公开(公告)号：US07563487B2

公开(公告)日：2009-07-21

申请号：US10551459

申请日：2004-03-12

申请人： Yasuhito Masuda ,  Yasuhiro Okuda ,  Fumihiro Hayashi ,  Tsuyoshi Haga

发明人： Yasuhito Masuda ,  Yasuhiro Okuda ,  Fumihiro Hayashi ,  Tsuyoshi Haga

IPC分类号： B05D1/00 ,  B05D1/18

CPC分类号： H01L23/4828 ,  G01R1/0408 ,  G01R31/2863 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R43/007 ,  H05K3/4069 ,  Y10T428/24917 ,  H01L2924/00

摘要： The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.

摘要翻译： 本发明涉及一种各向异性导电膜及其制造方法，其中使用由合成树脂制成的电绝缘多孔膜作为基膜，并且其中形成能够在膜厚度方向上具有导电性的导电部分形成 独立地在基膜的多个位置处，以将穿透从第一表面到第二表面的方式将导电金属粘附到多孔结构的树脂部分上。

公开(公告)号：US07338753B2

公开(公告)日：2008-03-04

申请号：US11503303

申请日：2006-08-14

申请人： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

发明人： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

IPC分类号： G03F7/039

CPC分类号： B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

摘要： A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.

摘要翻译： 一种通过使用树脂模具（13）制造金属微结构（1）的方法。 为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造 根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上， 化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。 将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的暴露的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

公开(公告)号：US07219426B2

公开(公告)日：2007-05-22

申请号：US10972514

申请日：2004-10-26

申请人： Tsuyoshi Haga

发明人： Tsuyoshi Haga

IPC分类号： H01R43/16

CPC分类号： G01R1/06738 ,  G01R1/0466 ,  G01R1/06716 ,  G01R3/00 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224

摘要： A method of manufacturing a protruding-volute contact for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming; and performing convex formation of a metal microstructure made from the layer consisting of metallic material so as to form a spiral spring that protrudes volutedly outward. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.

摘要翻译： 一种用于与电子设备或检查设备的电极实现电连续性的突出 - 蜗壳接触的方法，所述方法包括以下步骤：用金属模具形成塑料模具（抗蚀剂结构） 通过电铸在塑料模具（抗蚀剂结构）上形成由金属材料构成的层; 并且由由金属材料构成的层进行金属微观结构的凸起形成，以形成向外突出的螺旋弹簧。 通过这种方法，可以以低成本制造具有高可靠性并且能够实现大电流的电连续性的检查接触或耦合接触。

公开(公告)号：US20060138676A1

公开(公告)日：2006-06-29

申请号：US10553748

申请日：2004-12-09

申请人： Tsuyoshi Haga

发明人： Tsuyoshi Haga

IPC分类号： H01L23/48

CPC分类号： H01M2/204 ,  H01M2/30

摘要： A micro terminal for inspection or installation with high connection reliability is provided at lower cost. A micro terminal according to the present invention has electrical conduction between the micro terminal and an electrode of an electronic device or an inspection device and includes a columnar contactor in contact with the electrode. The contactor has a spring structure which is elastically deformed when pressed against the electrode. The contactor includes a protrusion protruding outwardly at its end in contact with the electrode and the shape of the protrusion has a part of a sphere or a part of a paraboloid of revolution.

摘要翻译： 以较低的成本提供了具有高连接可靠性的检查或安装微型终端。 根据本发明的微型端子在微型端子与电子器件或检查装置的电极之间具有导电性，并且包括与电极接触的柱状接触器。 接触器具有弹簧结构，当按压电极时弹性变形。 接触器包括在其与电极接触的端部向外突出的突起，并且突起的形状具有球体的一部分或旋转抛物面的一部分。

公开(公告)号：US20050176277A1

公开(公告)日：2005-08-11

申请号：US10514828

申请日：2003-04-04

申请人： Tsuyoshi Haga

发明人： Tsuyoshi Haga

IPC分类号： H01R13/03 ,  H01R13/05 ,  H01R13/115 ,  H01R12/00

CPC分类号： H01R13/03 ,  H01R12/55 ,  H01R12/592

摘要： An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in this ring and coupled to this ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the spring electrode. This snap electrode preferably consists of nickel or a nickel alloy or consists of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.

摘要翻译： 本发明的目的是提供一种用于高密度连接的电极，该电极能够包装或FPC的附接/拆卸。 为了达到这个目的，根据本发明的卡扣电极具有呈圆形或多边形部分的管状环和至少一个弹簧电极，该弹簧电极设置在该环中并与该环连接，以连接到基板或FPC 通过用弹簧电极保持插入安装型封装的引线电极或FPC。 该卡扣电极优选由镍或镍合金组成或由铜或铜合金构成，并且优选地涂覆有贵金属或导电类金刚石碳。