公开(公告)号：US11832373B2

公开(公告)日：2023-11-28

申请号：US17949925

申请日：2022-09-21

Applicant: Tokyo Electron Limited

Inventor： Yohei Yamazawa ,  Takehisa Saito ,  Mayo Uda ,  Keigo Toyoda ,  Alok Ranjan ,  Toshiki Nakajima

IPC: H05H1/46 ,  H01J37/32 ,  H01L21/67

CPC classification number: H05H1/46 ,  H01J37/3211 ,  H01J37/3244 ,  H01J37/32495 ,  H01L21/67069 ,  H05H1/4652

Abstract: A plasma processing apparatus includes an antenna configured to generate plasma of a processing gas in a chamber. The antenna includes: an inner coil provided around the gas supply unit to surround a gas supply unit; and an outer coil provided around the gas supply unit and the inner coil to surround them. The outer coil is configured such that both ends of a wire forming the outer coil are opened; power is supplied from a power supply unit to a central point of the wire; the vicinity of the central point of the wire is grounded; and the outer coil resonates at a wavelength that is a half of a wavelength of the high frequency power. The inner coil is configured such that both ends of a wire forming the inner coil are connected through a capacitor and the inner coil is inductively coupled with the inner coil.

公开(公告)号：US11817296B2

公开(公告)日：2023-11-14

申请号：US16913545

申请日：2020-06-26

Applicant: Tokyo Electron Limited

Inventor： Barton Lane ,  Merritt Funk ,  Yohei Yamazawa ,  Justin Moses ,  Chelsea DuBose ,  Michael Hummel

IPC: H01J37/32 ,  G01R29/08

CPC classification number: H01J37/32174 ,  G01R29/0878

Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.

公开(公告)号：US20230132660A1

公开(公告)日：2023-05-04

申请号：US17514815

申请日：2021-10-29

Applicant: Tokyo Electron Limited

Inventor： Chelsea Dubose ,  Barton Lane ,  Merritt Funk ,  Justin Moses ,  Yohei Yamazawa

IPC: H01J37/32 ,  H01Q13/18 ,  H01Q1/38 ,  H01Q7/00

Abstract: A radio frequency (RF) system including: a first conductive covering surface, a portion of the first conductive covering surface including a portion of the first outer wall of a first RF device; a second conductive covering surface aligned to the first conductive covering surface, the second conductive covering surface being disposed around the insulating hole; an insulating hole for an RF center conductor extending through the first conductive covering surface and the second conductive covering surface, the first conductive covering surface and the second conductive covering surface being disposed around the insulating hole; a cavity bounded by the first conductive covering surface and the second conductive covering surface, the cavity being an insulating region; and an RF signal pickup disposed within the cavity.

公开(公告)号：US11600474B2

公开(公告)日：2023-03-07

申请号：US16913526

申请日：2020-06-26

Applicant: Tokyo Electron Limited

Inventor： Barton Lane ,  Merritt Funk ,  Yohei Yamazawa ,  Justin Moses ,  Chelsea Dubose ,  Michael Hummel

IPC: H01J37/32 ,  H01J37/24

Abstract: A radio frequency (RF) system includes a RF power source configured to power a load with an RF signal; an RF pipe including an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; and a current sensor aligned to a central axis of the RF pipe carrying the RF signal. A sensor casing is disposed around the RF pipe, where the sensor casing includes a conductive material connected to the outer conductor of the RF pipe. A gallery is disposed within the sensor casing and outside the outer conductor of the RF pipe, where the current sensor is disposed in the gallery. A slit in the outer conductor of the RF pipe exposes the current sensor to a magnetic field due to the current of the RF signal in the inner conductor of the RF pipe.

公开(公告)号：US11470712B2

公开(公告)日：2022-10-11

申请号：US16144714

申请日：2018-09-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei Yamazawa ,  Takehisa Saito ,  Mayo Uda ,  Keigo Toyoda ,  Alok Ranjan ,  Toshiki Nakajima

IPC: H05H1/46 ,  H01J37/32 ,  H01L21/67

Abstract: A plasma processing apparatus includes an antenna configured to generate plasma of a processing gas in a chamber. The antenna includes: an inner coil provided around the gas supply unit to surround a gas supply unit; and an outer coil provided around the gas supply unit and the inner coil to surround them. The outer coil is configured such that both ends of a wire forming the outer coil are opened; power is supplied from a power supply unit to a central point of the wire; the vicinity of the central point of the wire is grounded; and the outer coil resonates at a wavelength that is a half of a wavelength of the high frequency power. The inner coil is configured such that both ends of a wire forming the inner coil are connected through a capacitor and the inner coil is inductively coupled with the inner coil.

公开(公告)号：US20220108871A1

公开(公告)日：2022-04-07

申请号：US17495760

申请日：2021-10-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei Yamazawa ,  Takehisa Saito ,  Naoki Fujiwara ,  Kaori Fujiwara ,  Daisuke Kurashina ,  Yuki Hosaka

IPC: H01J37/32 ,  H01Q7/00

Abstract: A plasma processing apparatus includes: a main coil disposed on or above a plasma processing chamber; and a sub-coil assembly disposed radially inside or outside the main coil. The sub-coil assembly includes a first spiral coil and a second spiral coil. Each turn of the first spiral coil and each turn of the second spiral coil are alternately arranged in a vertical direction. A first upper terminal of the first spiral coil is connected to a ground potential via one or more capacitors, and a first lower terminal of the first spiral coil is connected to the ground potential. A second upper terminal of the second spiral coil is connected to the ground potential via one or more capacitors or one or more other capacitors, and a second lower terminal of the second spiral coil is connected to the ground potential.

公开(公告)号：US20210407770A1

公开(公告)日：2021-12-30

申请号：US16913545

申请日：2020-06-26

Applicant: Tokyo Electron Limited

Inventor： Justin Moses ,  Barton Lane ,  Merritt Funk ,  Chelsea Dubose ,  Yohei Yamazawa ,  Michael Hummel

IPC: H01J37/32 ,  G01R29/08

Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.

公开(公告)号：US10916410B2

公开(公告)日：2021-02-09

申请号：US16068696

申请日：2017-01-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei Yamazawa ,  Atsuki Furuya

IPC: C23C16/00 ,  H01L21/306 ,  H01J37/32 ,  C23C16/509 ,  C23C16/455 ,  C23C16/52 ,  H05H1/46

Abstract: A plasma processing apparatus includes a processing chamber, a high frequency power supply and a load variation stabilization circuit. The high frequency power supply is configured to supply a high frequency power to the processing chamber and generate plasma inside the processing chamber. The load variation stabilization circuit is connected in parallel with the processing chamber at a connection portion provided between the high frequency power supply and the processing chamber. The load variation stabilization circuit is configured to suppress variation in a load impedance when viewing a downstream side from the connection portion.

公开(公告)号：US10854431B2

公开(公告)日：2020-12-01

申请号：US16708856

申请日：2019-12-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Yoshinobu Ohya ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa ,  Hidetoshi Hanaoka ,  Toshihiro Hayami ,  Hiroki Yamazaki ,  Manabu Sato

IPC: H01J37/32 ,  H01L21/67

Abstract: A plasma processing method includes executing an etching process that includes supplying an etching gas into a process container in which a target substrate is supported on a second electrode serving as a lower electrode, and applying an RF power for plasma generation and an RF power for ion attraction to turn the etching gas into plasma and to subject the target substrate to etching. The etching process includes applying a negative DC voltage to a first electrode serving as an upper electrode during the etching to increase an absolute value of self-bias on the first electrode. The etching process includes releasing DC electron current generated by the negative DC voltage to ground through plasma and a conductive member disposed as a ring around the first electrode, by using a first state where the conductive member is connected to a ground potential portion.

公开(公告)号：US10679867B2

公开(公告)日：2020-06-09

申请号：US15590356

申请日：2017-05-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei Yamazawa

IPC: H01L21/00 ,  H01L21/67 ,  H01J37/32 ,  H01F21/00 ,  H01F21/04 ,  H01L21/3065 ,  H05K9/00 ,  H01F30/04 ,  H02M1/00

Abstract: A capacitively-coupled plasma processing apparatus includes: at least one chamber body providing chambers separated from each other; upper electrodes respectively installed in upper spaces within the chambers; lower electrodes respectively installed in lower spaces within the chambers; a high frequency power supply; a transformer including a primary coil electrically connected to the high frequency power supply, and secondary coils each of which coils having a first end and a second end; first condensers respectively connected between each of the first ends of the secondary coils and the upper electrodes; and second condensers respectively connected between each of the second ends of the secondary coils and the lower electrodes. The primary coil extends around a central axis. The secondary coils are configured to be coaxially disposed with respect to the primary coil. A self-inductance of each of the secondary coils is smaller than that of the primary coil.