系统柜还包括包括多个冷却剂储存器的冷却系统。 多个冷却剂储存器中的每一个与多个电子元件系统托架中的至少一个相关联。 冷却系统还包括流体地连接到多个冷却剂储存器中的每一个的至少一个泵。 所述至少一个泵被选择性地操作以将供应的冷却剂循环到多个冷却剂储存器中的每一个。

    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
    33.
    发明申请
    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
    用于移动电子系统的冷却泵送系统

    公开(公告)号:US20100044005A1

    公开(公告)日:2010-02-25

    申请号:US12194973

    申请日:2008-08-20

    IPC分类号: B60H1/32

    CPC分类号: H05K7/20272 H05K7/20872

    摘要: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.

    摘要翻译: 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器,流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个,质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。

    Optical waveguide coupler and method for producing same
    36.
    发明授权
    Optical waveguide coupler and method for producing same 有权
    光波导耦合器及其制造方法

    公开(公告)号:US06501885B2

    公开(公告)日:2002-12-31

    申请号:US09757914

    申请日:2001-01-10

    IPC分类号: G02B626

    CPC分类号: G02B6/4249 G02B6/125

    摘要: The optical waveguide coupler comprises a structure (1) of a number of elongated narrow optical waveguide strips (2), which consist respectively of a front area (3), a center area (4) and a coupling area (5). The center area (4) has respective transition areas (6) and (7) to the corresponding area (3) or (5). A gap (9) in the front areas (3) provided between two adjoining strips (2) is larger than the thickness of the narrow strips (2). The front faces (8) of the front areas (3), and the front faces of the coupling areas (5) are embodied to be as smooth as possible, wherein all strips form a stack in the coupling area (5). The gaps are pits which result from etching of an Si substrate with the aid of a DRIE etching process.

    摘要翻译: 光波导耦合器包括分别由前区域(3),中心区域(4)和耦合区域(5)组成的多个细长窄光波导条(2)的结构(1)。 中心区域(4)具有到相应区域(3)或(5)的各自的过渡区域(6)和(7)。 设置在两个邻接条(2)之间的前区域(3)中的间隙(9)大于窄条(2)的厚度。 前区域(3)的前表面(8)和联接区域(5)的前表面被实施为尽可能平滑,其中所有条带在耦合区域(5)中形成堆叠。 间隙是借助于DRIE蚀刻工艺蚀刻Si衬底产生的凹坑。

    Electronic Device Having an Electrode with Enhanced Injection Properties
    38.
    发明申请
    Electronic Device Having an Electrode with Enhanced Injection Properties 审中-公开
    具有增强注射性能的电极的电子器件

    公开(公告)号:US20120325144A1

    公开(公告)日:2012-12-27

    申请号:US13603457

    申请日:2012-09-05

    IPC分类号: H05B33/10

    摘要: An electronic device having an electrode with enhanced injection properties comprising a first electrode and a first layer of cross-linked molecular charge transfer material on the first electrode. The cross-linked molecular charge transfer material may be an acceptor, which may consist of at least one of: TNF, TN9(CN)2F, TeNF, TCNB, DCNQ, and TCAQ. The cross-linked molecular charge transfer material may also be a donor, which may consist of at least one of: Terpy, Ru(terpy)2 TTN, and crystal violet.

    摘要翻译: 一种具有增强的注入性能的电极的电子器件包括在第一电极上的第一电极和交联的分子电荷转移材料的第一层。 交联分子电荷转移材料可以是受体,其可以由TNF,TN9(CN)2F,TeNF,TCNB,DCNQ和TCAQ中的至少一种组成。 交联分子电荷转移材料也可以是供体,其可以由以下至少一种组成:Terpy,Ru(terpy)2 TTN和结晶紫。

    Electronic device having an electrode with enhanced injection properties
    39.
    发明申请
    Electronic device having an electrode with enhanced injection properties 有权
    电子装置具有具有增强的注射性能的电极

    公开(公告)号:US20060038170A1

    公开(公告)日:2006-02-23

    申请号:US11205232

    申请日:2005-08-16

    摘要: The present invention relates to methods and apparatus for producing an electronic device, such as an organic light-emitting diode (OLED), having an electrode with enhanced injection properties. An example method according to the invention comprises the steps of providing an electrode, depositing a first layer of molecular charge transfer material on the electrode, and cross-linking the molecular charge transfer material. With the method according to the invention, an OLED with higher light efficiency, lower operating voltage, and longer lifetime can be produced. The present invention further relates to an electronic device having an electrode with enhanced injection properties.

    摘要翻译: 本发明涉及一种用于生产电子器件的方法和装置,例如有机发光二极管(OLED),其具有具有增强的注入特性的电极。 根据本发明的示例性方法包括提供电极,在电极上沉积第一层分子电荷转移材料并交联分子电荷转移材料的步骤。 利用根据本发明的方法,可以生产出光效率更高,工作电压更低,寿命更长的OLED。 本发明还涉及一种具有提高喷射性能的电极的电子装置。

    Optimizing Heat Transfer in 3-D Chip-Stacks
    40.
    发明申请
    Optimizing Heat Transfer in 3-D Chip-Stacks 有权
    优化3-D芯片堆中的热传递

    公开(公告)号:US20130331996A1

    公开(公告)日:2013-12-12

    申请号:US13494047

    申请日:2012-06-12

    IPC分类号: G05D23/00 G05D7/00

    摘要: A computer-implemented method, system, and article of manufacture for optimizing heat transfer in a 3-D chip-stack. The method includes the steps of: receiving a heat-removal effectiveness parameter for a plurality of channel-region areas in the chip-stack, receiving at least one of a flow value and temperature value for at least two of the channel-region areas, comparing the received values for different channel-region areas, and adjusting a flow rate of a liquid flowing to at least one of the two channel-region areas based on the heat-removal effectiveness parameter of the channel-region area receiving the adjustment and the results of the comparison step, where at least one step is carried out using a computer device.

    摘要翻译: 用于优化3-D芯片堆叠中的热传递的计算机实现的方法,系统和制品。 该方法包括以下步骤:接收码片堆叠中的多个信道区域区域的散热有效性参数,接收至少两个信道区域区域的流量值和温度值中的至少一个, 比较不同通道区域的接收值,并且基于接收调整的通道区域区域的散热效率参数来调节流入两个通道区域区域中的至少一个的液体的流量, 比较步骤的结果,其中使用计算机设备执行至少一个步骤。