Chip-carrier for improved drop directionality
    31.
    发明授权
    Chip-carrier for improved drop directionality 失效
    芯片载体,用于改善滴下方向性

    公开(公告)号:US06443557B1

    公开(公告)日:2002-09-03

    申请号:US09430329

    申请日:1999-10-29

    IPC分类号: B41J214

    摘要: A carrier frame having an aperture and a nozzle plate disposed on the carrier frame and positioned over the aperture is described. The nozzle plate has at least one nozzle formed between opposing surfaces of the nozzle plate. The carrier frame and the nozzle plate are made from materials having dissimilar thermal expansion coefficients such that the carrier frame has a thermal expansion coefficient that is less than the thermal expansion coefficient of the nozzle plate. The nozzle plate is staked to the carrier frame and then baked so that the nozzle plate shrinks during the baking process thereby becoming taught and under a state of tensile stress. The nozzle is formed in the nozzle plate after the baking process by laser ablation, for example. The nozzle thus formed has a true bore due to the taught nozzle plate and the opposed surfaces of the nozzle plate being parallel to each other. Consequently, a nozzle camber angle measured relative to a nozzle axis and defined by an angular displacement between a center point of symmetry on an input side of the nozzle and a center point of symmetry on an output side of the nozzle is coaxially aligned with the nozzle axis. By eliminating dimples in the nozzle plate, the nozzle has sidewall surfaces that are symmetric with respect to the nozzle axis thereby defining a nozzle with a true bore. An ink drop injected into the nozzle by an ink jet printhead mounted to the nozzle plate and having a firing chamber in fluid communication with the nozzle will exit the nozzle in a direction that is aligned with the nozzle camber angle such that the drop directionality of the ink drop is improved by true bore of the nozzle.

    摘要翻译: 描述了具有开口的载体框架和设置在载体框架上并定位在孔上方的喷嘴板。 喷嘴板具有在喷嘴板的相对表面之间形成的至少一个喷嘴。 载体框架和喷嘴板由具有不同热膨胀系数的材料制成,使得载体框架的热膨胀系数小于喷嘴板的热膨胀系数。 喷嘴板被固定到载体框架上,然后烘烤,使得喷嘴板在烘烤过程中收缩,从而变得教导并处于拉伸应力状态。 例如,在通过激光烧蚀的烘烤处理之后,在喷嘴板中形成喷嘴。 这样形成的喷嘴由于教导的喷嘴板而具有真正的孔,并且喷嘴板的相对表面彼此平行。 因此,相对于喷嘴轴线测量的喷嘴外倾角和由喷嘴的输入侧上的对称中心点与喷嘴的输出侧上的对称中心点之间的角位移所限定的喷嘴外角与喷嘴同轴对准 轴。 通过消除喷嘴板中的凹坑,喷嘴具有相对于喷嘴轴对称的侧壁表面,从而限定具有真实孔的喷嘴。 通过安装在喷嘴板上并具有与喷嘴流体连通的喷射室的喷墨打印头喷射到喷嘴中的墨滴将沿着与喷嘴外倾角对准的方向离开喷嘴,使得喷嘴的下落方向性 通过喷嘴真空度可以提高油墨滴。

    Printhead For Generating Ink Drops With Reduced Tails
    32.
    发明申请
    Printhead For Generating Ink Drops With Reduced Tails 有权
    用于生成具有减少尾巴的墨滴的打印头

    公开(公告)号:US20120092421A1

    公开(公告)日:2012-04-19

    申请号:US13266232

    申请日:2009-04-30

    IPC分类号: B41J2/05

    CPC分类号: B41J2/1433 B41J2002/14475

    摘要: A printhead (10) for use in an inkjet printing process includes a substrate (12) having at least one ink feed opening (14) defined therein, an ink chamber (16) in operative and fluid communication with the ink feed opening(s) (14), and a nozzle plate (18) disposed on a portion (P1) of the substrate (12). The nozzle plate (18) has a plurality of orifices (20) defined therein. The printhead (10) further includes a firing resistor (22) disposed on another portion (P2) of the substrate (12) and proximate to the ink feed opening(s) (14) and a barrier structure (24) disposed on the other portion (P2) of the substrate (12) and positioned adjacent to the firing resistor (22).

    摘要翻译: 用于喷墨印刷方法的打印头(10)包括:具有限定在其中的至少一个供墨口(14)的基板(12),与所述供墨开口操作和流体连通的墨室(16) (14)和设置在基板(12)的一部分(P1)上的喷嘴板(18)。 喷嘴板(18)具有限定在其中的多个孔口(20)。 打印头(10)还包括设置在基板(12)的另一部分(P2)上并靠近墨水供给开口(14)的触发电阻器(22)和设置在另一部分上的阻挡结构(24) 基板(12)的部分(P2)并且邻近点火电阻器(22)定位。

    INKJET PRINTHEAD BRIDGE BEAM FABRICATION METHOD
    33.
    发明申请
    INKJET PRINTHEAD BRIDGE BEAM FABRICATION METHOD 有权
    INKJET PRINTHEAD BRIDGE梁制造方法

    公开(公告)号:US20110049092A1

    公开(公告)日:2011-03-03

    申请号:US12548397

    申请日:2009-08-26

    IPC分类号: B44C1/22

    摘要: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

    摘要翻译: 一种制造喷墨打印头的桥梁的方法采用在桥梁下方形成的空腔和限制背面凹陷形成的蚀刻停止层。 该方法包括形成将一对沟槽的底部连接在衬底的前表面中并从衬底的前表面延伸并在该腔的底部沉积蚀刻停止层的空腔。 该方法还包括在基板的后表面中形成凹部,露出蚀刻停止层的凹部和限制形成的凹部的深度的蚀刻停止层。 该方法还包括去除暴露的蚀刻停止层以连接空腔和凹部,桥梁是在形成的空腔之上和沟槽之间的衬底的一部分。

    Stereolithographic method for forming three-dimensional structure
    34.
    发明授权
    Stereolithographic method for forming three-dimensional structure 有权
    用于形成三维结构的立体光刻方法

    公开(公告)号:US07790074B2

    公开(公告)日:2010-09-07

    申请号:US10629742

    申请日:2003-07-30

    IPC分类号: B29C41/02 B29C41/22 B29C41/52

    摘要: A method of forming a three-dimensional object comprises ejecting drops of liquefied material into a vat using an ejector; scanning the ejector in first and second mutually opposed directions to induce the drops of liquefied material from the ejector to deposit and solidify in a predetermined sequence to sequentially form layers of the three-dimensional object; supplying a viscous liquid into the vat to a level which is essentially level with the top of a most recently formed layer of the three-dimensional object; and raising the level of the viscous liquid in accordance with the formation of new layers.

    摘要翻译: 形成三维物体的方法包括使用喷射器将液化物料液滴喷射到大桶中; 在第一和第二相互相对的方向上扫描喷射器,以从喷射器引起液化材料的液滴以预定顺序沉积和固化,以顺序地形成三维物体的层; 将大桶中的粘性液体提供到与最近形成的三维物体层的顶部基本平齐的水平; 并根据新层的形成提高粘性液体的含量。

    Fabrication process
    35.
    发明授权
    Fabrication process 失效
    制造工艺

    公开(公告)号:US07718545B1

    公开(公告)日:2010-05-18

    申请号:US11590372

    申请日:2006-10-30

    IPC分类号: H01L21/31 H01L21/469

    摘要: A fabrication process, including forming one or more layers on at least a sidewall of a topographical feature of a substantially planar substrate, the sidewall being substantially orthogonal to the substrate; and planarizing respective portions of the one or more layers to form a planar surface substantially parallel to the substrate, wherein the planar surface includes respective co-planar surfaces of the one or more layers, at least one of the surfaces having a dimension determined by a thickness of the corresponding layer.

    摘要翻译: 一种制造方法,包括在基本平坦的基底的形貌特征的至少一个侧壁上形成一个或多个层,所述侧壁基本上垂直于所述基底; 以及平坦化所述一个或多个层的相应部分以形成基本上平行于所述基底的平坦表面,其中所述平坦表面包括所述一个或多个层的相应共平面表面,所述表面中的至少一个具有由 相应层的厚度。

    Printable compositions having anisometric nanostructures for use in printed electronics
    36.
    发明授权
    Printable compositions having anisometric nanostructures for use in printed electronics 有权
    具有用于印刷电子学中的不规则纳米结构的可印刷组合物

    公开(公告)号:US07062848B2

    公开(公告)日:2006-06-20

    申请号:US10665335

    申请日:2003-09-18

    IPC分类号: H05K3/10 H01B1/00

    摘要: Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition, at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contact to provide a conductive path. The nanostructures arranged in a conductive path can be sintered or used as a conductive material without sintering.

    摘要翻译: 用于制备导电路径的组合物和方法可以包括可印刷组合物,其包括液体载体和多个纳米结构。 多个纳米结构可以在液体载体内具有至少约5:1的纵横比。 纳米结构的实例包括纳米带,纳米板,纳米棒,纳米线,纳米棒以及这些材料的混合物。 这些可印刷组合物可用于在基材上形成导电路径。 可印刷组合物可以使用任何数量的常规印刷技术施加到基材上。 在施加可印刷组合物之后,可以除去液体载体的至少一部分,使得纳米结构可以充分接触以提供导电路径。 布置在导电路径中的纳米结构可以烧结或用作导电材料而不进行烧结。

    Fuel additives for fuel cell
    37.
    发明授权
    Fuel additives for fuel cell 失效
    燃料电池用燃料添加剂

    公开(公告)号:US06921593B2

    公开(公告)日:2005-07-26

    申请号:US09964647

    申请日:2001-09-28

    摘要: A method of enhancing performance of liquid-type fuel cells by adding additives to the liquid fuel. For example, hemoglobin, surfactants, oxygen scavengers, and chelating agents, may be added to the fuel to resolve problems such as CO poisoning of catalyst, wettability of electrodes, and electrode poisoning, and therefore enhance the performance of the fuel cell. The additives may be added individually based on needs, or mixed in a desired ratio for a given type of fuel cell. The additives may be used on a regular basis to improve fuel efficiency and prolong the life span of the fuel cells. The additives may also be pre-packed for field use when high quality fuel is not available.

    摘要翻译: 一种通过向液体燃料中添加添加剂来提高液体型燃料电池性能的方法。 例如,可以向燃料中添加血红蛋白,表面活性剂,除氧剂和螯合剂,以解决催化剂的CO中毒,电极的润湿性和电极中毒等问题,从而提高燃料电池的性能。 可以根据需要单独添加添加剂,或者对于给定类型的燃料电池以所需比例混合。 可以定期使用添加剂以提高燃料效率并延长燃料电池的使用寿命。 当高品质燃料不可用时,添加剂也可以预包装用于现场使用。

    Thermal ink jet resistor passivation
    38.
    发明授权
    Thermal ink jet resistor passivation 失效
    热喷墨电阻钝化

    公开(公告)号:US06715859B2

    公开(公告)日:2004-04-06

    申请号:US09873995

    申请日:2001-06-06

    IPC分类号: B41J205

    CPC分类号: B41J2/14129 B41J2202/03

    摘要: A passivation layer for a thermal ink jet printhead is provided. The material of the passivation layer can be a Co-based alloy with 25-30 wt % Cr or an Fe-based alloy with ≦10 wt. % Co, ≦20 wt. % Cr, ≦10 wt. % Mn. The passivation layer is amorphous and the surface is substantially atomically smooth or has a controlled surface roughness. The passivation layer displays resistance to cavitation and chemical corrosion and is conformally disposed over a resistor by sputtering or other physical vapor deposition techniques.

    摘要翻译: 提供了用于热喷墨打印头的钝化层。 钝化层的材料可以是具有25-30重量%Cr的Co基合金或具有<= 10重量%的Fe基合金。 %Co,<= 20wt。 %Cr,<= 10wt。 %Mn。 钝化层是无定形的,并且表面基本上是原子光滑的或具有受控的表面粗糙度。 钝化层显示出抗气蚀和化学腐蚀的阻力,并通过溅射或其它物理气相沉积技术保形地设置在电阻器上。

    Multiple redundant through hole electrical interconnects and method for forming the same
    39.
    发明授权
    Multiple redundant through hole electrical interconnects and method for forming the same 失效
    多重冗余通孔电气互连及其形成方法

    公开(公告)号:US06659592B2

    公开(公告)日:2003-12-09

    申请号:US09932123

    申请日:2001-08-16

    IPC分类号: B41J201

    CPC分类号: B41J2/14072 B41J2202/18

    摘要: An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.

    摘要翻译: 包括延伸穿过衬底(例如,硅晶片)的多个电互连的装置及其形成方法。 电互连将电信号通过基板传送到安装在基板正面上的结构。 导电层可用于选择性地将电信号分配到结构。 因此,不需要将电信号路由到基板的前侧,以将信号传送到结构。 结构可以耦合到多个电互连,以便沿着穿过衬底的冗余路径传送电信号到结构,从而在电互连失败之后提高可靠性。