专利检索 ap:("Yasuharu Sakuma" OR "Satoru Tanaka" OR "Kazuo Koyama" OR "Yujiro Miyauchi" OR "Takeshi Kubota" OR "Atsushi Itami" OR "Hiroaki Kato" OR "Chohachi Sato" OR "Teruo Takeuchi") AND inv:"Teruo Takeuchi" 第 4 页

31.

发明申请
LED PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译： LED封装及其制造方法

公开(公告)号：US20110186902A1

公开(公告)日：2011-08-04

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi , Hiroaki Oshio , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto , Satoshi Shimizu

发明人： Hidenori Egoshi , Hiroaki Oshio , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto , Satoshi Shimizu

IPC分类号： H01L33/48 , H01L33/62

CPC分类号： H01L24/97 , H01L24/45 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2224/85 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子芯片连接到第二引线框架。树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分边缘表面。并且，树脂体的外观是LED封装的外观的一部分。

32.

外观设计
Light-emitting diode 有权

公开(公告)号：USD626097S1

公开(公告)日：2010-10-26

申请号：US29355533

申请日：2010-02-09

申请人： Teruo Takeuchi , Tatsuo Tonedachi , Kazuhisa Iwashita , Satoshi Shimizu

设计人： Teruo Takeuchi , Tatsuo Tonedachi , Kazuhisa Iwashita , Satoshi Shimizu

33.

发明申请
Photo-interrupter and manufacturing method thereof 审中-公开
标题翻译：光电断路器及其制造方法

公开(公告)号：US20050056796A1

公开(公告)日：2005-03-17

申请号：US10910636

申请日：2004-08-04

申请人： Teruo Takeuchi

发明人： Teruo Takeuchi

IPC分类号： H01L31/12 , H03K17/94 , G02B27/00

CPC分类号： H03K17/941 , H03K2217/94104

摘要： A photo-interrupter includes a light-emitting-side internal device provided with a light-emitting chip and formed by molding, and a light-receiving-side internal device provided with a light-receiving chip and formed by molding. The light-emitting-side internal device has a light output face, and the light-receiving-side internal device has a light input face. The light-emitting-side internal device and the light-receiving-side internal device are held by a casing, such that the light output face and the light input face are opposite to each other with a gap interposed therebetween. The light output face and the light input face are respectively disposed in first and second slits formed in the casing. The light output face and the light input face are respectively flush with surfaces of the casing around the first and second slits.

摘要翻译： 光断续器包括设置有发光芯片并通过模制形成的发光侧内部装置，以及设置有受光芯片并通过模制形成的光接收侧内部装置。发光侧内部装置具有光输出面，受光侧内部装置具有光输入面。发光侧内部装置和受光侧内部装置由壳体保持，使得光输出面和光输入面彼此相对并间隔开。光输出面和光输入面分别设置在形成在壳体中的第一和第二狭缝中。光输出面和光输入面分别与第一和第二狭缝周围的壳体的表面齐平。

34.

发明授权
Resin composition 失效
标题翻译：树脂组成

公开(公告)号：US4312796A

公开(公告)日：1982-01-26

申请号：US85054

申请日：1979-10-15

申请人： Toshiaki Kobayashi , Teruo Takeuchi , Mamoru Nakamura

发明人： Toshiaki Kobayashi , Teruo Takeuchi , Mamoru Nakamura

IPC分类号： C08K13/02 , C08L27/06 , C08L51/04 , C08L55/02 , C08K5/09 , C08K3/32

CPC分类号： C08L27/06 , C08K13/02 , C08L55/02 , C08L51/04

摘要： A resin composition which does not substantially corrode molds, said composition being obtained by blending(I) 100 parts by weight of a resin composition composed of 5 to 80% by weight of (A) an acrylonitrile-butadiene-styrene copolymer resin or a methacrylic ester-butadiene-styrene copolymer resin and 95 to 20% by weight of (B) a vinyl chloride resin obtained by polymerizing vinyl chloride or a monomeric mixture composed mainly of vinyl chloride in the presence of a cycloolefin compound, with(II) 0.5 to 15 parts by weight of (C) a lead-type stabilizer comprising an inorganic acid salt of lead and an organic acid salt of lead in a weight ratio of from 1:10 to 15:1 or (D) a tin-type stabilizer comprising an alkyltin maleate and an alkyltin mercaptide in a weight ratio of from 1:10 to 15:1.

摘要翻译： 所述组合物通过将（I）100重量份由5-80重量％的（A）丙烯腈 - 丁二烯 - 苯乙烯共聚物树脂或甲基丙烯酸甲酯组成的树脂组合物酯 - 丁二烯 - 苯乙烯共聚物树脂和95〜20重量％的（B）通过在环烯烃化合物存在下将氯乙烯或主要由氯乙烯组成的单体混合物与（II）0.5聚合而得到的氯乙烯树脂， 15重量份的（C）包含铅的无机酸盐和铅的有机酸盐的重量比为1:10至15:1的铅型稳定剂，或（D）包含马来酸烷基锡和重量比为1:10至15:1的烷基锡硫醇盐。

35.

发明申请
SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
标题翻译：半导体发光器件

公开(公告)号：US20130307014A1

公开(公告)日：2013-11-21

申请号：US13614779

申请日：2012-09-13

申请人： Mami Yamamoto , Kazuhiro Inoue , Yasunori Nagahata , Teruo Takeuchi , Hidenori Egoshi

发明人： Mami Yamamoto , Kazuhiro Inoue , Yasunori Nagahata , Teruo Takeuchi , Hidenori Egoshi

IPC分类号： H01L33/52

CPC分类号： H01L33/62 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/0095 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73265 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00014 , H01L2924/00

摘要： According to an embodiment, a semiconductor light emitting device includes a insulating base and a semiconductor light emitting element and resin. The insulating base includes a first face, a second face opposite to the first face, and a side face connecting to the first face and the second face, a recess portion being provided on the side face extending from the first face to the second face. The insulating base also includes a first metal layer blocking an opening of the recess portion, a second metal layer on an inner face of the recess portion, and a third metal layer on the second face, the third metal being electrically connected to the first metal layer via the second metal layer. A semiconductor light emitting element is fixed on the first face; and resin covers the first face and seals the semiconductor light emitting element.

摘要翻译： 根据实施例，半导体发光器件包括绝缘基底和半导体发光元件和树脂。所述绝缘底座包括第一面，与所述第一面相反的第二面以及与所述第一面和所述第二面连接的侧面，在从所述第一面向所述第二面延伸的侧面设置有凹部。绝缘基底还包括阻挡凹部的开口的第一金属层，凹部的内表面上的第二金属层和第二面上的第三金属层，第三金属电连接到第一金属层经由第二金属层。半导体发光元件固定在第一面上; 并且树脂覆盖第一面并密封半导体发光元件。

36.

发明授权
LED package 有权
标题翻译： LED封装

公开(公告)号：US08497521B2

公开(公告)日：2013-07-30

申请号：US12875566

申请日：2010-09-03

申请人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu

发明人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L33/48 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599

摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。线将第一端子连接到第一引线框架。树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向从第一引线框架提取。