公开(公告)号：US20250080984A1

公开(公告)日：2025-03-06

申请号：US18720873

申请日：2022-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Rajavelsamy RAJADURAI ,  Rohini RAJENDRAN ,  Vinay Kumar SHRIVASTAVA ,  Varini GUPTA ,  Nivedya Parambath SASI

IPC: H04W12/12 ,  H04W76/40

Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Method and system for supporting protection of MBS traffic in wireless network. Embodiments herein disclose a method and a system for supporting protection of Multi-cast Broadcast Service (MBS) traffic in a wireless network. The method includes receiving security information in a MBS announcement by user equipment (UE) (100). The method includes determining if MBS traffic protection is applied or not over the service layer; determining whether security capability of the MBS supports handling of the MBS traffic protected at the service layer, when the MBS traffic protection is applied over the service layer; joining a MBS session by sending a Non-access stratum (NAS) request message to a session management function (SMF) device (200), and requesting for the 5GC individual traffic delivery method by including an indication in the NAS request message, if the security capability of the MBS does not support handling of the MBS traffic protected at the service layer; and receiving the MBS traffic via 5GC individual traffic delivery method.

公开(公告)号：US20250080798A1

公开(公告)日：2025-03-06

申请号：US18932163

申请日：2024-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Namhyun KIM ,  Gaeun Kim ,  Kyungwoo Kim ,  Kyumin Kim ,  Bora Park ,  Kangsik Yoon ,  Duhe Jang

IPC: H04N21/4402 ,  H04N21/426 ,  H04N21/434

Abstract: A transmission device includes a communication interface configured to perform communications with an external device and at least one display device, a memory configured to store analog data received from the external device, a signal processor, and a processor configured to control the signal processor to decode the analog data, separate the decoded analog data into analog audio data, analog video data, and analog additional data, convert the analog audio data, the analog video data, and the analog additional data, separated from one another, respectively, to digital audio data, digital video data, and digital additional data, configure a digital transport stream including a plurality of packets by separately packetizing the digital audio data, the digital video data, and the digital additional data, respectively, and transmit, using the communication interface, the digital transport stream to the at least one display device.

公开(公告)号：US20250080142A1

公开(公告)日：2025-03-06

申请号：US18676949

申请日：2024-05-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HEESOO KIM ,  SANGYUN LEE ,  JEONGYEOL BAE ,  JIYOUNG LEE ,  SANGMIN YOO ,  JONGSOO LEE

IPC: H04B1/00 ,  H04B1/04 ,  H04B1/10 ,  H04B1/525

Abstract: An RF circuit including: first and second ports receiving first and second RF signals; a (1-1)-th amplification stage and a (1-2)-th amplification stage connected to the first port and a first ground to amplify the first RF signal; a (2-1)-th amplification stage and a (2-2)-th amplification stage connected to the second port and a second ground to amplify the second RF signal; a (1-1)-th switch connected to the (1-1)-th amplification stage and the second ground, and a (1-2)-th switch connected to the (1-2)-th amplification stage and the second ground; a (2-1)-th switch connected to the (2-1)-th amplification stage and the first ground, and a (2-2)-th switch connected to the (2-2)-th amplification stage and the first ground; and a mixer to mix the first RF signal or the second RF signal with an LO signal, and mix the first RF signal or the second RF signal with the LO signal.

公开(公告)号：US20250080135A1

公开(公告)日：2025-03-06

申请号：US18953753

申请日：2024-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu SEOL ,  Jiyoup KIM ,  Hyejeong SO ,  Myoungbo KWAK ,  Pilsang YOON ,  Sucheol LEE ,  Youngdon CHOI ,  Junghwan CHOI

IPC: H03M7/14 ,  G06F13/16 ,  G06F13/40 ,  H03M13/00 ,  H03M13/29 ,  H03M13/45

Abstract: Encoding and decoding apparatuses and methods for implementing multi-mode coding are provided. The apparatus includes a transmitter and a receiver connected to a data bus. When data bursts are converted by the transmitter into codewords each including a plurality of symbols and/or a codeword received by the receiver is recovered as data bursts, maximum transition avoidance (MTA) codeword mappings in which no maximum transition (MT) event occurs between the plurality of symbols and minimum DC current (MDC) codeword mappings related to minimum power consumption of the plurality of symbols are used.

公开(公告)号：US20250079421A1

公开(公告)日：2025-03-06

申请号：US18757626

申请日：2024-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihyun Lim ,  Yoonyoung Jeon

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/498

Abstract: Provided is a semiconductor package including a first wiring structure, a second wiring structure disposed on the first wiring structure, an expanded layer electrically connecting the first wiring structure and the second wiring structure to each other, and including an expanded base layer and a plurality of via structures, a semiconductor chip disposed in the expanded layer and between the first wiring structure and the second wiring structure, and a buried capacitor structure including a plurality first through-holes spaced apart from each other that penetrate the expanded base layer adjacent to the semiconductor chip, and extend in a first horizontal direction along a side surface of the semiconductor chip, and a plurality of electrode layers disposed on sidewalls of the plurality of first through-holes.

公开(公告)号：US20250079393A1

公开(公告)日：2025-03-06

申请号：US18748354

申请日：2024-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Cheon PARK ,  Un-Byoung KANG ,  Ku Young KIM ,  Jun Woo MYUNG ,  Seung-Jin LEE ,  Ji-Seok HONG

IPC: H01L23/00 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes: a first semiconductor chip including a first substrate and a first through electrode passing through the first substrate, wherein the first substrate has a first active surface and a first non-active surface; a chip structure including a plurality of second semiconductor chips stacked on the first semiconductor chip, wherein each second semiconductor chip includes a second substrate and a second through electrode passing through the second substrate; and a third semiconductor chip disposed on the chip structure, and including a third substrate, wherein the first substrate has a first width and a first thickness, wherein the second substrate has a second width and a second thickness, and the third substrate has a third width and a third thickness, wherein the third thickness is thicker than the second thickness, and the third width is greater than the second width.

公开(公告)号：US20250079382A1

公开(公告)日：2025-03-06

申请号：US18807488

申请日：2024-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeean Lee ,  Dongwon Kang ,  Dahee Kim ,  Changyeon Song ,  Sunguk Lee

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538

Abstract: Provided is a semiconductor package including a lower package substrate including lower insulating layers, a first semiconductor device mounted on the lower package substrate, a core layer on the lower package substrate to be laterally spaced apart from the first semiconductor device, an encapsulation material surrounding the first semiconductor device and covering an upper portion of the core layer, an upper package substrate disposed on the encapsulation material, the upper package substrate including a first upper redistribution layer and a second upper redistribution layer; wherein a first line width and a first line spacing of a first fine pattern of the first upper redistribution pattern are greater than or equal to a corresponding second line width and a corresponding second line spacing of a second fine pattern of the second upper redistribution pattern, respectively.

公开(公告)号：US20250079310A1

公开(公告)日：2025-03-06

申请号：US18806236

申请日：2024-08-15

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Hoyoung TANG ,  Taehyung KIM

IPC: H01L23/528 ,  H01L27/088 ,  H01L29/06 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

Abstract: An integrated circuit includes: a backside wiring layer on a back side of a substrate, the backside wiring layer including a first backside pattern and a second backside pattern isolated from each other; and a power gating switch on a front side of the substrate, the power gating switch connected to the first and second backside patterns. The power gating switch includes: a first source/drain region connected to the first backside pattern, and configured to receive a first supply voltage from the first backside pattern; a gate line structure configured to receive a power gating signal; and a second source/drain region connected to the second backside pattern, and configured to receive a power signal from the first source/drain region based on the power gating signal.

公开(公告)号：US20250079211A1

公开(公告)日：2025-03-06

申请号：US18653168

申请日：2024-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sewoong Lee ,  Jaeho Jang ,  Yohwan Joo ,  Jinkyou Choi

IPC: H01L21/67 ,  G06N3/045

Abstract: An anomaly detection method includes receiving data regarding semiconductor process variables, generating an anomaly detection model through a convolution algorithm and a transformer algorithm, classifying the data by using the generated anomaly detection model, and detecting, based upon the classified data, an anomaly associated with the semiconductor process variables.

公开(公告)号：US20250079016A1

公开(公告)日：2025-03-06

申请号：US18814096

申请日：2024-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Korosh VATANPARVAR ,  Jeremy Speth ,  Nafiul Rashid ,  Li Zhu ,  Migyeong Gwak ,  Jilong Kuang ,  Jun Gao

IPC: G16H50/30 ,  G06V10/25 ,  G06V10/32 ,  G06V10/82 ,  G06V40/16 ,  G16H50/20

Abstract: A method performed by at least one processor includes obtaining an image of a subject; preprocessing the image of the subject; inputting the preprocessed image into a machine learning model trained in accordance with a first frequency distribution corresponding to a first ground truth obtained from one or more sensors performing a vital measurement on one or more test subjects; and obtaining, from the machine learning model, an estimate of a signal corresponding to the vital measurement of the subject.