公开(公告)号：US20050178335A1

公开(公告)日：2005-08-18

申请号：US11103542

申请日：2005-04-12

Applicant: Eric Strang ,  Wayne Johnson

Inventor： Eric Strang ,  Wayne Johnson

IPC: H01L21/26 ,  H01L21/00 ,  H01L21/687 ,  C23C16/00

CPC classification number: H01L21/68757 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/68785

Abstract: A method and an apparatus utilized for thermal processing of substrates during semiconductor manufacturing. The method includes heating the substrate to a predetermined temperature using a heating assembly, cooling the substrate to the predetermined temperature using a cooling assembly located such that a thermal conductance region is provided between the heating and cooling assemblies, and adjusting a thermal conductance of the thermal conductance region to aid in heating and cooling of the substrate. The apparatus includes a heating assembly, a cooling assembly located such that a thermal conductance region is provided between the heating and cooling assemblies, and a structure or configuration for adjusting a thermal conductance of the thermal conductance region.

Abstract translation: 一种用于在半导体制造期间对衬底进行热处理的方法和装置。 该方法包括使用加热组件将衬底加热至预定温度，使用冷却组件将衬底冷却至预定温度，该冷却组件位于加热组件和冷却组件之间提供导热区域，并调节热电导率 导电区域以帮助加热和冷却基板。 该装置包括加热组件，冷却组件，其定位成使得在加热和冷却组件之间设置热传导区域，以及用于调节导热区域的热导率的结构或构造。

公开(公告)号：US20120224822A1

公开(公告)日：2012-09-06

申请号：US13274123

申请日：2011-10-14

Applicant: Wayne Johnson ,  Brain L. Johnson ,  Thomas W. Kampf ,  Alex Watts ,  Michael J. Wentworth

Inventor： Wayne Johnson ,  Brain L. Johnson ,  Thomas W. Kampf ,  Alex Watts ,  Michael J. Wentworth

IPC: G02B6/44

CPC classification number: G02B6/44 ,  B29D11/00 ,  G02B6/4459 ,  H02G3/0608 ,  Y10T29/49826

Abstract: A cable exit trough with pivoting cover. The cover having a cover plate and a pivot plate hingedly mounted thereto for easy access to the trough. The exit trough may define an insert aperture for receiving modular cable management inserts. The modular insert providing an additional cable management device such as a curved guidewall. The cable management device may alternatively be fixed to the cable exit trough. Removable snap-mounted flanges may also be included in the exit trough.

Abstract translation: 带枢轴盖的电缆出口槽。 盖子具有盖板和铰链安装在其上的枢轴板，以便于进入槽。 出口槽可以限定用于接收模块化电缆管理插入件的插入孔。 模块化插入件提供附加的电缆管理装置，例如弯曲导向壁。 电缆管理装置可以可选地固定到电缆出口槽。 可拆卸的卡扣式法兰也可以包括在出口槽中。

公开(公告)号：US20100266255A1

公开(公告)日：2010-10-21

申请号：US12798448

申请日：2010-04-01

Applicant: Wayne Johnson ,  Brian L. Johnson ,  Thomas W. Kampf ,  Alex Watts ,  Michael J. Wentworth

Inventor： Wayne Johnson ,  Brian L. Johnson ,  Thomas W. Kampf ,  Alex Watts ,  Michael J. Wentworth

IPC: G02B6/00

CPC classification number: G02B6/44 ,  B29D11/00 ,  G02B6/4459 ,  H02G3/0608 ,  Y10T29/49826

Abstract: A cable exit trough with pivoting cover. The cover having a cover plate and a pivot plate hingedly mounted thereto for easy access to the trough. The exit trough may define an insert aperture for receiving modular cable management inserts. The modular insert providing an additional cable management device such as a curved guidewall. The cable management device may alternatively be fixed to the cable exit trough. Removable snap-mounted flanges may also be included in the exit trough.

Abstract translation: 带枢轴盖的电缆出口槽。 盖子具有盖板和铰链安装在其上的枢轴板，以便于进入槽。 出口槽可以限定用于接收模块化电缆管理插入件的插入孔。 模块化插入件提供附加的电缆管理装置，例如弯曲导向壁。 电缆管理装置可以可选地固定到电缆出口槽。 可拆卸的卡扣式法兰也可以包括在出口槽中。

公开(公告)号：US20060013552A1

公开(公告)日：2006-01-19

申请号：US11137125

申请日：2005-05-25

Applicant: Michael Wentworth ,  Brian Johnson ,  Wayne Johnson ,  Thomas Kampf ,  Alex Watts

Inventor： Michael Wentworth ,  Brian Johnson ,  Wayne Johnson ,  Thomas Kampf ,  Alex Watts

IPC: G02B6/00

CPC classification number: G02B6/4439 ,  G02B6/4459

Abstract: A cable exit trough defining an insert aperture for receiving a modular cable management inserts. The modular insert providing an additional cable management device such as a curved guidewall. The cable management device may alternatively be fixed to the cable exit trough. Removable snap-mounted flanges may also be included in the exit trough. The exit trough may also include an exit cover having a cover plate and a pivot plate hingedly mounted thereto for easy access to the trough.

公开(公告)号：US06535785B2

公开(公告)日：2003-03-18

申请号：US09984760

申请日：2001-10-31

Applicant: Wayne Johnson ,  Richard Parsons

Inventor： Wayne Johnson ,  Richard Parsons

IPC: G06F1900

CPC classification number: H01J37/32082 ,  H01J37/32137 ,  H01J37/32146 ,  H01J37/32155 ,  H01J37/32165 ,  H01J37/32174 ,  H01J37/32935 ,  H01J37/32963 ,  H01J37/3299 ,  H01J2237/332 ,  H01J2237/334

Abstract: A system and method for monitoring the conditions in a gas plasma processing system while varying or modulating the RF power supplied to the system, so that resulting signals of the electrical circuits of the system provide information regarding operational parameters of the system or the state of a process. Significant improvements in sensitivity and accuracy over conventional techniques are thereby achieved. In addition, the plasma processing system can be thoroughly tested and characterized before delivery, to allow more accurate monitoring of and greater control over a process, thereby improving quality control/assurance of substrates being produced by the system. The information obtained by the modulation technique can be displayed on a monitor screen, in order to allow an operator to accurately monitor the system/process and diagnose any problems with the system/process.

公开(公告)号：USD352604S

公开(公告)日：1994-11-22

申请号：US8265

申请日：1993-05-12

Applicant: Wayne Johnson

Designer： Wayne Johnson

公开(公告)号：US5269847A

公开(公告)日：1993-12-14

申请号：US879545

申请日：1992-05-04

Applicant: Roger N. Anderson ,  Paul R. Lindstrom ,  Wayne Johnson

Inventor： Roger N. Anderson ,  Paul R. Lindstrom ,  Wayne Johnson

IPC: C23C16/455 ,  H01L21/00

CPC classification number: C23C16/455 ,  Y10S438/935

Abstract: A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.

Abstract translation: 具有输入歧管的晶片处理反应器，以使得能够控制正被处理的晶片上的工艺气流分布。 可以控制工艺气体的相对浓度和流速，从而能够提高跨晶片的加工均匀性。

公开(公告)号：US4947080A

公开(公告)日：1990-08-07

申请号：US391011

申请日：1989-08-09

Applicant: Charles H. Wood ,  Wayne Johnson

Inventor： Charles H. Wood ,  Wayne Johnson

IPC: H01J61/52 ,  H01J65/04

CPC classification number: H01J61/52 ,  H01J65/044

Abstract: A microwave generated light source including a lamp envelope having apparatus for rotating the envelope about an axis which includes an electric motor with a hollow shaft, an elongated stem attached to the envelope and extending within the hollow shaft and a wire-like spring clip for retaining the stem within the hollow shaft.

Abstract translation: 一种微波产生的光源，包括灯壳，其具有用于使包围绕轴线旋转的装置，所述装置包括具有空心轴的电动机，附接到信封并在空心轴内延伸的细长杆和用于保持的线状弹簧夹 空心轴内的杆。

公开(公告)号：US08021700B1

公开(公告)日：2011-09-20

申请号：US12455072

申请日：2009-05-28

Applicant: Wayne Johnson

Inventor： Wayne Johnson

IPC: A61K36/00 ,  A61K31/00 ,  A61K35/00 ,  A61K31/355 ,  A61K31/11

CPC classification number: A61K31/00 ,  A61K8/31 ,  A61K8/678 ,  A61K8/922 ,  A61K31/11 ,  A61K31/355 ,  A61K36/15 ,  A61Q19/00 ,  A61Q19/001 ,  Y10S514/969

Abstract: A general healing ointment for use on cracked lips, rashes, burns and the like is herein disclosed. The ointment is manufactured from an all natural blend of petroleum jelly, vitamin E cream and oil, cocoa butter, and pine pitch. It provides relief for a variety of ailments such as cracked skin, cold sores, rashes, acne, boils, and the like. It is readily absorbed by the skin and not visible to others, but won't dry out the skin afterwards.

Abstract translation: 本文公开了用于破裂的嘴唇，皮疹，烧伤等的一般治疗软膏。 软膏是由凡士林，维生素E奶油和油，可可脂和松沥等天然混合物制成的。 它可以缓解各种疾病，如皮肤破裂，疮疮，皮疹，痤疮，痘痘等。 它容易被皮肤吸收并且对其他人不可见，但是后来不会干燥皮肤。

公开(公告)号：US20100291738A1

公开(公告)日：2010-11-18

申请号：US12851699

申请日：2010-08-06

Applicant: Leora Peltz ,  Wayne Johnson

Inventor： Leora Peltz ,  Wayne Johnson

IPC: H01L21/60

CPC classification number: H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/32014 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.

Abstract translation: 通过包括空隙的导电金属图案化层将半导体管芯附接到封装衬底。 空隙提供了一种空间，当加热时金属可以膨胀，以避免由于管芯，导电金属粘合层和基底的热膨胀系数的不匹配引起的结合上的机械应力。 导电金属的附加涂层可以在结合线上流动以加强结合。