Molded Part for Use in a Portable Electronic Device
    31.
    发明申请
    Molded Part for Use in a Portable Electronic Device 审中-公开
    用于便携式电子设备的成型部件

    公开(公告)号:US20150225547A1

    公开(公告)日:2015-08-13

    申请号:US14526571

    申请日:2014-10-29

    Applicant: Ticona LLC

    CPC classification number: C08K7/14 C08K2201/016 C08L81/04

    Abstract: A polymer composition containing a polyarylene sulfide, a disulfide compound, and inorganic fibers is provided. The polymer composition has an aspect ratio of from about 1.5 to about 10, wherein the aspect ratio is defined as the cross-sectional width of the fibers divided by the cross-sectional thickness of the fibers.

    Abstract translation: 提供含有聚芳硫醚,二硫化物和无机纤维​​的聚合物组合物。 聚合物组合物的纵横比为约1.5至约10,其中纵横比定义为纤维的横截面宽度除以纤维的横截面厚度。

    Low halogen content disulfide washed polyarylene sulfide
    33.
    发明授权
    Low halogen content disulfide washed polyarylene sulfide 有权
    低卤素含量二硫化物洗涤聚芳硫醚

    公开(公告)号:US08921513B2

    公开(公告)日:2014-12-30

    申请号:US13621862

    申请日:2012-09-18

    Applicant: Ticona LLC

    Inventor: Rong Luo Xinyu Zhao

    Abstract: Methods for forming a low chlorine content washed polyarylene sulfide are described. Methods include washing a polyarylene sulfide that includes aryl halide endgroups with a solution that includes a disulfide compound. The solution can also include a catalyst and an organic solvent. During the disulfide wash, a nucleophilic substitution reaction occurs between the disulfide compound and aryl halides endgroups of the polyarylene sulfide. The nucleophilic substitution reaction is carried out at conditions to prevent chain scission of the polyarylene sulfide that includes the aryl halide endgroups. Compositions and products formed with the low chlorine content disulfide washed polyarylene sulfide are also described.

    Abstract translation: 描述了形成低氯含量的聚芳硫醚的方法。 方法包括用包括二卤化物化合物的溶液洗涤包括芳基卤化物端基的聚芳硫醚。 溶液还可以包括催化剂和有机溶剂。 在二硫化物洗涤期间,在聚亚芳基硫醚的二硫化物化合物和芳基卤化物端基之间发生亲核取代反应。 亲核取代反应在防止含有芳基卤化物端基的聚芳硫醚的断链的条件下进行。 还描述了由低氯含量二硫化物洗涤的聚芳硫醚形成的组合物和产品。

    Low Temperature Injection Molding of Polyarylene Sulfide Compositions
    34.
    发明申请
    Low Temperature Injection Molding of Polyarylene Sulfide Compositions 审中-公开
    聚亚芳基硫化物组合物的低温注塑成型

    公开(公告)号:US20140350156A1

    公开(公告)日:2014-11-27

    申请号:US14450851

    申请日:2014-08-04

    Applicant: Ticona LLC

    Inventor: Rong Luo Xinyu Zhao

    Abstract: A method for injection molding a thermoplastic composition that contains a polyarylene sulfide and an aromatic amide oligomer is provided. Due to the improved crystallization properties imparted by the oligomer, the present inventors have discovered that the thermoplastic composition can be molded at lower temperatures to still achieve the same degree of crystallization. In addition to minimizing the energy requirements for the molding operation, such low mold temperatures may be accomplished using heating mediums that are less corrosive and expensive than some conventional techniques.

    Abstract translation: 提供了一种注射模塑含有聚芳硫醚和芳族酰胺低聚物的热塑性组合物的方法。 由于由低聚物赋予的改进的结晶性能,本发明人已经发现,热塑性组合物可以在较低温度下成型,以达到相同的结晶度。 除了最小化模制操作的能量需求之外,可以使用比一些常规技术更少的腐蚀性和昂贵的加热介质来实现这种低模具温度。

    Overmolded Composite Structure for an Electronic Device
    35.
    发明申请
    Overmolded Composite Structure for an Electronic Device 审中-公开
    用于电子设备的包覆成型复合结构

    公开(公告)号:US20140177155A1

    公开(公告)日:2014-06-26

    申请号:US14195268

    申请日:2014-03-03

    Applicant: TICONA LLC

    Inventor: Rong Luo Xinyu Zhao

    Abstract: An overmolded composite structure that contains a metal component and a resinous component adhered to a surface thereof is provided. The resinous component is formed from a thermoplastic composition that contains at least one polyarylene sulfide and at least one mineral filler. The present inventors have discovered that the nature and relative concentration of the polyarylene sulfides, mineral fillers, and/or other materials in the thermoplastic composition can be selectively tailored so that the resulting resinous component has a coefficient of linear thermal expansion and/or color that is similar to the metal component.

    Abstract translation: 提供包含粘附到其表面上的金属成分和树脂成分的包覆成型复合结构体。 树脂组分由含有至少一种聚芳硫醚和至少一种矿物填料的热塑性组合物形成。 本发明人已经发现,热塑性组合物中聚亚芳基硫化物,矿物填料和/或其它材料的性质和相对浓度可以选择性地定制,使得所得到的树脂组分具有线性热膨胀系数和/或颜色系数 类似于金属部件。

    Overmolded composite structure for an electronic device
    36.
    发明授权
    Overmolded composite structure for an electronic device 失效
    用于电子设备的包覆成型复合结构

    公开(公告)号:US08663764B2

    公开(公告)日:2014-03-04

    申请号:US13621874

    申请日:2012-09-18

    Applicant: Ticona LLC

    Inventor: Rong Luo Xinyu Zhao

    Abstract: An overmolded composite structure that contains a metal component and a resinous component adhered to a surface thereof is provided. The resinous component is formed from a thermoplastic composition that contains at least one polyarylene sulfide and at least one mineral filler. The present inventors have discovered that the nature and relative concentration of the polyarylene sulfides, mineral fillers, and/or other materials in the thermoplastic composition can be selectively tailored so that the resulting resinous component has a coefficient of linear thermal expansion and/or color that is similar to the metal component.

    Abstract translation: 提供包含粘附到其表面上的金属成分和树脂成分的包覆成型复合结构体。 树脂组分由含有至少一种聚芳硫醚和至少一种矿物填料的热塑性组合物形成。 本发明人已经发现,热塑性组合物中聚亚芳基硫化物,矿物填料和/或其它材料的性质和相对浓度可以选择性地定制,使得所得到的树脂组分具有线性热膨胀系数和/或颜色系数 类似于金属部件。

    Polyarylene Sulfide Fibers and Composites Including the Fibers
    37.
    发明申请
    Polyarylene Sulfide Fibers and Composites Including the Fibers 审中-公开
    包含纤维的聚亚芳基硫醚纤维和复合材料

    公开(公告)号:US20130273799A1

    公开(公告)日:2013-10-17

    申请号:US13799956

    申请日:2013-03-13

    Applicant: TICONA LLC

    Inventor: Rong Luo Xinyu Zhao

    Abstract: Polyarylene sulfide fibers and products that incorporate the polyarylene sulfide fibers are described as are methods of forming the fibers and products. The polyarylene sulfide fibers can incorporate a reactively functionalized polyarylene sulfide that can provide improved compatibility between the polyarylene sulfide and other materials, including both additives to the polyarylene sulfide composition that is used to form the fibers and external materials that may be located adjacent to the fibers in a composite.

    Abstract translation: 聚芳硫醚纤维和引入聚芳硫醚纤维的产品被描述为形成纤维和产品的方法。 聚芳硫醚纤维可以引入反应性官能化的聚芳硫醚,其可以提供聚芳硫醚和其它材料之间改善的相容性,包括用于形成纤维的聚芳硫醚组合物的两种添加剂和可以位于纤维附近的外部材料 在复合材料中。

    Ultraviolet Radiation Stabilized Polyarylene Sulfide Composition
    38.
    发明申请
    Ultraviolet Radiation Stabilized Polyarylene Sulfide Composition 审中-公开
    紫外辐射稳定聚亚芳基硫化物组成

    公开(公告)号:US20130273283A1

    公开(公告)日:2013-10-17

    申请号:US13799204

    申请日:2013-03-13

    Applicant: Ticona LLC

    Abstract: Disclosed is a UV stabilized polyarylene sulfide composition, methods of forming the composition, and UV stabilized products that can be formed of the composition. The UV stabilized polyarylene sulfide composition can include a reactively functionalized polyarylene sulfide polymer in conjunction with a UV stabilizer. The reactivity of the polyarylene sulfide polymer is formed during melt processing via reaction of a reactively functionalized disulfide compound with a starting polyarylene sulfide. The reactivity of the polyarylene sulfide can encourage interaction between the polyarylene sulfide polymer and the UV stabilizer, which can improve dispersion of the UV stabilizer throughout the composition and improve miscibility between the polyarylene sulfide polymer and the UV stabilizer. Products can incorporate high concentrations of UV stabilizer and/or can be formed to very small cross sectional dimensions without phase separation between the UV stabilizer and the polyarylene sulfide.

    Abstract translation: 公开了一种紫外线稳定化的聚芳硫醚组合物,形成组合物的方法和可以由该组合物形成的UV稳定化产物。 UV稳定化聚芳硫醚组合物可以包括与UV稳定剂结合的反应性官能化聚芳硫醚聚合物。 通过反应性官能化的二硫化物化合物与起始聚芳硫醚的反应,在熔融加工过程中形成聚芳硫醚聚合物的反应性。 聚芳硫醚的反应性可以促进聚芳硫醚聚合物和UV稳定剂之间的相互作用,这可以改善UV稳定剂在整个组合物中的分散,并改善聚芳硫醚聚合物和UV稳定剂之间的混溶性。 产品可以并入高浓度的UV稳定剂和/或可以形成非常小的横截面尺寸,而不会在UV稳定剂和聚芳硫醚之间相分离。

    Housing for a Portable Electronic Device
    39.
    发明申请
    Housing for a Portable Electronic Device 有权
    便携式电子设备外壳

    公开(公告)号:US20130249357A1

    公开(公告)日:2013-09-26

    申请号:US13621865

    申请日:2012-09-18

    Applicant: TICONA LLC

    CPC classification number: H05K5/03 C08G75/029 C08K5/372 C08K7/02 C08L81/02

    Abstract: An injection molded housing for a portable electronic device is provided. The housing contains a thermoplastic composition that includes a polyarylene sulfide melt processed in the presence of a disulfide compound and a filler. Without intending to be limited by theory, it is believed that the disulfide can undergo a chain scission reaction with the starting polyarylene sulfide to lower its melt viscosity, which can lead to decreased attrition of the filler and thus improved mechanical properties. Due to this ability to reduce viscosity during melt processing, the present inventors have discovered that relatively high molecular weight polyarylene sulfides can be fed to the extruder with little difficulty.

    Abstract translation: 提供了一种用于便携式电子设备的注塑外壳。 壳体包含热塑性组合物,其包含在二硫化物化合物和填料的存在下加工的聚芳硫醚熔体。 不期望受理论的限制,相信二硫化物可以与起始聚芳硫醚发生断链反应以降低其熔体粘度,这可导致填料的磨损减少,从而改善机械性能。 由于这种在熔融加工过程中降低粘度的能力,本发明人已经发现,相对高分子量的聚亚芳基硫化物可以很少地进料到挤出机中。

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