-
公开(公告)号：US20110198632A1
公开(公告)日：2011-08-18
申请号：US13096846
申请日：2011-04-28
IPC分类号： H01L27/15
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
-
公开(公告)号：US08461602B2
公开(公告)日：2013-06-11
申请号：US13018330
申请日：2011-01-31
IPC分类号： H01L29/00
CPC分类号： H01L25/0753 , F21K9/27 , F21S8/06 , F21Y2103/10 , F21Y2115/10 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
-
33.发明授权Solid state light sheet having wide support substrate and narrow strips enclosing LED dies in series 有权具有宽的支撑基板和包围LED管芯的窄带的固态光片是串联的公开(公告)号：US08344397B2
公开(公告)日：2013-01-01
申请号：US13100231
申请日：2011-05-03
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
-
公开(公告)号：US08338841B2
公开(公告)日：2012-12-25
申请号：US13096846
申请日：2011-04-28
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
-
35.发明授权Solid state light sheet for general illumination having substrates for creating series connection of dies 有权用于一般照明的固态光片具有用于产生模具的串联连接的基板公开(公告)号：US08338839B2
公开(公告)日：2012-12-25
申请号：US13079706
申请日：2011-04-04
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
-
36.发明申请公开(公告)号：US20110204391A1
公开(公告)日：2011-08-25
申请号：US13100247
申请日：2011-05-03
IPC分类号： H01L27/15
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
-
37.发明申请公开(公告)号：US20110198631A1
公开(公告)日：2011-08-18
申请号：US13096814
申请日：2011-04-28
IPC分类号： H01L27/15
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
-
公开(公告)号：US20110195532A1
公开(公告)日：2011-08-11
申请号：US12870760
申请日：2010-08-27
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , H01L33/48 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare blue-light LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. In one embodiment, an intermediate sheet having holes is then affixed to the bottom substrate, with the LEDs passing through the holes. A transparent top substrate having conductors is then laminated over the intermediate sheet. In another embodiment, no intermediate sheet is used. Various ways to connect the LEDs in series are described along with many embodiments. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture. A phosphor is used to generate white light.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸蓝光LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 在一个实施例中，具有孔的中间片然后被固定到底部基底，LED穿过孔。 然后将具有导体的透明顶部衬底层压在中间片上。 在另一个实施例中，不使用中间片。 多个实施例一起描述了串联连接LED的各种方式。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。 使用荧光体产生白光。
-
公开(公告)号：US20110058372A1
公开(公告)日：2011-03-10
申请号：US12917319
申请日：2010-11-01
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
-
-
-
-
-
-
-
-
搜索结果
39 条记录 (耗时 0.031 秒)
