中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

94 records (took 0.029 seconds)

    Composite Structure
    3.
    发明申请
    Composite Structure 审中-公开

    公开(公告)号：US20190030771A1

    公开(公告)日：2019-01-31

    申请号：US15550187

    申请日：2016-03-24

    Applicant: Ticona LLC

    Inventor： Junchen Ding ,  Yanjun Li ,  Rong Luo

    IPC: B29C45/14 ,  C08L81/04 ,  C08L33/06 ,  C08G59/06 ,  C08K7/14

    Abstract: A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.

    Polyaryletherketone Composition
    5.
    发明申请
    Polyaryletherketone Composition 审中-公开

    公开(公告)号：US20170267838A1

    公开(公告)日：2017-09-21

    申请号：US15430623

    申请日：2017-02-13

    Applicant: Ticona LLC

    Inventor： Bing Lu ,  Rong Luo ,  Xinyu Zhao

    IPC: C08K7/14 ,  C08L61/16

    Abstract: A polymer composition that contains a polyaryletherketone and a plurality of reinforcing fibers is provided. The reinforcing fibers have an aspect ratio of from about 1.5 to about 10, which is defined as the cross-sectional width of the fibers divided by the cross-sectional thickness of the fibers.

    Continuous fiber reinforced polyarylene sulfide
    8.
    发明授权
    Continuous fiber reinforced polyarylene sulfide 有权
    连续纤维增强聚芳硫醚

    公开(公告)号：US09394430B2

    公开(公告)日：2016-07-19

    申请号：US13800130

    申请日：2013-03-13

    Applicant: Ticona LLC

    Inventor： Rong Luo ,  Aaron Johnson ,  Tim Tibor ,  Xinyu Zhao ,  David Eastep

    IPC: C08K7/06 ,  B32B5/12 ,  B32B5/26 ,  B32B5/28 ,  C08J5/24

    CPC classification number: C08K7/06 ,  B32B5/12 ,  B32B5/26 ,  B32B5/28 ,  B32B2250/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/546 ,  B32B2605/00 ,  C08J5/24 ,  C08J2381/04 ,  Y10T428/1352 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947

    Abstract: A continuous fiber composite is described and methods for forming the continuous fiber composite. The continuous fiber composite includes a plurality of unidirectionally aligned continuous fibers embedded within a polyarylene sulfide polymer. The continuous fiber composite includes a very high loading of continuous fibers, for instance greater than about 40% by weight of the continuous fiber composite. The continuous fiber composite is formed by reacting a starting polyarylene sulfide with a reactively functionalized disulfide compound in a melt processing unit. Reaction between the starting polyarylene sulfide and the reactively functionalized disulfide compound leads to formation of a reactively functionalized polyarylene sulfide. Upon embedding of the continuous fibers into the reactively functionalized polyarylene sulfide, the reactivity of the polyarylene sulfide can enhance adhesion between the polyarylene sulfide polymer and the fibers.

    Abstract translation: 描述连续纤维复合材料和形成连续纤维复合材料的方法。 连续纤维复合材料包括嵌入聚芳硫醚聚合物内的多个单向排列的连续纤维。 连续纤维复合材料包括连续纤维的非常高的载量，例如大于连续纤维复合材料的约40重量％。 连续纤维复合材料通过在熔融加工单元中使起始聚芳硫醚与反应性官能化的二硫化物化合物反应形成。 起始聚芳硫醚和反应性官能化二硫化物化合物之间的反应导致形成反应官能化的聚芳硫醚。 在将连续纤维嵌入反应性官能化聚芳硫醚中时，聚芳硫醚的反应性可以增强聚芳硫醚聚合物与纤维之间的粘合性。

    Housing for a portable electronic device
    9.
    发明授权
    Housing for a portable electronic device 有权
    便携式电子设备的外壳

    公开(公告)号：US09119307B2

    公开(公告)日：2015-08-25

    申请号：US13621865

    申请日：2012-09-18

    Applicant: Ticona LLC

    Inventor： Rong Luo ,  Xinyu Zhao ,  Ke Feng

    IPC: C08K3/34 ,  H05K5/03 ,  C08K5/372 ,  C08G75/02 ,  C08K7/02

    CPC classification number: H05K5/03 ,  C08G75/029 ,  C08K5/372 ,  C08K7/02 ,  C08L81/02

    Abstract: An injection molded housing for a portable electronic device is provided. The housing contains a thermoplastic composition that includes a polyarylene sulfide melt processed in the presence of a disulfide compound and a filler. Without intending to be limited by theory, it is believed that the disulfide can undergo a chain scission reaction with the starting polyarylene sulfide to lower its melt viscosity, which can lead to decreased attrition of the filler and thus improved mechanical properties. Due to this ability to reduce viscosity during melt processing, the present inventors have discovered that relatively high molecular weight polyarylene sulfides can be fed to the extruder with little difficulty.

    Abstract translation: 提供了一种用于便携式电子设备的注塑外壳。 壳体包含热塑性组合物，其包含在二硫化物化合物和填料的存在下加工的聚芳硫醚熔体。 不期望受理论的限制，相信二硫化物可以与起始聚芳硫醚发生断链反应以降低其熔体粘度，这可导致填料的磨损减少，从而改善机械性能。 由于这种在熔融加工过程中降低粘度的能力，本发明人已经发现，相对高分子量的聚亚芳基硫化物可以很少地进料到挤出机中。

    Thermoplastic composition for use in forming a laser direct structured substrate
    10.
    发明授权
    Thermoplastic composition for use in forming a laser direct structured substrate 有权
    用于形成激光直接结构化基材的热塑性组合物

    公开(公告)号：US09074070B2

    公开(公告)日：2015-07-07

    申请号：US13658063

    申请日：2012-10-23

    Applicant: Ticona LLC

    Inventor： Paul C. Yung ,  Rong Luo

    IPC: C08K3/22 ,  C09K19/38 ,  C08K3/04 ,  C08K3/40 ,  C08L67/03 ,  C08K3/36

    CPC classification number: C08K3/36 ,  C08K3/22 ,  C09K19/38 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107

    Abstract: A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process (“LDS”).

    Abstract translation: 提供了包含热致液晶聚合物，介电材料，激光可激活添加剂和纤维填料的独特组合的热塑性组合物。 在本发明中选择性地控制组分的性质和/或它们的浓度以保持高的介电常数，良好的机械性能（例如，负载下的挠曲）和良好的加工性（例如低粘度），但仍然是激光可激活的 。 因此，热塑性组合物可以容易地成形为薄的衬底，并随后使用激光直接结构化工艺（“LDS”）施加一个或多个导电元件。

Patent Agency Ranking