摘要:
A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.
摘要:
A method of measuring the presence of oil in turbine bleed air that uses an aerosol sampler/size classifier to do a comparative measurement of the engine bleed air to the ambient air entering the engine on a real time basis by comparing quantity and size distribution of suspended particles of engine inlet air with suspended particles in the bleed air throughout the normal operating schedule of the engine and determining the presence of oil in the bleed air when the quantity and size distribution of suspended particles in the bleed air exceeds the quantity and size distribution of suspended particles in the engine inlet air by a predetermined amount.
摘要:
A method and an apparatus utilized for thermal processing of substrates during semiconductor manufacturing. The method includes heating the substrate to a predetermined temperature using a heating assembly, cooling the substrate to the predetermined temperature using a cooling assembly located such that a thermal conductance region is provided between the heating and cooling assemblies, and adjusting a thermal conductance of the thermal conductance region to aid in heating and cooling of the substrate. The apparatus includes a heating assembly, a cooling assembly located such that a thermal conductance region is provided between the heating and cooling assemblies, and a structure or configuration for adjusting a thermal conductance of the thermal conductance region.
摘要:
A shock absorber has a base valve assembly which includes a compression valve assembly and an acceleration valve assembly. The compression valve assembly controls a fluid path through the base assembly to provide a firm damping characteristic for the shock absorber during low acceleration movement. The acceleration valve assembly controls a second fluid path through the base assembly to provide a soft damping characteristic for the shock when the shock absorber experiences acceleration beyond a specified amount.
摘要:
A package for a tip, such as a replaceable tip for a bipolar electrosurgical device, is used for insertion of the tip onto and removal of the tip from the end of a device handle, without requiring any direct contact between the user's hand and the tip. The package includes a housing having a tip cavity shaped to receive the tip and an opening through which the end of the handle is insertable for removable attachment to the tip. A releasable locking mechanism, which is releasable in response to the end of the handle being disposed in the opening for removable attachment to the tip, retains the tip in the tip cavity. The package may be made from a single piece of molded material, such as a clear plastic. The package may also be used with monopolar, diathermized and non-bipolar tips, as well as other sharp tips such as cannulae, pics and blades, that are attachable to the end of a handle.
摘要:
An edge card interconnection system provides enhanced electrical interconnection between a module and a circuit board. Electrical contact length is minimized and deflection of the contacts is controlled as the system is configured to eliminate the need for the contacts to absorb module thickness tolerances. A latching mechanism is easily manipulated and provides significant protection to modules being installed/extracted. A hold-down mechanism facilitates enhanced engagement of the connector with the printed circuit board. An insulative connector portion includes a back-up spring that pushes an inserted module against a set of contacts. Deflection of the contacts is controlled by a wall of the connector portion that prohibits the module from deflecting the contacts beyond a preset amount. The back-up spring absorbs any tolerance(s) in board thickness. A module latch and protection mechanism includes latch arms for engagement with a connector body, the latch arms have tabs disposed thereon upon which manual forces are exerted to release the latch arms from the associated connector body latch mating portion. A connector hold-down mechanism is provided which snaps onto ends of the insulative connector housing and is soldered into a plated through-hole, to fasten the edge card interconnection system to a printed circuit board. The connector hold-down mechanism may have compliant protuberances which engage the plated through-holes in the printed circuit board to guarantee contact to the barrel of the plated through-hole and ensure proper solder attachment thereto.
摘要:
A package for a tip, such as a replaceable tip for a bipolar electrosurgical device, is used for insertion of the tip onto and removal of the tip from the end of a device handle, without requiring any direct contact between the user's hand and the tip. The package includes a housing having a tip cavity shaped to receive the tip and an opening through which the end of the handle is insertable for removable attachment to the tip. A releasable locking mechanism, which is releasable in response to the end of the handle being disposed in the opening for removable attachment to the tip, retains the tip in the tip cavity. The package may be made from a single piece of molded material, such as a clear plastic. The package may also be used with monopolar, diathermized and non-bipolar tips, as well as other sharp tips such as cannulae, pics and blades, that are attachable to the end of a handle.
摘要:
A system and method for maintaining a plasma in a plasma region by supplying RF power at a fundamental frequency to the plasma region together with a gas in order to create an RF electromagnetic field which interacts with the gas to create a plasma that contains electromagnetic energy components at frequencies that are harmonics of the fundamental frequency. The components at frequencies that are harmonics of the fundamental frequency are reduced by placing RF energy absorbing resistive loads in energy receiving communication with the plasma, the resistive loads having a frequency dependent attenuation characteristic such that the resistive loads attenuate electrical energy at frequencies higher than the fundamental frequency more strongly than energy at the fundamental frequency.
摘要:
For use primarily in sliding glass doors and windows for tripping a magnetic switch embedded in the casing as part of a security alarm circuit, a magnetic switch trip comprises an elongated L-shaped insert having a small bar magnet in one leg, with the other leg comprising a stem extending at a 90.degree. angle from the magnet, there being a narrowed, frangible neck between the stem and the magnetic to permit snapping the magnet off of the stem. The insert is used primarily as a single piece by inserting the magnet leg into a hole in the vertical side panel of a sliding door frame, and rotating the insert inside the door until the magnet is vertical, adjacent the overlying door casing. The stem is then plugged into the hole for a permanent mount. Alternative modes of use accommodate other sliding fixture types, resulting in one device eliminating separate inventory requirements for at least three different elements of the magnetic reed switch sensors.
摘要:
A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.