Scanning laser thermal annealing
    391.
    发明授权
    Scanning laser thermal annealing 有权
    扫描激光热退火

    公开(公告)号:US07351638B1

    公开(公告)日:2008-04-01

    申请号:US10021782

    申请日:2001-12-18

    CPC classification number: H01L21/268 H01L21/26513 H01L29/6659

    Abstract: A method of manufacturing a semiconductor device includes forming a gate electrode over a substrate, implanting dopants into the substrate and activating the dopants using laser thermal annealing. During annealing, the laser and substrate are moved relative to one another, and the movement of the laser and the substrate relative to one another does not pause between and during activating one portion of the source/drain regions and activating another portion of the source/drain regions. Each pulse from the laser can respectively irradiate different portions of the source/drain regions, and a spot area of the laser is less than 50 millimeter2.

    Abstract translation: 一种制造半导体器件的方法包括在衬底上形成栅电极,将掺杂剂注入到衬底中并使用激光热退火激活掺杂剂。 在退火期间,激光器和衬底相对于彼此移动,并且激光器和衬底相对于彼此的运动在激活源极/漏极区域的一部分之间和在激活源极/漏极区域的另一部分之间不间断, 漏区。 来自激光器的每个脉冲可以分别照射源极/漏极区域的不同部分,并且激光器的斑点面积小于50毫米2。

    SRAM formation using shadow implantation
    392.
    发明授权
    SRAM formation using shadow implantation 有权
    使用阴影植入的SRAM形成

    公开(公告)号:US07298007B1

    公开(公告)日:2007-11-20

    申请号:US11171399

    申请日:2005-07-01

    Abstract: A memory device includes multiple fins formed adjacent to one another, a source region, a drain region, a gate, a wordline, and a bitline contact. At least one of the multiple fins is doped with a first type of impurities and at least one other one of the fins is doped with a second type of impurities. The source region is formed at one end of each of the fins and the drain region is formed at an opposite end of each of the fins. The gate is formed over two of the multiple fins, the wordline is formed over each of the multiple fins, and a bitline contact is formed adjacent at least one of the multiple fins.

    Abstract translation: 存储器件包括彼此相邻形成的多个鳍,源极区,漏极区,栅极,字线和位线接触。 多个翅片中的至少一个被掺杂有第一类型的杂质,并且至少另外一个翅片掺杂有第二类型的杂质。 源区域形成在每个散热片的一端,并且漏极区域形成在每个散热片的相对端。 栅极形成在多个散热片的两个之上,字线形成在多个散热片的每一个上,并且与多个散热片中的至少一个相邻地形成有位线接触。

    Tri-gate and gate around MOSFET devices and methods for making same
    394.
    发明授权
    Tri-gate and gate around MOSFET devices and methods for making same 有权
    围绕MOSFET器件的三栅极和栅极及其制造方法

    公开(公告)号:US07259425B2

    公开(公告)日:2007-08-21

    申请号:US10348911

    申请日:2003-01-23

    CPC classification number: H01L29/785 H01L29/42384 H01L29/66545 H01L29/66795

    Abstract: A triple gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin structure, a first gate formed adjacent a first side of the fin structure, a second gate formed adjacent a second side of the fin structure opposite the first side, and a top gate formed on top of the fin structure. A gate around MOSFET includes multiple fins, a first sidewall gate structure formed adjacent one of the fins, a second sidewall gate structure formed adjacent another one of the fins, a top gate structure formed on one or more of the fins, and a bottom gate structure formed under one or more of the fins.

    Abstract translation: 三栅极金属氧化物半导体场效应晶体管(MOSFET)包括翅片结构,邻近翅片结构的第一侧形成的第一栅极,与第一侧相对的翅片结构的第二侧附近形成的第二栅极,以及 形成在鳍结构顶部的顶门。 MOSFET周围的栅极包括多个散热片,邻近其中一个翅片形成的第一侧壁栅极结构,邻近另一个鳍片形成的第二侧壁栅极结构,形成在一个或多个翅片上的顶部栅极结构,以及底部栅极 在一个或多个翅片下形成的结构。

    Double gate semiconductor device having a metal gate
    395.
    发明授权
    Double gate semiconductor device having a metal gate 有权
    具有金属栅极的双栅极半导体器件

    公开(公告)号:US07256455B2

    公开(公告)日:2007-08-14

    申请号:US10720166

    申请日:2003-11-25

    CPC classification number: H01L29/785 H01L29/42384 H01L29/66545 H01L29/66795

    Abstract: A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a source region formed on the insulating layer adjacent a first end of the conductive fin and a drain region formed on the insulating layer adjacent a second end of the conductive fin. The semiconductor device may further include a metal gate formed on the insulating layer adjacent the conductive fin in a channel region of the semiconductor device.

    Abstract translation: 半导体器件可以包括衬底,形成在衬底上的绝缘层和形成在绝缘层上的导电鳍。 导电翅片可以包括多个侧表面和顶表面。 半导体器件还可以包括形成在与导电鳍片的第一端相邻的绝缘层上的源极区域和形成在与导电鳍片的第二端相邻的绝缘层上的漏极区域。 半导体器件还可以包括在半导体器件的沟道区域中形成在与绝缘层相邻的导电鳍片上的金属栅极。

    Compositions and methods for the synthesis and subsequent modification of uridine-5′-diphosphosulfoquinovose (UDP-SQ)
    396.
    发明授权
    Compositions and methods for the synthesis and subsequent modification of uridine-5′-diphosphosulfoquinovose (UDP-SQ) 失效
    尿苷-5'-二磷酸鸟苷酸(UDP-SQ)的合成和随后修饰的组合物和方法

    公开(公告)号:US07226764B1

    公开(公告)日:2007-06-05

    申请号:US09709020

    申请日:2000-11-08

    CPC classification number: C12P19/42

    Abstract: The present invention is directed to compositions and methods related to the synthesis and modification of uridine-5′-diphospho-sulfoquinovose (UDP-SQ). In particular, the methods of the present invention comprise the utilization of recombinant enzymes from Arabidopsis thaliana, UDP-glucose, and a sulfur donor to synthesize UDP-SQ, and the subsequent modification of UDP-SQ to form compounds including, but not limited to, 6-sulfo-α-D-quinovosyl diaclyglycerol (SQDG) and alkyl sulfoquinovoside. The compositions and methods of the invention provide a more simple, rapid means of synthesizing UDP-SQ, and the subsequent modification of UDP-SQ to compounds including, but not limited to, SQDG.

    Abstract translation: 本发明涉及与尿苷-5'-二磷酸 - 磺基奎诺糖(UDP-SQ)的合成和修饰相关的组合物和方法。 特别地,本发明的方法包括利用来自拟南芥,UDP-葡萄糖和硫供体的重组酶合成UDP-SQ,以及后续的UDP-SQ修饰以形成化合物,包括但不限于 ,6-磺基-α-D-喹喔啉基二甘油(SQDG)和烷基磺基喹诺酮。 本发明的组合物和方法提供了一种更简单,快速的方法来合成UDP-SQ,以及随后将UDP-SQ修饰为化合物,包括但不限于SQDG。

    Narrow-body damascene tri-gate FinFET
    397.
    发明授权
    Narrow-body damascene tri-gate FinFET 有权
    窄体镶嵌三栅极FinFET

    公开(公告)号:US07186599B2

    公开(公告)日:2007-03-06

    申请号:US10754540

    申请日:2004-01-12

    CPC classification number: H01L29/785 H01L29/66545 H01L29/66795

    Abstract: A method of forming a fin field effect transistor includes forming a fin and forming a source region on a first end of the fin and a drain region on a second end of the fin. The method further includes forming a dummy gate with a first semi-conducting material in a first pattern over the fin and forming a dielectric layer around the dummy gate. The method also includes removing the first semi-conducting material to leave a trench in the dielectric layer corresponding to the first pattern, thinning a portion of the fin exposed within the trench, and forming a metal gate within the trench.

    Abstract translation: 形成鳍状场效应晶体管的方法包括:在鳍片的第一端上形成翅片并形成源极区域,在鳍片的第二端部形成漏极区域。 该方法还包括在鳍上形成具有第一图案的第一半导体材料的虚拟栅极,并在虚拟栅极周围形成介电层。 该方法还包括去除第一半导体材料以在对应于第一图案的电介质层中留下沟槽,使在沟槽内暴露的鳍片的一部分变薄,并在沟槽内形成金属栅极。

    Germanium MOSFET devices and methods for making same
    398.
    发明授权
    Germanium MOSFET devices and methods for making same 有权
    锗MOSFET器件及其制造方法

    公开(公告)号:US07148526B1

    公开(公告)日:2006-12-12

    申请号:US10348758

    申请日:2003-01-23

    Abstract: A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.

    Abstract translation: 双栅极锗金属氧化物半导体场效应晶体管(MOSFET)包括锗翅片,邻近锗翅片的第一侧形成的第一栅极和与第一侧相对的锗翅片第二侧附近形成的第二栅极 。 三栅极MOSFET包括锗翅片,与锗翅片的第一侧相邻形成的第一栅极,与第一侧相对的锗翅片的第二侧附近形成的第二栅极和形成在锗翅片顶部上的顶栅极 。 全栅极MOSFET包括锗翅片,邻近锗翅片的第一侧形成的第一侧壁栅极结构,邻近锗翅片的第二侧形成的第二侧壁栅极结构,以及形成在锗翅片上和周围的附近的栅极结构 锗鳍

    Planarizing sacrificial oxide to improve gate critical dimension in semiconductor devices
    399.
    发明授权
    Planarizing sacrificial oxide to improve gate critical dimension in semiconductor devices 有权
    平面化牺牲氧化物以改善半导体器件中的栅极临界尺寸

    公开(公告)号:US07091068B1

    公开(公告)日:2006-08-15

    申请号:US10310776

    申请日:2002-12-06

    CPC classification number: H01L29/785 H01L29/66795

    Abstract: A method of manufacturing a semiconductor device may include forming a fin structure on an insulator and depositing a gate material over the fin structure. The method may also include forming a sacrificial material over the gate material and planarizing the sacrificial material. An antireflective coating may be deposited on the planarized sacrificial material. A gate structure may then be formed by etching the gate material.

    Abstract translation: 制造半导体器件的方法可以包括在绝缘体上形成翅片结构,并在栅极结构上沉积栅极材料。 该方法还可以包括在栅极材料上形成牺牲材料并平坦化牺牲材料。 可以在平坦化的牺牲材料上沉积抗反射涂层。 然后可以通过蚀刻栅极材料形成栅极结构。

    Narrow body raised source/drain metal gate MOSFET
    400.
    发明授权
    Narrow body raised source/drain metal gate MOSFET 有权
    窄体凸起源极/漏极金属栅极MOSFET

    公开(公告)号:US07034361B1

    公开(公告)日:2006-04-25

    申请号:US10653234

    申请日:2003-09-03

    Abstract: A semiconductor device includes a fin, a source region formed adjacent the fin and having a height greater than that of the fin, and a drain region formed adjacent the a second side of the fin and having a height greater than that of the fin. A metal gate region is formed at a top surface and at least one side surface of the fin. A width of the source and drain region may be greater than that of the fin. The semiconductor device may exhibit a reduced series resistance and an improved transistor drive current.

    Abstract translation: 半导体器件包括鳍状物,邻近翅片形成的源极区域,其高度大于鳍状物的高度;以及漏极区域,其形成在翅片的第二侧附近并且具有高于翅片的高度。 金属栅极区域形成在翅片的顶表面和至少一个侧表面处。 源极和漏极区域的宽度可以大于鳍片的宽度。 半导体器件可以呈现减小的串联电阻和改进的晶体管驱动电流。

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