Abstract:
A boundary conduction mode (BCM) switching regulator controls a power stage to convert an input voltage to an output voltage or output current. The BCM switching regulator detects whether it is operating in continuous conduction mode (CCM) or discontinuous conduction mode (DCM), and adjusts the On-time, Off-time, or frequency of the power stage accordingly, so that the switching regulator operates in or near BCM.
Abstract:
The present invention discloses a method for controlling the impurity density distribution in semiconductor device and a semiconductor device made thereby. The control method includes the steps of: providing a substrate; defining a doped area which includes at least one first region; partially masking the first region by a mask pattern; and doping impurities in the doped area to form one integrated doped region in the first region, whereby the impurity concentration of the first region is lower than a case where the first region is not masked by the mask pattern.
Abstract:
A power management control circuit controls a first power transistor to convert a input voltage to an output voltage and controls a second power transistor to charge a battery from the output voltage. The first power transistor is coupled between the input voltage and the output voltage, and the second power transistor is coupled between the output voltage and the battery. The power management control circuit includes: a detection transistor detecting a current through the second power transistor and generating a charging reference voltage; an amplifier comparing the output voltage with the voltage of the battery to generate an amplified signal for controlling the charging reference voltage; a comparator comparing a reference voltage with the charging reference voltage to generate an EOC (End of Charge) signal for determining whether to stop charging the battery; and an offset voltage compensation device compensating an input offset voltage of the amplifier.
Abstract:
The present invention discloses a bi-directional switching regulator and its control circuit, wherein the bi-directional switching regulator converts an input voltage to an output voltage in a power supply mode, and it includes: a power stage including an upper gate switch, a lower gate switch and an inductor coupled to a common switching node, wherein the inductor is coupled to the input voltage; a load switch coupled between the output voltage and the upper gate switch; and a driver circuit controlling the load switch to adjust an output current flowing through the load switch according to current information at an input terminal of the input voltage.
Abstract:
The present invention discloses a high voltage device and a manufacturing method thereof. The high voltage device is formed in a first conductive type substrate, wherein the substrate has an upper surface. The high voltage device includes: a second conductive type buried layer, which is formed in the substrate; a first conductive type well, which is formed between the upper surface and the buried layer; and a second conductive type well, which is connected to the first conductive type well and located at different horizontal positions. The second conductive type well includes a well lower surface, which has a first part and a second part, wherein the first part is directly above the buried layer and electrically coupled to the buried layer; and the second part is not located above the buried layer and forms a PN junction with the substrate.
Abstract:
The present invention discloses a current splitter circuit for splitting a supply current to multiple light emitting device strings of a light emitting device array. The current splitter circuit includes: a minimum selector circuit coupled to the multiple light emitting device strings to generate a minimum signal which indicates a minimum voltage of the light emitting device strings; and multiple current source circuits each including a first current source end coupled to a corresponding light emitting device string, a second current source end coupled to ground, and a current source control end receiving a current control signal related to the minimum signal, so as to control currents through the corresponding light emitting device string.
Abstract:
The present invention discloses a light emitting device open/short detection circuit, which is used for detecting at least one light emitting device string open/short. Each light emitting device string has a first end and a second end, wherein the first end is coupled to a voltage supply circuit to supply electrical power to the light emitting devices. The open/short detection circuit includes: an abnormal voltage detection circuit coupled to the light emitting device strings for receiving voltages of the second ends respectively and generating an abnormal voltage detection signal; a voltage setting circuit coupled to the abnormal voltage detection circuit for setting an abnormal reference level; and a determination circuit coupled to the voltage setting circuit. When the abnormal voltage detection signal is equal to or over the abnormal reference level, the determination circuit generates an open/short detection signal for an abnormal condition detected.
Abstract:
The present invention discloses a high voltage device and a manufacturing method thereof. The high voltage device is formed in a first conductive type substrate, wherein the substrate includes isolation regions defining a device region. The high voltage device includes: a drift region, located in the device region, doped with second conductive type impurities; a gate in the device region and on the surface of the substrate; and a second conductive type source and drain in the device region, at different sides of the gate respectively. From top view, the concentration of the second conductive type impurities of the drift region is distributed substantially periodically along horizontal and vertical directions.
Abstract:
The present invention discloses an integrated circuit (IC) chip package and a manufacturing method thereof. The IC chip package includes: a lead frame, including a lead frame array having plural conductive cells, wherein some of the conductive cells are respectively electrically connected with corresponding first extended wires; at least one redistribution layer, wherein each redistribution layer includes plural second extended wires, which are respectively electrically connected to the first extended wires or the second extended wires of another redistribution layer; and a solder array, including plural solder balls, which are electrically connected to the lead frame array.
Abstract:
The present invention discloses a semiconductor overlapped PN structure and manufacturing method thereof. The method includes: providing a substrate; providing a first mask to define a P (or N) type well and at least one overlapped region in the substrate; implanting P (or N) type impurities into the P (or N) type well and the at least one overlapped region; providing a second mask having at least one opening to define an N (or P) type well in the substrate, and to define at least one dual-implanted region in the at least one overlapped region; implanting N (or P) type impurities into the N (or P) type well and the at least one dual-implanted region such that the at least one dual-implanted region has P type and N type impurities.