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85 条记录 (耗时 0.033 秒)

    Lateral flux capacitor having fractal-shaped perimeters
    34.
    发明授权
    Lateral flux capacitor having fractal-shaped perimeters 失效
    具有分形周长的横向磁通电容器

    公开(公告)号：US6084285A

    公开(公告)日：2000-07-04

    申请号：US954973

    申请日：1997-10-20

    申请人： Arvin R. Shahani ,  Thomas H. Lee ,  Hirad Samavati ,  Derek K. Shaeffer ,  Steven Walther

    发明人： Arvin R. Shahani ,  Thomas H. Lee ,  Hirad Samavati ,  Derek K. Shaeffer ,  Steven Walther

    IPC分类号： H01L27/08 ,  H01L29/41

    CPC分类号： H01L27/0805 ,  H01L28/86

    摘要： Linear integrated circuit capacitors having greater capacitance per unit area by using lateral flux. One embodiment comprises a two metal layer capacitor wherein each metal layer is comprised of two capacitor conductive components. The capacitor conductive components are cross-coupled so that the total capacitance is the sum of the vertical flux between the metal layers, and the lateral flux along the edges between the two capacitor conductive components in each of the metal layers. The lateral flux between the capacitor conductive components in a single metal layer increases the capacitance per unit area and decreases the bottom-plate parasitic capacitance. Increasing the length of the common edge formed by capacitor conductive components in a metal layer increases the capacitance per unit area. In one lateral flux capacitor, each metal layer is comprised of a plurality of rows, alternate rows are coupled together such that lateral flux is generated between each of the rows. The rows are also cross-coupled with rows in adjacent metal layers to provide vertical flux. Fractal shapes can be used to maximize the length of the perimeter of adjacent capacitor conductive components in a single metal layer. The Koch Islands and Minkowski Sausage families of fractals are particularly well suited for generating capacitor conductive component perimeter shapes. These fractals are generated by selecting an initiator shape and repeatedly applying a generator. The fractal shapes are generated by a computer program based upon user input parameters.

    摘要翻译： 线性集成电路电容器通过使用横向通量具有更大的电容单位面积。 一个实施例包括两个金属层电容器，其中每个金属层由两个电容器导电部件组成。 电容器导电部件被交叉耦合，使得总电容是金属层之间的垂直通量和沿着每个金属层中的两个电容器导电部件之间的边缘的横向磁通的总和。 单个金属层中的电容器导电元件之间的横向通量增加了每单位面积的电容，并降低了底板寄生电容。 增加由金属层中的电容器导电部件形成的共同边缘的长度增加了每单位面积的电容。 在一个横向通量电容器中，每个金属层由多个行组成，交替的行耦合在一起，使得在每行之间产生横向通量。 这些行还与相邻金属层中的行交叉耦合以提供垂直通量。 可以使用分形来最大化单个金属层中相邻电容器导电组件的周长的长度。 科赫群岛和明科夫斯基香肠分形系列特别适用于生成电容器导电组件周边形状。 这些分形是通过选择引发器形状并重复应用发生器来生成的。 基于用户输入参数的计算机程序生成分形。

    Distributed ESD protection device for high speed integrated circuits
    36.
    发明授权
    Distributed ESD protection device for high speed integrated circuits 失效
    用于高速集成电路的分布式ESD保护器件

    公开(公告)号：US5969929A

    公开(公告)日：1999-10-19

    申请号：US58588

    申请日：1998-04-10

    申请人： Bendik Kleveland ,  Thomas H. Lee

    发明人： Bendik Kleveland ,  Thomas H. Lee

    IPC分类号： H01L27/04 ,  H01L21/822 ,  H01L21/8234 ,  H01L27/02 ,  H01L27/088 ,  H02H9/04 ,  H02H3/22

    CPC分类号： H01L27/0248 ,  H01L27/0251 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49175

    摘要： A distributed electrostatic discharge (ESD) protection circuit for high frequency integrated circuits. A transmission line from an integrated circuit (IC) pad or package pin couples a plurality of ESD elements. The ESD elements, such as diodes, are distributed along the transmission line and coupled from the transmission line to ground or a power supply. The effective impedance of the transmission line and ESD elements is defined to match the impedance of an external line. Distributed ESD protection circuits provide a high frequency signal path that can be used well into the GHz frequency range and also provide effective ESD protection.

    摘要翻译： 用于高频集成电路的分布式静电放电（ESD）保护电路。 来自集成电路（IC）焊盘或封装引脚的传输线耦合多个ESD元件。 ESD元件，例如二极管，沿着传输线分布并且从传输线耦合到地或电源。 传输线和ESD元件的有效阻抗被定义为匹配外部线路的阻抗。 分布式ESD保护电路提供可以很好地用于GHz频率范围的高频信号路径，并提供有效的ESD保护。

    Temperature sensor integral with microprocessor and methods of using same
    37.
    发明授权
    Temperature sensor integral with microprocessor and methods of using same 失效
    温度传感器与微处理器集成，使用方法

    公开(公告)号：US5961215A

    公开(公告)日：1999-10-05

    申请号：US938392

    申请日：1997-09-26

    申请人： Thomas H. Lee ,  Mark G. Johnson ,  Matthew P. Crowley

    发明人： Thomas H. Lee ,  Mark G. Johnson ,  Matthew P. Crowley

    IPC分类号： G01K7/01

    CPC分类号： G01K7/01

    摘要： A temperature sensor includes a bandgap reference circuit for providing a temperature-independent reference voltage, a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage, and an amplifier responsive to the reference voltage and the biasing voltage for providing a temperature-dependent output voltage. Preferably, the temperature sensor is integral with a microprocessor and implemented in CMOS technology. The temperature sensor can be used, for instance, to reduce the clock speed of the microprocessor when the microprocessor temperature exceeds a predetermined temperature, or to store temperature-indicating data in non-volatile memory of the microprocessor to provide a thermal history of the microprocessor.

    摘要翻译： 温度传感器包括用于提供与温度无关的参考电压的带隙参考电路，用于提供带隙参考电路中的电流以提供温度依赖偏置电压的偏置电路，以及响应于参考电压和偏置电压的放大器 用于提供与温度相关的输出电压。 优选地，温度传感器与微处理器成一体并以CMOS技术实现。 例如，温度传感器可以用于当微处理器温度超过预定温度时降低微处理器的时钟速度，或者将温度指示数据存储在微处理器的非易失性存储器中以提供微处理器的热历史 。

    Differential charge pump circuit with high differential and low common mode impedance
    38.
    发明授权
    Differential charge pump circuit with high differential and low common mode impedance 失效
    差分电荷泵电路具有高差分和低共模阻抗

    公开(公告)号：US5422529A

    公开(公告)日：1995-06-06

    申请号：US165398

    申请日：1993-12-10

    申请人： Thomas H. Lee

    发明人： Thomas H. Lee

    IPC分类号： H03F3/45 ,  H03L7/093 ,  H03K17/56

    CPC分类号： H03F3/45179 ,  H03F3/45076 ,  H03F3/45183 ,  H03F2203/45176 ,  H03F2203/45188 ,  H03F2203/45201 ,  H03F2203/45208 ,  H03F2203/45466 ,  H03F2203/45644 ,  H03F2203/45674 ,  H03F2203/45712

    摘要： A high gain, low voltage differential amplifier exhibiting extremely low common mode sensitivities includes a load element exhibiting a high differential resistance, but a low common mode resistance. The load element contains a positive differential load resistance and a negative differential load resistance, which offsets the positive differential load resistance. The output common mode level of the differential amplifier is one p-channel source to gate voltage drop below the power supply voltage prohibiting the common mode output voltage from drifting far from an active level. The differential amplifier also has application for use in a differential charge pump circuit. The high differential impedance of the differential amplifier allows the attainment of extremely small leakage, while a low common-mode impedance results in simplified biasing.

    摘要翻译： 具有非常低的共模灵敏度的高增益低电压差分放大器包括具有高差分电阻但是具有低共模电阻的负载元件。 负载元件包含正差分负载电阻和负差分负载电阻，抵消正差分负载电阻。 差分放大器的输出共模电平是一个p沟道源极到栅极电压降低于电源电压，禁止共模输出电压远离有源电平漂移。 差分放大器也可应用于差分电荷泵电路。 差分放大器的高差分阻抗允许实现极小的泄漏，而低共模阻抗导致简化的偏置。

    CONFIGURABLE TEST EQUIPMENT
    39.
    发明申请
    CONFIGURABLE TEST EQUIPMENT 审中-公开
    可配置的测试设备

    公开(公告)号：US20150168482A1

    公开(公告)日：2015-06-18

    申请号：US14104602

    申请日：2013-12-12

    申请人： Todd M. Flynn ,  Christopher W. Argento ,  Steven A. Faillaci ,  Thomas H. Lee

    发明人： Todd M. Flynn ,  Christopher W. Argento ,  Steven A. Faillaci ,  Thomas H. Lee

    IPC分类号： G01R31/26 ,  G01R1/067 ,  G01R1/04 ,  G01R31/28

    CPC分类号： G01R31/2889 ,  G01R31/2834

    摘要： An electronic component test device capable of testing electronic components in a plurality of test configurations. The device includes a probe head for providing a plurality of probe contact structures to an electronic component to be tested. The device includes an interconnect board coupled to the probe head. The interconnect board includes a plurality of conductive terminals, each of a first subset of the plurality of conductive terminals is coupled to one of a group of electrical signal lines for coupling to different types of external signals. The interconnect board includes a plurality of conductive lines. Each conductive line is coupled between a corresponding one of a plurality of conductive terminals in a second subset of the plurality of conductive terminals and a terminal for coupling to one of the plurality of probe contact structures. Each conductive terminal of the second subset is couplable by an interconnector of a plurality of interconnectors to a conductive terminal of multiple conductive terminals of the first subset based on a test configuration of the device.

    摘要翻译： 一种能够测试多个测试配置中的电子部件的电子部件测试装置。 该装置包括用于向待测试的电子部件提供多个探针接触结构的探针头。 该装置包括耦合到探针头的互连板。 互连板包括多个导电端子，多个导电端子的第一子集中的每一个耦合到一组电信号线中的一个，用于耦合到不同类型的外部信号。 互连板包括多条导线。 每个导电线耦合在多个导电端子的第二子集中的多个导电端子中的相应一个导体端子和用于耦合到多个探针接触结构中的一个的端子。 基于设备的测试配置，第二子集的每个导电端子由多个互连器的互连器耦合到第一子集的多个导电端子的导电端子。