摘要:
A carrier frame having an aperture and a nozzle plate disposed on the carrier frame and positioned over the aperture is described. The nozzle plate has at least one nozzle formed between opposing surfaces of the nozzle plate. The carrier frame and the nozzle plate are made from materials having dissimilar thermal expansion coefficients such that the carrier frame has a thermal expansion coefficient that is less than the thermal expansion coefficient of the nozzle plate. The nozzle plate is staked to the carrier frame and then baked so that the nozzle plate shrinks during the baking process thereby becoming taught and under a state of tensile stress. The nozzle is formed in the nozzle plate after the baking process by laser ablation, for example. The nozzle thus formed has a true bore due to the taught nozzle plate and the opposed surfaces of the nozzle plate being parallel to each other. Consequently, a nozzle camber angle measured relative to a nozzle axis and defined by an angular displacement between a center point of symmetry on an input side of the nozzle and a center point of symmetry on an output side of the nozzle is coaxially aligned with the nozzle axis. By eliminating dimples in the nozzle plate, the nozzle has sidewall surfaces that are symmetric with respect to the nozzle axis thereby defining a nozzle with a true bore. An ink drop injected into the nozzle by an ink jet printhead mounted to the nozzle plate and having a firing chamber in fluid communication with the nozzle will exit the nozzle in a direction that is aligned with the nozzle camber angle such that the drop directionality of the ink drop is improved by true bore of the nozzle.
摘要:
A printhead (10) for use in an inkjet printing process includes a substrate (12) having at least one ink feed opening (14) defined therein, an ink chamber (16) in operative and fluid communication with the ink feed opening(s) (14), and a nozzle plate (18) disposed on a portion (P1) of the substrate (12). The nozzle plate (18) has a plurality of orifices (20) defined therein. The printhead (10) further includes a firing resistor (22) disposed on another portion (P2) of the substrate (12) and proximate to the ink feed opening(s) (14) and a barrier structure (24) disposed on the other portion (P2) of the substrate (12) and positioned adjacent to the firing resistor (22).
摘要:
A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.
摘要:
A method of forming a three-dimensional object comprises ejecting drops of liquefied material into a vat using an ejector; scanning the ejector in first and second mutually opposed directions to induce the drops of liquefied material from the ejector to deposit and solidify in a predetermined sequence to sequentially form layers of the three-dimensional object; supplying a viscous liquid into the vat to a level which is essentially level with the top of a most recently formed layer of the three-dimensional object; and raising the level of the viscous liquid in accordance with the formation of new layers.
摘要:
A fabrication process, including forming one or more layers on at least a sidewall of a topographical feature of a substantially planar substrate, the sidewall being substantially orthogonal to the substrate; and planarizing respective portions of the one or more layers to form a planar surface substantially parallel to the substrate, wherein the planar surface includes respective co-planar surfaces of the one or more layers, at least one of the surfaces having a dimension determined by a thickness of the corresponding layer.
摘要:
Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition, at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contact to provide a conductive path. The nanostructures arranged in a conductive path can be sintered or used as a conductive material without sintering.
摘要:
A method of enhancing performance of liquid-type fuel cells by adding additives to the liquid fuel. For example, hemoglobin, surfactants, oxygen scavengers, and chelating agents, may be added to the fuel to resolve problems such as CO poisoning of catalyst, wettability of electrodes, and electrode poisoning, and therefore enhance the performance of the fuel cell. The additives may be added individually based on needs, or mixed in a desired ratio for a given type of fuel cell. The additives may be used on a regular basis to improve fuel efficiency and prolong the life span of the fuel cells. The additives may also be pre-packed for field use when high quality fuel is not available.
摘要:
A passivation layer for a thermal ink jet printhead is provided. The material of the passivation layer can be a Co-based alloy with 25-30 wt % Cr or an Fe-based alloy with ≦10 wt. % Co, ≦20 wt. % Cr, ≦10 wt. % Mn. The passivation layer is amorphous and the surface is substantially atomically smooth or has a controlled surface roughness. The passivation layer displays resistance to cavitation and chemical corrosion and is conformally disposed over a resistor by sputtering or other physical vapor deposition techniques.
摘要:
An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.
摘要:
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system includes a plurality of contiguously interconnected electrically conductive droplets such as solder ball droplets produced by a print-on-demand solder jet system. An interconnect is formed by repeatedly ejecting the conductive droplets along a predetermined path between components to be connected. Each ejected droplet is disposed adjacent to another ejected droplet to form a contiguously linked chain of droplets that bridge a physical gap between the components. A non-conductive coating can be deposited on the interconnect to protect the interconnect from damage and to encase the interconnect. The electrical resistance of the interconnect can be reduced by reflowing the droplets that form the interconnect, whereby the coating that encses the interconnect is operative to maintain the shape of the interconnect after reflow.