公开(公告)号：US20230278260A1

公开(公告)日：2023-09-07

申请号：US18175710

申请日：2023-02-28

申请人： DISCO CORPORATION

发明人： Shinya ARUGA ,  Hiroaki KOBAYASHI

IPC分类号： B28D5/00

CPC分类号： B28D5/0064 ,  B28D5/0052 ,  B28D5/0023

摘要： A dividing apparatus is provided with a second camera that forms a second image to be used for determining whether or not a wafer is divided at a first projected dicing line. That is, in the dividing apparatus, whether or not the wafer is divided at the first projected dicing line can be checked in reference to the second image. Hence, in the dividing apparatus, even in a case where part of the wafer remains at the first projected dicing line and the wafer is not divided, a dividing unit can be operated again to divide the wafer at the first projected dicing line. Consequently, in the dividing apparatus, the wafer can reliably be divided at the first projected dicing line.

公开(公告)号：US20230234149A1

公开(公告)日：2023-07-27

申请号：US18009348

申请日：2021-05-20

申请人： Siltronic AG

发明人： Peter Wiesner ,  Wolfgang Gmach ,  Robert Kreuzeder

IPC分类号： B23D57/00 ,  B28D5/00 ,  B23D59/00 ,  B28D5/04

CPC分类号： B23D57/0023 ,  B23D57/0061 ,  B28D5/0076 ,  B23D59/002 ,  B28D5/045 ,  B28D5/0064

摘要： Slices are cut from workpieces using a wire saw having a wire array tensioned in a plane between two wire guide rollers each supported between fixed and floating bearings and comprising a chamber and a shell enclosing a core and having guide grooves for wires. During a cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while simultaneously: changing shell lengths by adjusting chamber temperatures in dependence on a depth of cut and a first correction profile; and moving the workpiece along the workpiece axis in accordance with a second correction profile. The correction profiles are opposed to a shape deviation.

公开(公告)号：US20180141237A1

公开(公告)日：2018-05-24

申请号：US15645961

申请日：2017-07-10

申请人： LG SILTRON INCORPORATED

发明人： Su In JEON

IPC分类号： B28D5/04 ,  B28D5/00

CPC分类号： B28D5/045 ,  B28D5/0064 ,  B28D5/0076 ,  B28D5/0082

摘要： A pressing head of the ingot slicing apparatus includes: a head main body in which a plurality of pneumatic supply ports configured to supply compressed air are formed so that pressure on each portion of the pressing head is separately controlled; pressing units installed on a lower end of the head main body, located to correspond to the pneumatic supply ports, and each configured to apply pressure to a side surface of an ingot by the compressed air supplied through each of the pneumatic supply ports; pneumatic correction units each installed on a lower surface of each of the pressing units and configured to control a pressure deviation between the plurality of pressing units; an adhesive plate installed to be in contact with lower side surfaces of the pneumatic correction units so that a lower surface of the adhesive plate is in direct contact with and presses the side surface of the ingot; and a coupling support unit configured to couple and support the head main body, the pressing units, the pneumatic correction units, and the adhesive plate.

公开(公告)号：US20170338100A1

公开(公告)日：2017-11-23

申请号：US15527619

申请日：2015-10-07

申请人： Sumitomo Electric Industries, Ltd.

发明人： Mitsuhiko Sakai ,  Hiroyuki Kitabayashi

IPC分类号： H01L21/02 ,  H01L21/683 ,  H01L21/04 ,  H01L21/67 ,  H01L29/16 ,  H01L21/768

CPC分类号： H01L21/02035 ,  B28D5/0064 ,  B28D5/022 ,  H01L21/0445 ,  H01L21/3043 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/76865 ,  H01L21/78 ,  H01L29/1608 ,  H01L2221/68327 ,  H01L2221/68381

摘要： In accordance with the following step of a method of manufacturing a MOSFET, a first cutting step of cutting a silicon carbide wafer along a plane substantially parallel to a {11-20} plane is performed. After the first cutting step, a second cutting step of cutting the silicon carbide wafer along a plane substantially perpendicular to the {11-20} plane and substantially perpendicular to the first main surface is performed.

公开(公告)号：US09627260B2

公开(公告)日：2017-04-18

申请号：US15077423

申请日：2016-03-22

申请人： DISCO CORPORATION

发明人： Kazuma Sekiya

IPC分类号： H01L21/78 ,  H01L21/66 ,  B23Q17/09 ,  H01L21/304 ,  B28D5/00 ,  B28D5/02

CPC分类号： H01L21/78 ,  B23Q17/0952 ,  B28D5/0064 ,  B28D5/022 ,  H01L21/304 ,  H01L21/3043 ,  H01L22/12 ,  H01L22/20

摘要： A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of separate regions where a plurality of devices are each formed is disclosed. The workpiece cutting method includes a workpiece cutting step of cutting the workpiece held on a first chuck table along the division lines by using a cutting blade, a dummy wafer cutting step of cutting a dummy wafer held on a second chuck table by using the cutting blade, a dummy wafer imaging step of imaging a cut groove formed on the dummy wafer in the dummy wafer cutting step, by using an imaging unit to thereby obtain a detected image, and a determining step of determining the condition of the cutting blade from the condition of chippings formed on both sides of the cut groove in the detected image.

公开(公告)号：US09073135B2

公开(公告)日：2015-07-07

申请号：US13423350

申请日：2012-03-19

申请人： Anton Huber ,  Wolfgang Gmach ,  Robert Kreuzeder ,  Peter Wiesner

发明人： Anton Huber ,  Wolfgang Gmach ,  Robert Kreuzeder ,  Peter Wiesner

IPC分类号： B28D5/00 ,  B28D1/08 ,  B23D57/00 ,  B28D5/04

CPC分类号： B23D57/0053 ,  B28D5/0064 ,  B28D5/0076 ,  B28D5/045

摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.

摘要翻译： 一种用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，提供分别与每个线导向辊相关联的固定轴承，并提供包括以平行方式设置的线段的锯线。 线段在线导向辊之间张紧并相对于工件移动，以进行锯切操作。 导丝辊被冷却，固定的轴承独立于导线辊被冷却。

公开(公告)号：US20130174828A1

公开(公告)日：2013-07-11

申请号：US13707867

申请日：2012-12-07

申请人： MEMC ELECTRONIC MATERIALS, SPA

发明人： Carlo Zavattari ,  Ferdinando Severico ,  Sumeet S. Bhagavat ,  Gabriele Vercelloni ,  Roland R. Vandamme

IPC分类号： B28D5/00

CPC分类号： B28D5/007 ,  B28D5/0064 ,  B28D5/0076 ,  B28D5/045

摘要： Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid that comes in contact with the ingot. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.

摘要翻译： 公开了用于控制在线锯机中切割的晶片的表面轮廓的系统和方法。 本文所述的系统和方法通常可操作以通过控制晶片的形状来改变从晶锭切片的晶片的纳米拓扑学。 通过改变与锭接触的温度控制流体的温度和/或流速来改变晶片的形状。 可以使用不同的反馈系统来确定产生具有期望形状和/或纳米拓扑的晶片所需的流体的温度。

公开(公告)号：US20130139801A1

公开(公告)日：2013-06-06

申请号：US13309270

申请日：2011-12-01

申请人： Carlo Zavattari ,  Ferdinando Severico ,  Sumeet S. Bhagavat ,  Gabriele Vercelloni ,  Roland R. Vandamme

发明人： Carlo Zavattari ,  Ferdinando Severico ,  Sumeet S. Bhagavat ,  Gabriele Vercelloni ,  Roland R. Vandamme

IPC分类号： B28D5/00 ,  B28D1/10

CPC分类号： B28D5/045 ,  B28D5/0064

摘要： Methods are disclosed for controlling the displacement of bearings in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling displacement of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.

摘要翻译： 公开了用于控制线锯机中的轴承的位移的方法。 本文所述的系统和方法通常可操作以通过控制晶片的形状来改变从晶锭切片的晶片的纳米拓扑学。 通过改变与支撑导线器的导轨的轴承流体连通的温度控制流体的温度和/或流速来控制线锯中的轴承的位移来改变晶片的形状。 可以使用不同的反馈系统来确定产生具有期望形状和/或纳米拓扑的晶片所需的流体的温度。

公开(公告)号：US20110132345A1

公开(公告)日：2011-06-09

申请号：US12937708

申请日：2009-04-09

申请人： Stefan Schneeberger ,  Philippe Nasch ,  Cedric Thommen

发明人： Stefan Schneeberger ,  Philippe Nasch ,  Cedric Thommen

IPC分类号： B28D5/04 ,  B28D1/06

CPC分类号： B28D5/045 ,  B23D57/0023 ,  B23D57/0038 ,  B23D57/0053 ,  B28D5/0064 ,  B28D5/007 ,  B28D5/0076 ,  Y02P70/179 ,  Y10T83/0448

摘要： A wire saw device for sawing semiconductor material is provided, the wire saw device comprising a wire guide device (110) adapted to guide a wire for forming at least one wire web (200) for sawing the semiconductor material, and at least one wire management unit (130) for providing a wire to the wire guide device, wherein the wire guide device (110) and the at least one wire management unit (130) are adapted to provide the at least one wire web such that an effective cutting area rate of 12 m2/h or more is provided.

摘要翻译： 提供了一种用于锯切半导体材料的线锯装置，所述线锯装置包括适于引导用于形成用于锯切所述半导体材料的至少一个线幅（200）的线的线引导装置（110），以及至少一个线管理 单元（130），用于向所述导线装置提供导线，其中所述导线装置（110）和所述至少一个线管理单元（130）适于提供所述至少一个线材网，使得有效切割面积率 为12 m2 / h以上。

公开(公告)号：US20110126813A1

公开(公告)日：2011-06-02

申请号：US12628816

申请日：2009-12-01

申请人： John B. Hodsden ,  Kerry R. Lindemann ,  Kerry L. Shaklee ,  Earl James Crawford, III

发明人： John B. Hodsden ,  Kerry R. Lindemann ,  Kerry L. Shaklee ,  Earl James Crawford, III

IPC分类号： B28D1/08 ,  B24B1/00

CPC分类号： B28D5/0076 ,  B23D57/0053 ,  B24B27/0633 ,  B28D5/0064 ,  B28D5/045

摘要： A multi-wire slurry-free wafer cutting apparatus along with a method for optimizing saw operation is disclosed that includes a cutting wire impregnated with a plurality of cutting particles wrapped multiple times around two or more wire guides to form a multi-wire web. A drive mechanism drives the web across an ingot at an optimum speed determined by setting a multi-wire web speed to an initial speed, detecting vibration of the web, identifying the web speed having a lowest vibration, and operating the drive mechanism at that speed as optimum. A cleansing fluid is applied to the multi-wire web that includes a major portion of water and a minor portion of surfactant which cleans the cutting wire and keeps the cut particles free of oxidation. One or more cleansing fluid applicators are configured to apply the cleansing fluid to the multi-wire web close to the ingot in a laminar flow.

摘要翻译： 公开了一种多线无浆液晶片切割装置以及用于优化锯操作的方法，其包括浸渍有围绕两个或更多个导线器多次缠绕的多个切割颗粒的切割丝，以形成多丝网。 驱动机构通过将多丝网速度设定为初始速度确定的最佳速度驱动幅材，检测幅材的振动，识别具有最低振动的幅材速度，并以该速度操作驱动机构 作为最佳。 将清洁流体施加到包括大部分水的多线幅材和少部分表面活性剂，其清洁切割线并保持切割的颗粒不被氧化。 一个或多个清洁液施加器构造成将清洁流体以层流的方式施加到靠近锭的多线幅材上。