Abstract:
A data acquisition method and an electronic device are provided. The electronic device includes a first image capturing unit and a second image capturing unit. The first image capturing unit and the second image capturing unit utilize different imaging modes during image capturing. The method includes: acquiring first image data of a current scene captured by the first image capturing unit and second image data of the current scene captured by the second image capturing unit respectively, where the first image data includes first sub-image data and second sub-image data, the second image data includes third sub-image data, an image dimension of the third sub-image data is the same as the image dimension of the first sub-image data, and a resolution of the third sub-image data is higher than a resolution of the first sub-image data; and synthesizing the third sub-image data with the first sub-image data.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
Imaging devices and techniques that utilize multiple optical detectors are described and, in particular, imaging geometries for imaging devices that include three or more optical detectors with overlapping fields of regard. The imaging geometries are determined and provided in consideration of one or more performance criteria evaluated over multiple different operating conditions for a process of generating a reconstructed image from the captured images. Imaging systems and methods utilizing the imaging geometries are also described.
Abstract:
Imaging devices and techniques that utilize multiple optical detectors are described and, in particular, imaging geometries for imaging devices that include three or more optical detectors with overlapping fields of regard. The imaging geometries are determined and provided in consideration of one or more performance criteria evaluated over multiple different operating conditions for a process of generating a reconstructed image from the captured images. Imaging systems and methods utilizing the imaging geometries are also described.
Abstract:
An image acquisition system that uses multiple cameras or image sensors in a redundant camera array. The cameras or sensors are arrayed in rows and columns so that a viewing area of each camera overlaps a viewing area of an adjacent camera. At least one camera is positioned in the array so that all edges of its viewing area abuts the viewing area of an adjacent camera. The image is displayed or stored in seamless and continuous form in high resolution. The system may also be used in low light conditions for image acquisition. Multiple cameras or sensors may be arrayed on modular panels that mates with and adjacent modular panel. The system is adaptable to image acquisition for X-rays, scanning, photocopying, security systems and the like.
Abstract:
A charged coupled device is disclosed including an asymmetrical split with independent control over the regions on opposite sides of the split. The charge coupled device is configurable for use in multiline or kinetic spectroscopy, and includes two separate horizontal registers with optional charge dump regions for improving efficiency.
Abstract:
An image pick-up apparatus (1) for picking up a plurality of sub-images and combining them so as to form a composite image, including a correction unit (5) for correcting brightness values of the composite image. The correction unit (5) includes a selection unit (6) for selecting bright and dark parts from the sub-images. There is also provided an arithmetic unit (10) for deriving a gain correction factor from the bright parts and an offset correction term from the dark parts. The correction unit (5) also includes a multiplier unit (8) and an adder unit (9) for multiplying signal levels of a sub-image signal by the gain correction factor and for adding the offset correction term thereto. The image pick-up apparatus is used in an X-ray examination apparatus (20) for picking up an optical image on the exit window (32) of an X-ray image intensifier (24) and for supplying an electronic image signal for a high-resolution composite image so that image information in a medical X-ray image with small details can be suitably reproduced.
Abstract:
The invention relates to a method and apparatus for constructing a sensor system (100) sensitive to electromagnetic radiation for use in a digital imaging camera head. The sensor system (100) is capable of delivering an electrical signal containing the image information formed by electromagnetic radiation incident on the sensor system (100). The sensor system (100) is comprised of a number (N pcs.) of mutually essentially identical modular sensor units (10.sub.1 . . . 10.sub.N) and of an equal number (N pcs.) of mutually essentially identical modular control electronics units (20.sub.1 . . . 20.sub.N) suited for the control and signal processing of said sensor units (10.sub.1 . . . 10.sub.N). The sensor system (100) has a modular design permitting the dimensions of the imaging area covered by the sensor system (100) to be expanded or reduced as required for the needs of an imaging application by adding or reducing, respectively, the number of the modular sensor units (10,20). Each individual modular sensor unit (10) and/or control electronics unit (20) are/is also separately removable for servicing.
Abstract:
An image pick-up apparatus (1) which includes a beam splitter (2) for splitting an image into sub-images and several image sensors (3, 4) for picking up the sub-images is provided with a depolarizing element (6) for reducing the linear polarization degree of the light incident on the beam splitter. The electronic image signals of the image sensors (3, 4) are combined so as to form an electronic image signal of a composite image in a combination unit (5). Because the linear polarization degree of the light incident on a mirror surface (27) of the beam splitter (2) is low, the differences between brightnesses of sub-images picked up by individual image sensors are small. Disturbances are thus counteracted in the composite image. The image pick-up apparatus is preferably used in an X-ray examination apparatus (10) in order to reproduce an X-ray image having a high spatial resolution and few disturbances.