Abstract:
A device may include a first substrate. The device may include an optical source. The optical source may generate light when a voltage or current is applied to the optical source. The optical source may be being provided on a first region of the first substrate. The device may include a second substrate. A second region of the second substrate may form a cavity with the first region of the first substrate. The optical source may extend into the cavity. The device may include an optical interconnect. The optical interconnect may be provided on or in the second substrate and outside the cavity. The optical interconnect may be configured to receive the light from the optical source.
Abstract:
An optical module (1) of the invention includes a circuit substrate (24) on which light receiving and emitting elements (52) are mounted, a connector component (54) for holding optical fibers (7), and a lens array component (55) which is fixed on the circuit substrate (24) and optically connects the optical fibers (7) to the light receiving and emitting elements (52) on the circuit substrate (24), and the circuit substrate (24) has a lens array mounting region (A1) in which the lens array component (55) is fixed and a connector component opposed region (A2) opposed to the connector component (54), and thermal insulation space is formed between the connector component (54) and the connector component opposed region (A2).
Abstract:
A thermally isolated multi-channel transmitter optical subassembly (TOSA) may be used in a multi-channel optical transceiver. The multi-channel TOSA generally includes an array of lasers optically coupled to an arrayed waveguide grating (AWG) to combine multiple optical signals at different channel wavelengths. The lasers, and possibly other components, are wire bonded to a thermal isolation bar. The thermal isolation bar provides an electrical connection to external circuitry and is thermally coupled to a temperature control device, such as a thermoelectric cooler (TEC). Thus, the thermal isolation bar electrically connects the lasers to the circuitry while preventing external heat from being conducted to the lasers from outside the TOSA. The optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).
Abstract:
A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion.
Abstract:
A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion.
Abstract:
A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion.
Abstract:
An apparatus comprises an optical transmitter; an optical detector configured to receive optical signals from an optical fiber; an optical splitter having a first port, a second port coupled to the optical detector by the optical fiber, and a third port coupled to the optical transmitter; and a two stage amplifier system connected to an output of the optical detector. An input surface of the optical detector may have a diameter that is substantially equal to a diameter of a core in the optical fiber. The diameter of the input surface of the optical detector reduces capacitance and reduces signal distortion. The optical splitter may be configured to receive a first optical signal at the first port. The optical splitter may be configured to send the first optical signal to the second port and send a second optical signal received at the third port to the first port.
Abstract:
In a laser apparatus, a plurality of semiconductor laser elements respectively emit laser beams; a multimode optical fiber has a light-entrance end and a light-emission end; an optical condensing system collects the laser beams emitted from the plurality of semiconductor laser elements, and couples the collected laser beams to the light-entrance end of the multimode optical fiber; and a protection member is arranged at the light-emission end of the multimode optical fiber, protects the light-emission end from the atmosphere, and has a light-emission window located at at least a predetermined distance from the light-emission end.
Abstract:
An optical semiconductor module with a downsizeable structure is provided. An optical semiconductor module 10 comprises a mounting member 20, first member 30, optical semiconductor element 22, second member 34, and optical fiber 40. The mounting member 20 extends along a reference surface intersecting an axis 12. The first member 30 has a tubular portion 30a extending in a direction of the axis 12, a first end 30b formed at one end of the tubular portion 30a and fixed to the mounting member, and a second end 30c formed at the other end of the tubular portion 30a. The optical semiconductor element 22 is arranged in the tubular portion 30a of the first member 30 such that its optical axis is directed in a direction of the predetermined axis 12. The second member 34 has a tubular portion 34a extending in a direction of the axis 12, and is fixed to the second end 30c of the first member 20. The optical fiber 40 extends in the tubular portion 34a of the second member 34 such that it is optically coupled to the optical semiconductor element 22.
Abstract:
A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least partially thermally isolated from other heat sinks to mitigate heat flow from high-power components to heat sensitive components. Further, all of the heat sinks associated with the circuit package are electrically coupled to provide electromagnetic shielding. A thermally insulative and electrically conductive gasket is employed to couple adjacent heat sinks.