公开(公告)号：US06380566B1

公开(公告)日：2002-04-30

申请号：US09669737

申请日：2000-09-26

申请人： Tomoko Matsudai ,  Yusuke Kawaguchi ,  Kazutoshi Nakamura ,  Hirofumi Nagano ,  Akio Nakagawa

发明人： Tomoko Matsudai ,  Yusuke Kawaguchi ,  Kazutoshi Nakamura ,  Hirofumi Nagano ,  Akio Nakagawa

IPC分类号： H01L2974

CPC分类号： H01L29/7824 ,  H01L29/0847 ,  H01L29/7816 ,  H01L29/7835 ,  H01L29/78624

摘要： An N-MOSFET is formed on an SOI substrate consisting of a semiconductor substrate, an insulating layer and an n−-active layer. A p-well layer, an n-RESURF layer, and an n-diffusion layer are formed in the surface of the n−-active layer between a source electrode and a drain electrode by means of impurity diffusion. The diffusion regions of the p-well layer and the n-RESURF layer overlap with each other. An end of the n-RESURF layer reaches a position below a gate electrode. The diffusion regions of the p-well layer and the n-diffusion layer do not overlap with each other, so that the n-RESURF layer has a region in direct contact with the n−-active layer between the p-well layer and the n-diffusion layer.

摘要翻译： 在由半导体衬底，绝缘层和n-活性层组成的SOI衬底上形成N-MOSFET。 通过杂质扩散在源电极和漏电极之间的n-活性层的表面上形成p阱层，n-RESURF层和n扩散层。 p阱层和n-RESURF层的扩散区域彼此重叠。 n-RESURF层的一端到达栅电极下方的位置。 p阱层和n扩散层的扩散区域彼此不重叠，使得n-RESURF层具有与p阱层和p阱层之间的n-活性层直接接触的区域 n扩散层。

公开(公告)号：US6163051A

公开(公告)日：2000-12-19

申请号：US154041

申请日：1998-09-16

申请人： Akio Nakagawa ,  Tomoko Matsudai ,  Hideyuki Funaki ,  Norio Yasuhara

发明人： Akio Nakagawa ,  Tomoko Matsudai ,  Hideyuki Funaki ,  Norio Yasuhara

IPC分类号： H01L21/331 ,  H01L29/06 ,  H01L29/739 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/66325 ,  H01L29/0696 ,  H01L29/7394 ,  H01L29/7398

摘要： A high breakdown voltage semiconductor device comprising a first base region of a first conductivity type, a second base region of a second conductivity type, which is formed in a surface region of the first base region, a first gate insulation film formed on an inner wall of a first LOCOS groove formed passing through the second base region to reach the first base region, a first gate electrode formed on the first gate insulation film, a first source region of a first conductivity type, which is formed in a surface region of the second base region around the first LOCOS groove in such a manner as to contact with the first gate insulating film, a first drain region formed in a surface region of the first base region in such a manner as to be spaced apart from the second base region, a source electrode formed on the first source region and on the second base region, and a drain electrode formed on the first drain region.

摘要翻译： 一种高耐压电压半导体器件，包括第一导电类型的第一基极区域和形成在第一基极区域的表面区域中的第二导电类型的第二基极区域，形成在内壁上的第一栅极绝缘膜 形成为穿过第二基极区域以到达第一基极区域的第一LOCOS沟槽，形成在第一栅极绝缘膜上的第一栅极电极，形成在第一栅极绝缘膜的表面区域中的第一导电类型的第一源极区域， 第二基区，以与第一栅极绝缘膜接触的方式围绕第一LOCOS沟槽;第一漏极区，形成在第一基极区域的表面区域中，以与第二基极区域隔开; 形成在第一源极区域和第二基极区域上的源电极以及形成在第一漏极区域上的漏电极。

公开(公告)号：US5994740A

公开(公告)日：1999-11-30

申请号：US972148

申请日：1997-11-17

申请人： Akio Nakagawa ,  Yoshihiro Yamaguchi ,  Tomoko Matsudai

发明人： Akio Nakagawa ,  Yoshihiro Yamaguchi ,  Tomoko Matsudai

IPC分类号： H01L21/84 ,  H01L27/12 ,  H01L27/01 ,  H01L31/0392

CPC分类号： H01L21/84 ,  H01L27/1203

摘要： An n.sup.- -type silicon active layer having a thickness of 6 .mu.m or less is formed on a silicon substrate via a silicon oxide film. An npn bipolar transistor with a low withstand voltage and an IGBT with a high withstand voltage are formed in the active layer. The two devices are insulated and isolated from each other through a trench. The bipolar transistor has an n-type well layer formed in the surface of the active layer. A p-type well layer is formed in the surface of the n-type well layer. The thickness of the n-type well layer under the p-type well layer is set to be 1 .mu.m or more. A first n.sup.+ -type diffusion layer is formed in the surface of the n-type well layer. A p.sup.+ -type diffusion layer and a second n.sup.+ -type diffusion layer are formed in the surface of the p-type well layer. The n-type well layer and the first n.sup.+ -type diffusion layer serve as a collector region. The p-type well layer and the p.sup.+ -type diffusion layer serve as a base region. The second n.sup.+ -type diffusion layer serves as an emitter region.

摘要翻译： 通过氧化硅膜在硅衬底上形成厚度为6μm以下的n型硅有源层。 在有源层中形成具有低耐压的npn双极晶体管和具有高耐压的IGBT。 两个器件通过沟槽彼此绝缘和隔离。 双极晶体管在有源层的表面形成有n型阱层。 p型阱层形成于n型阱层的表面。 p型阱层下面的n型阱层的厚度设定为1μm以上。 在n型阱层的表面形成第一n +型扩散层。 在p型阱层的表面形成p +型扩散层和第n +型扩散层。 n型阱层和第一n +型扩散层用作集电极区域。 p型阱层和p +型扩散层用作基极区域。 第二n +型扩散层用作发射极区域。

公开(公告)号：US5438220A

公开(公告)日：1995-08-01

申请号：US085056

申请日：1993-07-02

申请人： Akio Nakagawa ,  Norio Yasuhara ,  Tomoko Matsudai ,  Yoshihiro Yamaguchi ,  Ichiro Omura ,  Hideyuki Funaki

发明人： Akio Nakagawa ,  Norio Yasuhara ,  Tomoko Matsudai ,  Yoshihiro Yamaguchi ,  Ichiro Omura ,  Hideyuki Funaki

IPC分类号： H01L21/336 ,  H01L21/74 ,  H01L21/762 ,  H01L27/06 ,  H01L27/092 ,  H01L27/12 ,  H01L29/06 ,  H01L29/08 ,  H01L29/40 ,  H01L29/739 ,  H01L29/74 ,  H01L29/745 ,  H01L29/749 ,  H01L29/78 ,  H01L29/786 ,  H01L29/861

CPC分类号： H01L29/404 ,  H01L21/74 ,  H01L21/76264 ,  H01L21/76297 ,  H01L27/0623 ,  H01L27/0922 ,  H01L27/1203 ,  H01L29/0834 ,  H01L29/402 ,  H01L29/405 ,  H01L29/407 ,  H01L29/408 ,  H01L29/66772 ,  H01L29/7394 ,  H01L29/7436 ,  H01L29/7455 ,  H01L29/749 ,  H01L29/7824 ,  H01L29/7835 ,  H01L29/78624 ,  H01L29/8611 ,  H01L21/76275 ,  H01L21/76286 ,  H01L29/78603 ,  H01L2924/0002

摘要： A high breakdown voltage semiconductor device includes a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivity type, a first impurity region of the first conductivity type formed in the active layer, and a second impurity region of a second conductivity type formed in the active layer and spaced apart from the first impurity region by a predetermined distance. The first impurity region is formed of diffusion layers. The diffusion layers are superimposed one upon another and differ in diffusion depth or diffusion window width, or both.

摘要翻译： 高耐压半导体器件包括半导体衬底，形成在半导体衬底上的绝缘层，形成在绝缘层上并由第一导电类型的高电阻半导体形成的有源层，第一导电类型的第一杂质区 形成在有源层中的第二杂质区和形成在有源层中并与第一杂质区隔开预定距离的第二导电类型的第二杂质区。 第一杂质区由扩散层形成。 扩散层彼此叠加并且扩散深度或扩散窗宽度不同，或两者均不同。

公开(公告)号：US5428228A

公开(公告)日：1995-06-27

申请号：US164756

申请日：1993-12-10

申请人： Tsuneo Ogura ,  Kiminori Watanabe ,  Akio Nakagawa ,  Yoshihiro Yamaguchi ,  Norio Yasuhara ,  Tomoko Matsudai ,  Shigeru Hasegawa ,  Kazuya Nakayama

发明人： Tsuneo Ogura ,  Kiminori Watanabe ,  Akio Nakagawa ,  Yoshihiro Yamaguchi ,  Norio Yasuhara ,  Tomoko Matsudai ,  Shigeru Hasegawa ,  Kazuya Nakayama

IPC分类号： H01L27/06 ,  H01L29/74 ,  H01L29/745 ,  H01L29/749 ,  H01L29/747

CPC分类号： H01L27/0617 ,  H01L29/7436 ,  H01L29/7455 ,  H01L29/749

摘要： A thyristor with insulated gates includes turn-off and turn-on MOSFETs. The turn-on MOSFET has a turn-on gate employing a p-type base as a channel and extending over an n-type base and an n-type emitter. The turn-off MOSFET has n-type drain and source layers formed in a p-type base layer, and a turn-off gate extending over the drain and source layers. The n-type drain layer is short-circuited with the p-type base layer via a drain electrode. The drain electrode is formed near an n-type emitter layer. When the thyristor is to be turned off, the first voltage is applied to the turn-on gate, and the second voltage is applied to the turn-off gate while the first voltage is applied to the turn-on gate. After the application of the second voltage continues for a predetermined period of time, the application of the first voltage to the turn-on gate is stopped. With this operation, the thyristor can be turned off even with a large current.

摘要翻译： 具有绝缘栅极的晶闸管包括关断和导通MOSFET。 导通MOSFET具有采用p型基极作为沟道并在n型基极和n型发射极上延伸的导通栅极。 关断MOSFET具有形成在p型基极层中的n型漏极和源极层，以及在漏极和源极层上延伸的截止栅极。 n型漏极层经由漏电极与p型基极层短路。 在n型发射极层附近形成漏电极。 当晶闸管关断时，第一电压被施加到导通栅极，并且第二电压被施加到关断栅极，同时第一电压被施加到导通栅极。 在第二电压的施加持续预定时间段之后，停止向导通门施加第一电压。 通过这种操作，即使使用大电流，晶闸管也可以关闭。

公开(公告)号：US20100096696A1

公开(公告)日：2010-04-22

申请号：US12645072

申请日：2009-12-22

申请人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Tomoko Matsudai ,  Kenichi Matsushita

发明人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Tomoko Matsudai ,  Kenichi Matsushita

IPC分类号： H01L29/78

CPC分类号： H01L29/0847 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/42368 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/7816 ,  H01L29/7835

摘要： A body layer of a first conductivity type is formed on a semiconductor substrate, and a source layer of a second conductivity type is formed in a surface region of the body layer. An offset layer of the second conductivity type is formed on the semiconductor substrate, and a drain layer of the second conductivity type is formed in a surface region of the offset layer. An insulating film is embedded in a trench formed in the surface region of the offset layer between the source layer and the drain layer. A gate insulating film is formed on the body layer and the offset layer between the source layer and the insulating film. A gate electrode is formed on the gate insulating film. A first peak of an impurity concentration profile in the offset layer is formed at a position deeper than the insulating film.

摘要翻译： 在半导体衬底上形成第一导电类型的主体层，并且在主体层的表面区域中形成第二导电类型的源极层。 第二导电类型的偏移层形成在半导体衬底上，并且第二导电类型的漏极层形成在偏移层的表面区域中。 绝缘膜嵌入形成在源极层和漏极层之间的偏移层的表面区域中的沟槽中。 在主体层和源极层与绝缘膜之间的偏移层上形成栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 偏移层中的杂质浓度分布的第一峰形成在比绝缘膜更深的位置。

公开(公告)号：US07692242B2

公开(公告)日：2010-04-06

申请号：US11505337

申请日：2006-08-17

申请人： Tomoko Matsudai ,  Norio Yasuhara ,  Yusuke Kawaguchi ,  Kenichi Matsushita

发明人： Tomoko Matsudai ,  Norio Yasuhara ,  Yusuke Kawaguchi ,  Kenichi Matsushita

IPC分类号： H01L29/04 ,  H01L29/06

CPC分类号： H01L29/1045 ,  H01L21/26586 ,  H01L29/1083 ,  H01L29/1087 ,  H01L29/66659 ,  H01L29/7835 ,  H01L29/7838

摘要： A low resistance layer is formed on a semiconductor substrate, and a high resistance layer formed on the low resistance layer. A source region of a first conductivity type is formed on a surface region of the high resistance layer. A drain region of the first conductivity type is formed at a distance from the source region. A first resurf region of the first conductivity type is formed in a surface region of the high resistance layer between the source region and the drain region. A channel region of a second conductivity type is formed between the source region and the first resurf region. A gate insulating film is formed on the channel region, and a gate electrode formed on the gate insulating film. An impurity concentration in the channel region under the gate electrode gradually lowers from the source region toward the first resurf region.

摘要翻译： 在半导体衬底上形成低电阻层，形成在低电阻层上的高电阻层。 第一导电类型的源区形成在高电阻层的表面区域上。 第一导电类型的漏极区域形成在与源极区域一定距离处。 在源极区域和漏极区域之间的高电阻层的表面区域中形成第一导电类型的第一再结晶区域。 在源极区域和第一再结晶区域之间形成第二导电类型的沟道区域。 栅极绝缘膜形成在沟道区上，栅极形成在栅极绝缘膜上。 栅电极下方的沟道区域中的杂质浓度从源极区域朝向第一再结晶区域逐渐降低。

公开(公告)号：US20100006936A1

公开(公告)日：2010-01-14

申请号：US12476147

申请日：2009-06-01

申请人： Tomoko Matsudai ,  Norio Yasuhara ,  Kazutoshi Nakamura

发明人： Tomoko Matsudai ,  Norio Yasuhara ,  Kazutoshi Nakamura

IPC分类号： H01L29/78

CPC分类号： H01L29/7835 ,  H01L21/266 ,  H01L29/0847 ,  H01L29/1045 ,  H01L29/1083 ,  H01L29/1087 ,  H01L29/66659

摘要： A semiconductor device includes a semiconductor layer of a first conductivity type; a deep well of a second conductivity type formed in a portion of an upper layer portion of the semiconductor layer; a well of the first conductivity type formed in a portion of an upper layer portion of the deep well; a source layer of the second conductivity type formed in the well; a drain layer of the second conductivity type formed in the well apart from the source layer; and a contact layer of the second conductivity type formed outside the well in an upper layer portion of the deep well and connected to the drain layer. The drain layer is electrically connected to the deep well via the well by applying a driving voltage between the source layer and the drain layer.

摘要翻译： 半导体器件包括第一导电类型的半导体层; 形成在半导体层的上层部分的一部分中的第二导电类型的深阱; 形成在深井的上层部分的一部分中的第一导电类型的阱; 在井中形成的第二导电类型的源极层; 第二导电类型的漏极层形成在远离源极的阱中; 以及在阱的上层部分中形成在阱外部并连接到漏极层的第二导电类型的接触层。 通过在源极层和漏极层之间施加驱动电压，漏极层通过阱与深阱电连接。

公开(公告)号：US07589389B2

公开(公告)日：2009-09-15

申请号：US12264580

申请日：2008-11-04

申请人： Tomoko Matsudai ,  Norio Yasuhara

发明人： Tomoko Matsudai ,  Norio Yasuhara

IPC分类号： H01L23/58

CPC分类号： H01L29/7816 ,  H01L29/063 ,  H01L29/0878 ,  H01L29/1045 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/66681 ,  H01L29/7835 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device comprising: a base layer of a first conductivity type selectively formed above a semiconductor substrate; a gate electrode formed on the base layer via the insulating film; a source layer of a second conductivity type selectively formed at a surface of the base layer at one side of the gate electrode; an channel implantation layer selectively formed at the surface of the base layer so as to be adjacent to the source layer below the gate electrode, the channel implantation layer having a higher concentration than the base layer; a RESURF layer of the second conductivity type selectively formed at the surface of the base layer at the other side of the gate electrode; and a drain layer of a second conductivity type being adjacent to the RESURF layer, a portion of the drain layer overlapping the base layer, and the drain layer having a higher concentration than the RESURF layer.

公开(公告)号：US07473978B2

公开(公告)日：2009-01-06

申请号：US11502387

申请日：2006-08-11

申请人： Tomoko Matsudai ,  Norio Yasuhara

发明人： Tomoko Matsudai ,  Norio Yasuhara

IPC分类号： H01L23/58

CPC分类号： H01L29/7816 ,  H01L29/063 ,  H01L29/0878 ,  H01L29/1045 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/66681 ,  H01L29/7835 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device comprising: a base layer of a first conductivity type selectively formed above a semiconductor substrate; a gate electrode formed on the base layer via the insulating film; a source layer of a second conductivity type selectively formed at a surface of the base layer at one side of the gate electrode; an channel implantation layer selectively formed at the surface of the base layer so as to be adjacent to the source layer below the gate electrode, the channel implantation layer having a higher concentration than the base layer; a RESURF layer of the second conductivity type selectively formed at the surface of the base layer at the other side of the gate electrode; and a drain layer of a second conductivity type being adjacent to the RESURF layer, a portion of the drain layer overlapping the base layer, and the drain layer having a higher concentration than the RESURF layer.

摘要翻译： 一种半导体器件，包括：选择性地形成在半导体衬底之上的第一导电类型的基极层; 经由所述绝缘膜形成在所述基底层上的栅电极; 选择性地形成在所述基极层的所述栅电极的一侧的表面处的第二导电类型的源极层; 沟道注入层，其选择性地形成在所述基底层的表面处以与所述栅极电极下方的源极层相邻，所述沟道注入层具有比所述基底层更高的浓度; 所述第二导电类型的RESURF层选择性地形成在所述基极层的所述栅极电极的另一侧的表面处; 以及与RESURF层相邻的第二导电类型的漏极层，所述漏极层的一部分与所述基极层重叠，并且所述漏极层具有比所述RESURF层更高的浓度。